质量、可靠性和封装数据下载

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Rating

Catalog

RoHS	Yes

RoHS	Yes

RoHS	Yes

RoHS	Yes

RoHS	Yes

REACH	Yes

REACH	Yes

REACH	Yes

REACH	Yes

REACH	Yes

器件标识	LC08A

铅涂层/焊球材料	Sn

铅涂层/焊球材料	Sn

铅涂层/焊球材料	NiPdAu

铅涂层/焊球材料	Sn

铅涂层/焊球材料	Sn

MSL 等级/回流焊峰	Level-1-260C-UNLIM

MSL 等级/回流焊峰	Level-1-260C-UNLIM

MSL 等级/回流焊峰	Level-1-260C-UNLIM

MSL 等级/回流焊峰	Level-1-260C-UNLIM

MSL 等级/回流焊峰	Level-1-260C-UNLIM

MTBF/FIT 估算

MTBF/FIT		MTBF/FIT 支持数据
MTBF	FIT	使用温度 (°C)	置信度 (%)	激活能量 (eV)	测试温度 (°C)	测试持续时间（小时）	样本大小	故障次数	更多建议
1x10¹⁰	0.1	55	60	0.7	125	1000	183306	0	—

材料成分

				成分含量		均质物质含量
均质物质	成分	CAS 编号	质量 (mg)	百分比 %	ppm	百分比 %	ppm
Bond Wire
Copper and Its Alloys	Copper	7440-50-8	0.029707	95.156796	951568	0.045891	459
Precious Metals	Gold	7440-57-5	0.000232	0.743137	7431	0.000358	4
Precious Metals	Palladium	7440-05-3	0.00128	4.100067	41001	0.001977	20
Sub-total	—	—	0.031219	100	1000000	0.048226	482
Die Attach Adhesive
Precious Metals	Silver	7440-22-4	0.044175	79.999638	799996	0.068241	682
Thermoplastics	Epoxy	85954-11-6	0.011044	20.000362	200004	0.017061	171
Sub-total	—	—	0.055219	100	1000000	0.085301	853
Lead Frame
Copper and Its Alloys	Copper	7440-50-8	16.683485	97.427499	974275	25.772316	257723
Copper and Its Alloys	Iron	7439-89-6	0.402414	2.350000	23500	0.621641	6216
Copper and Its Alloys	Phosphorus	7723-14-0	0.014127	0.082498	825	0.021823	218
Other Nonferrous Metals and Alloys	Lead	7439-92-1	0.002569	0.015002	150	0.003969	40
Zinc and Its Alloys	Zinc	7440-66-6	0.021405	0.125000	1250	0.033066	331
Sub-total	—	—	17.124000	100	1000000	26.452815	264528
Lead Frame Plating
Other Nonferrous Metals and Alloys	Tin	7440-31-5	1.1893	100.000000	1000000	1.837207	18372
Sub-total	—	—	1.1893	100	1000000	1.837207	18372
Mold Compound
Other Inorganic Materials	Fused Silica	60676-86-0	40.006064	86.600000	866000	61.800572	618006
Other Organic Materials	Carbon Black	1333-86-4	0.069295	0.150001	1500	0.107046	1070
Thermoplastics	Epoxy	85954-11-6	6.12102	13.250000	132500	9.455630	94556
Sub-total	—	—	46.196379	100	1000000	71.363248	713632
Semiconductor Device
Ceramics / Glass	Doped Silicon	7440-21-3	0.138015	100.000000	1000000	0.213203	2132
Sub-total	—	—	0.138015	100	1000000	0.213203	2132
Total	—	—	64.734132	—	—	100	1000000

