多接入边缘计算 (MEC)
产品和参考设计
多接入边缘计算 (MEC)
概述
Our integrated circuits and reference designs help you quickly create multi-access edge computing (MEC) designs with higher energy efficiency, density and fast data computing. Our power management and signal chain ICs support the need to improve 5G network latency performance as well as emerging technologies like artificial intelligence and machine learning.
设计要求
MEC systems require:
- High DC/DC power conversion and protection.
- Increased density to meet standard rack and open compute project (OCP) rack size requirements.
- High-bandwidth data throughputs requiring leading-edge signal processing.
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