TIDA-00339
IO-Link 感測器發送器 Booster Pack
TIDA-00339
概覽
This reference design offers a rapid prototyping platform for IO-Link sensor transmitters. Due to its design, it can be connected to TI LaunchPad / BoosterPack ecosystem on which the fully-validated IO-Link stack is implemented. The design has easy access to all interface and status signals. The different optional settings make this design flexible to adjust for several use cases. With the ability to connect sensor front-ends, the design can be used either as an evaluation platform of the IO-Link interface or as an entire sensor transmitter system. With the industry standard M12 connector, it can be connected to an IO-Link master system.
See more information on TMG.
特點
- IO-Link v1.1 and v1.0 connectivity out-of-the-box (TMG stack, PHY and M12 connector)
- Simple interfacing of sensors
- Designed to meet:
- IEC 61000-4-2
- IEC 61000-4-4
- IEC 61000-4-5
- IEC 60255-5
已開發完全組裝的電路板，僅供測試與性能驗證，且為非賣品。
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| 類型 | 標題 | 下載最新的英文版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 設計指南 | IO-Link PHY BoosterPack (Rev. B) | 2016/3/29 |