				成分含量		均质物质含量
均质物质	成分	CAS 编号	质量 (mg)	百分比 %	ppm	百分比 %	ppm
Bond Wire
Copper and Its Alloys	Copper	7440-50-8	0.075857	97.589121	975891	0.107326	1073
Not Categorized	Proprietary Materials	—	0.000007	0.009005	90	0.000010	0
Precious Metals	Palladium	7440-05-3	0.001865	2.399300	23993	0.002639	26
Precious Metals	Silver	7440-22-4	0.000002	0.002573	26	0.000003	0
Sub-total	—	—	0.077731	100	1000000	0.109978	1100
Die Attach Adhesive
Precious Metals	Silver	7440-22-4	0.118869	82.000110	820001	0.168182	1682
Thermoplastics	Epoxy	85954-11-6	0.026093	17.999890	179999	0.036918	369
Sub-total	—	—	0.144962	100	1000000	0.205099	2051
Lead Frame
Copper and Its Alloys	Copper	7440-50-8	21.1232	94.210500	942105	29.886120	298861
Copper and Its Alloys	Iron	7439-89-6	0.0112	0.049953	500	0.015846	158
Copper and Its Alloys	Phosphorus	7723-14-0	0.0056	0.024976	250	0.007923	79
Magnesium and Its Alloys	Magnesium	7439-95-4	0.0112	0.049953	500	0.015846	158
Nickel and Its Alloys	Nickel	7440-02-0	0.5376	2.397722	23977	0.760622	7606
Other Inorganic Materials	Silicon	7440-21-3	0.1568	0.699336	6993	0.221848	2218
Other Nonferrous Metals and Alloys	Lead	7439-92-1	0.00224	0.009991	100	0.003169	32
Other Nonferrous Metals and Alloys	Manganese	7439-96-5	0.00224	0.009991	100	0.003169	32
Precious Metals	Silver	7440-22-4	0.5712	2.547580	25476	0.808161	8082
Sub-total	—	—	22.42128	100	1000000	31.722707	317227
Lead Frame Plating
Other Nonferrous Metals and Alloys	Tin	7440-31-5	0.6	100.000000	1000000	0.848909	8489
Sub-total	—	—	0.6	100	1000000	0.848909	8489
Mold Compound
Other Inorganic Materials	Fused Silica	60676-86-0	39.798665	84.850000	848500	56.309068	563091
Other Organic Materials	Carbon Black	1333-86-4	0.070357	0.150000	1500	0.099544	995
Thermoplastics	Epoxy	85954-11-6	7.03571	15.000000	150000	9.954461	99545
Sub-total	—	—	46.904732	100	1000000	66.363073	663631
Semiconductor Device
Ceramics / Glass	Doped Silicon	7440-21-3	0.530258	100.000000	1000000	0.750235	7502
Sub-total	—	—	0.530258	100	1000000	0.750235	7502
Total	—	—	70.678963	—	—	100	1000000

				成分含量		均质物质含量
均质物质	成分	CAS 编号	质量 (mg)	百分比 %	ppm	百分比 %	ppm
Bond Wire
Copper and Its Alloys	Copper	7440-50-8	0.064655	99.990721	999907	0.086563	866
Not Categorized	Proprietary Materials	—	0.000005	0.007733	77	0.000007	0
Precious Metals	Silver	7440-22-4	0.000001	0.001547	15	0.000001	0
Sub-total	—	—	0.064661	100	1000000	0.086571	866
Die Attach Adhesive
Precious Metals	Silver	7440-22-4	0.129613	80.000123	800001	0.173532	1735
Thermoplastics	Epoxy	85954-11-6	0.032403	19.999877	199999	0.043383	434
Sub-total	—	—	0.162016	100	1000000	0.216915	2169
Lead Frame
Copper and Its Alloys	Copper	7440-50-8	28.619871	97.346500	973465	38.317684	383177
Copper and Its Alloys	Iron	7439-89-6	0.717654	2.441000	24410	0.960830	9608
Copper and Its Alloys	Phosphorus	7723-14-0	0.024255	0.082500	825	0.032474	325
Zinc and Its Alloys	Zinc	7440-66-6	0.03822	0.130000	1300	0.051171	512
Sub-total	—	—	29.400000	100	1000000	39.362159	393622
Lead Frame Plating
Nickel and Its Alloys	Nickel	7440-02-0	0.097022	95.119608	951196	0.129898	1299
Precious Metals	Gold	7440-57-5	0.000796	0.780392	7804	0.001066	11
Precious Metals	Palladium	7440-05-3	0.004182	4.100000	41000	0.005599	56
Sub-total	—	—	0.102000	100	1000000	0.136563	1366
Mold Compound
Other Inorganic Materials	Silica	7631-86-9	37.767277	85.000001	850000	50.564679	505647
Other Organic Materials	Carbon Black	1333-86-4	0.22216	0.499999	5000	0.297439	2974
Thermoplastics	Epoxy	85954-11-6	6.442653	14.500000	145000	8.625739	86257
Sub-total	—	—	44.432090	100	1000000	59.487857	594879
Semiconductor Device
Ceramics / Glass	Doped Silicon	7440-21-3	0.530258	100.000000	1000000	0.709935	7099
Sub-total	—	—	0.530258	100	1000000	0.709935	7099
Total	—	—	74.691025	—	—	100	1000000

