HZHYT-3P-HZ-CORE-AM62X

HZHYTECH HZ-CORE-AM62x system on module for AM623 and AM625 Arm Cortex-A53 1.4-GHz processors

HZHYT-3P-HZ-CORE-AM62X

從: HZHYTECH
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概覽

The HZ-CORE-AM62X system on module (SOM) is a solder-down "stamp" PCB from HZHYTECH based on AM623 and AM625 processors.

The SOM has low power consumption, low cost and optimal integration, making it widely usable in a variety of applications from high-precision medical measuring instruments, data acquisition processing systems, handheld devices, communication systems, industrial control, and video surveillance and other application fields.

The SOM solder-down form factor features lead-free immersion gold and 10-layer printed board technology to ensure signal integrity and good EMC characteristics. There are 224 pins in total, including 128 half-hole (castellated edge) immersed gold pins and 96 surface-mount pads to expand all interface functions, which is convenient for secondary development and use in production, allowing the user to flexibly configure the functions required by the application.

The TPS6521901RHBR integrated multi-channel power management IC is used to reduce overall system power consumption.

特點
  • 45 mm x 45 mm
  • Solder-down, 128 edge pins, 96 inner-ring pads (224 pins total)
  • 2-GB DDR4, 8-GB eMMC
  • CAN-FD, SPI, RGMII, and PRU/GPMC industrial interfaces available
  • Linux Yocto, Linux-RT, Android (A53); FreeRTOS (M4)
多媒體與工業網路 SoC
AM623 具有 Arm® Cortex®-A53 型物體與手勢辨識功能的物聯網 (IoT) 與閘道 SoC AM625 配備 Arm® Cortex®-A53 型邊緣 AI 與 Full-HD 雙顯示器的人機互動 SoC
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開發板

HZ-CORE-AM62X — HZ-CORE-AM62X core board system on module based on AM623 and AM625 processors

支援產品和硬體

HZ-CORE-AM62X HZ-CORE-AM62X core board system on module based on AM623 and AM625 processors

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開發套件

HZ-KIT-AM62X — Development kit for HZ-CORE-AM62X

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HZ-KIT-AM62X Development kit for HZ-CORE-AM62X

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