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TQ-3P-SOM-TQMA62XX
TQ-Group TQMa62xx system on modules for AM623 and AM625 Arm Cortex-A53 1.4-GHz processors
TQ-3P-SOM-TQMA62XX
概覽
The embedded module TQMa62xx, is based on the processor family AM623 and AM625 processor family. This module is designed to use the pin-compatible processors on one module design. This module is ideal for applications that require advanced computing power and scalable graphics performance. The AM62x family is introduced as the successor to the AM335x family of general purpose processors.
This MPU family offers performance enhancements in graphics, computing power and a variety of industrial interfaces. The modules make peripherals, including 2x TSN-capable Gb Ethernet switches, USB 2.0, CAN-FD, UART, LVDS, Parallel RGB, and CSI, available for the designer without complex power and high-speed data routing such as DDR.
特點
- 38 mm x 55 mm HDI module, 38 mm x 38 mm LGA module
- 320-pins, 0.5mm (HDI), 366-pin ball array (LGA)
- 2-GB LPDDR4 with ECC, 64-GB eMMC, 256-MB NOR Flash
- 2x Gb Ethernet switch (TSN), 3x CAN-FD, 2x USB 2.0
- LVDS + Parallel RGB dual-display
- Low power consumption (typ. 2W), integrated security functions
訂購並開始開發
開發套件
STKa62xx — Evaluation and development kit for TQMa62xx
STKa62xx — Evaluation and development kit for TQMa62xx
開發套件
STKa62xxL — Evaluation and development kit for TQMa62xxL
STKa62xxL — Evaluation and development kit for TQMa62xxL
開發板
TQMA62XX — System on module with high density interconnects (HDI), based on AM623 and AM625 processors
TQMA62XX — System on module with high density interconnects (HDI), based on AM623 and AM625 processors
開發板
TQMA62XXL — System on module in land-grid array (LGA) solder-down form factor, based on AM623 and AM625 processors
TQMA62XXL — System on module in land-grid array (LGA) solder-down form factor, based on AM623 and AM625 processors
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