				成分含量		均质物质含量
均质物质	成分	CAS 编号	质量 (mg)	百分比 %	ppm	百分比 %	ppm
Bond Wire
Copper and Its Alloys	Copper	7440-50-8	0.066802	97.535407	975354	0.087151	872
Not Categorized	Proprietary Materials	—	0.000008	0.011681	117	0.000010	0
Precious Metals	Gold	7440-57-5	0.000035	0.051102	511	0.000046	0
Precious Metals	Palladium	7440-05-3	0.001643	2.398890	23989	0.002143	21
Precious Metals	Silver	7440-22-4	0.000002	0.002920	29	0.000003	0
Sub-total	—	—	0.068490	100	1000000	0.089353	894
Die Attach Adhesive
Precious Metals	Silver	7440-22-4	0.034343	74.999454	749995	0.044804	448
Thermoplastics	Epoxy	85954-11-6	0.011448	25.000546	250005	0.014935	149
Sub-total	—	—	0.045791	100	1000000	0.059739	597
Lead Frame
Copper and Its Alloys	Copper	7440-50-8	29.052905	97.702798	977028	37.902748	379027
Copper and Its Alloys	Iron	7439-89-6	0.661626	2.225000	22250	0.863165	8632
Copper and Its Alloys	Phosphorus	7723-14-0	0.001963	0.006601	66	0.002561	26
Zinc and Its Alloys	Zinc	7440-66-6	0.019507	0.065601	656	0.025449	254
Sub-total	—	—	29.736001	100	1000000	38.793923	387939
Lead Frame Plating
Other Nonferrous Metals and Alloys	Tin	7440-31-5	0.699	100.000000	1000000	0.911923	9119
Sub-total	—	—	0.699	100	1000000	0.911923	9119
Mold Compound
Not Categorized	Phenolic Resin	9003-35-4	1.379481	3.000000	30000	1.799687	17997
Other Inorganic Materials	Silica	7631-86-9	37.475906	81.500000	815000	48.891491	488915
Other Organic Materials	Carbon Black	1333-86-4	0.229914	0.500001	5000	0.299948	2999
Other Plastics and Rubber	Silicone	218163-11-2	3.448703	7.500000	75000	4.499217	44992
Thermoplastics	Epoxy	85954-11-6	3.448703	7.500000	75000	4.499217	44992
Sub-total	—	—	45.982707	100	1000000	59.989559	599896
Semiconductor Device
Ceramics / Glass	Doped Silicon	7440-21-3	0.119194	100.000000	1000000	0.155502	1555
Sub-total	—	—	0.119194	100	1000000	0.155502	1555
Total	—	—	76.651183	—	—	100	1000000

				成分含量		均质物质含量
均质物质	成分	CAS 编号	质量 (mg)	百分比 %	ppm	百分比 %	ppm
Bond Wire
Copper and Its Alloys	Copper	7440-50-8	0.060588	94.964029	949640	0.079042	790
Copper and Its Alloys	Iron	7439-89-6	0.000001	0.001567	16	0.000001	0
Not Categorized	Proprietary Materials	—	0.000007	0.010972	110	0.000009	0
Precious Metals	Gold	7440-57-5	0.000677	1.061112	10611	0.000883	9
Precious Metals	Palladium	7440-05-3	0.002527	3.960753	39608	0.003297	33
Precious Metals	Silver	7440-22-4	0.000001	0.001567	16	0.000001	0
Sub-total	—	—	0.063801	100	1000000	0.083233	832
Die Attach Adhesive
Precious Metals	Silver	7440-22-4	0.034343	74.999454	749995	0.044803	448
Thermoplastics	Epoxy	85954-11-6	0.011448	25.000546	250005	0.014935	149
Sub-total	—	—	0.045791	100	1000000	0.059738	597
Lead Frame
Copper and Its Alloys	Copper	7440-50-8	29.052905	97.702798	977028	37.901706	379017
Copper and Its Alloys	Iron	7439-89-6	0.661626	2.225000	22250	0.863141	8631
Copper and Its Alloys	Phosphorus	7723-14-0	0.001963	0.006601	66	0.002561	26
Zinc and Its Alloys	Zinc	7440-66-6	0.019507	0.065601	656	0.025448	254
Sub-total	—	—	29.736001	100	1000000	38.792856	387929
Lead Frame Plating
Other Nonferrous Metals and Alloys	Tin	7440-31-5	0.699	100.000000	1000000	0.911898	9119
Sub-total	—	—	0.699	100	1000000	0.911898	9119
Mold Compound
Not Categorized	Phenolic Resin	9003-35-4	1.378242	3.000001	30000	1.798021	17980
Other Inorganic Materials	Silica	7631-86-9	37.442231	81.500000	815000	48.846214	488462
Other Organic Materials	Carbon Black	1333-86-4	0.229707	0.500000	5000	0.299670	2997
Other Plastics and Rubber	Silicone	218163-11-2	3.445604	7.500000	75000	4.495050	44951
Thermoplastics	Epoxy	85954-11-6	3.445604	7.500000	75000	4.495050	44951
Sub-total	—	—	45.941388	100	1000000	59.934005	599340
Semiconductor Device
Ceramics / Glass	Doped Silicon	7440-21-3	0.167311	100.000000	1000000	0.218270	2183
Sub-total	—	—	0.167311	100	1000000	0.218270	2183
Total	—	—	76.653292	—	—	100	1000000

认证摘要

应力	基准	最小批量	SS/批次	测试名称/条件	有效期	结果	笔记
HTOL	JESD22-A108	3	77	Life test, 125C	1000 hours	Pass	Or equivalent JEDEC condition
HTSL	JESD22-A103	3	25	High temp storage bake, 150C	1000 hours	Pass	Or equivalent JEDEC condition
AC/UHAST	JESD22-A102/JESD22-A118	3	25	Unbiased HAST 130C / 85% RH	96 hours	Pass	Or equivalent JEDEC condition
THB/HAST	JESD22-A101/JESD22-A110	3	25	HAST 130C/85%RH	96 hours	Pass	Or equivalent JEDEC condition
TC	JESD22-A104	3	25	Temperature cycle -65/150C	500 cycles	Pass	Or equivalent JEDEC condition
SD	J-STD-002	3	22	Per specification	>95% lead coverage	Pass	—
HBM	JS-001	1	3	ESD - HBM	Classification	See data sheet	—
CDM	JS-002	1	3	ESD - CDM	Classification	See data sheet	—
LU	JESD78	1	3	Latch-up	Per JESD78	Pass	As applicable per JESD78
MSL	J-STD-020	—	—	Per J-STD-020	Classification	See data sheet	—

持续可靠性监测

芯片制造工艺流程可靠性数据。

制造工艺	可靠性测试	滚动式的年度（2025 年第 4 季度 - 2026 年第 3 季度）样本大小	累计样本大小	结论
Power BICMOS	High temperature gate bias 150C, 1000 Hours or Equivalent JEDEC Condition	924	924	Pass
Power BICMOS	High temperature reverse bias 125C, 1000 Hours or Equivalent JEDEC Condition	1386	1386	Pass
Power BICMOS	Life test 125C, 1000 Hours or Equivalent JEDEC Condition	28135	456997	Pass

装配工艺可靠性数据。

封装系列	可靠性测试	滚动式的年度（2025 年第 4 季度 - 2026 年第 3 季度）样本大小	累计样本大小	结论
TSSOP	Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition	2387	48571	Pass
TSSOP	High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition	2187	38315	Pass
TSSOP	Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition	5852	105076	Pass
TSSOP	Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition	4389	85185	Pass

质量、可靠性和封装数据下载

SN74LVC08APWR 正在供货

Rating

MTBF/FIT 估算

材料成分

认证摘要

持续可靠性监测

芯片制造工艺流程可靠性数据。

装配工艺可靠性数据。

其他资源

通用质量指南

认证

冲突矿产专用披露报告

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数据类型定义

RoHS

REACH

器件标识

引脚镀层/焊球材料֙

MSL 等级/回流焊峰值温度

MTBF/FIT 估算

材料成分

认证摘要

持续可靠性监测