质量、可靠性和封装数据下载
SN74AUP1G00DBVR
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质量数据将根据组装地点而更改
Rating
| Catalog |
| RoHS | Yes |
|---|
| REACH | Yes |
|---|
| 器件标识 | H00R |
|---|
| 铅涂层/焊球材料 | NiPdAu |
|---|
| MSL 等级/回流焊峰 | Level-1-260C-UNLIM |
|---|
MTBF/FIT 估算
| MTBF/FIT | MTBF/FIT 支持数据 | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| MTBF | FIT | 使用温度 (°C) | 置信度 (%) | 激活能量 (eV) | 测试温度 (°C) | 测试持续时间（小时） | 样本大小 | 故障次数 | 更多建议 | |
| 2.21x109 | 0.5 | 55 | 60 | 0.7 | 125 | 1000 | 25789 | 0 | — | |
材料成分
| 成分含量 | 均质物质含量 | ||||||
|---|---|---|---|---|---|---|---|
| 均质物质 | 成分 | CAS 编号 | 质量 (mg) | 百分比 % | ppm | 百分比 % | ppm |
| Bond Wire | |||||||
|
Copper and Its Alloys
|
Copper
|
7440-50-8
|
0.014348
|
96.548012
|
965480
|
0.081655
|
817
|
|
Not Categorized
|
Proprietary Materials
|
— |
0.000002
|
0.013458
|
135
|
0.000011
|
0
|
|
Precious Metals
|
Gold
|
7440-57-5
|
0.000087
|
0.585425
|
5854
|
0.000495
|
5
|
|
Precious Metals
|
Palladium
|
7440-05-3
|
0.000424
|
2.853105
|
28531
|
0.002413
|
24
|
|
Sub-total
|
— | — |
0.014861
|
100
|
1000000
|
0.084574
|
846
|
| Die Attach Adhesive | |||||||
|
Precious Metals
|
Silver
|
7440-22-4
|
0.021206
|
74.999116
|
749991
|
0.120684
|
1207
|
|
Thermoplastics
|
Epoxy
|
85954-11-6
|
0.007069
|
25.000884
|
250009
|
0.040230
|
402
|
|
Sub-total
|
— | — |
0.028275
|
100
|
1000000
|
0.160914
|
1609
|
| Lead Frame | |||||||
|
Copper and Its Alloys
|
Copper
|
7440-50-8
|
5.32119
|
97.102007
|
971020
|
30.283058
|
302831
|
|
Copper and Its Alloys
|
Iron
|
7439-89-6
|
0.140288
|
2.560000
|
25600
|
0.798383
|
7984
|
|
Copper and Its Alloys
|
Phosphorus
|
7723-14-0
|
0.00811
|
0.147993
|
1480
|
0.046154
|
462
|
|
Other Nonferrous Metals and Alloys
|
Lead
|
7439-92-1
|
0.000548
|
0.010000
|
100
|
0.003119
|
31
|
|
Zinc and Its Alloys
|
Zinc
|
7440-66-6
|
0.009864
|
0.180000
|
1800
|
0.056136
|
561
|
|
Sub-total
|
— | — |
5.480000
|
100
|
1000000
|
31.186851
|
311869
|
| Lead Frame Plating | |||||||
|
Nickel and Its Alloys
|
Nickel
|
7440-02-0
|
0.009512
|
95.120000
|
951200
|
0.054133
|
541
|
|
Precious Metals
|
Gold
|
7440-57-5
|
0.000078
|
0.780000
|
7800
|
0.000444
|
4
|
|
Precious Metals
|
Palladium
|
7440-05-3
|
0.00041
|
4.100000
|
41000
|
0.002333
|
23
|
|
Sub-total
|
— | — |
0.010000
|
100
|
1000000
|
0.056910
|
569
|
| Mold Compound | |||||||
|
Other Inorganic Materials
|
Fused Silica
|
60676-86-0
|
10.549725
|
87.999999
|
880000
|
60.038814
|
600388
|
|
Other Organic Materials
|
Carbon Black
|
1333-86-4
|
0.035965
|
0.300000
|
3000
|
0.204678
|
2047
|
|
Other Organic Materials
|
Chlorine
|
7782-50-5
|
0.00012
|
0.001001
|
10
|
0.000683
|
7
|
|
Thermoplastics
|
Epoxy
|
85954-11-6
|
1.402514
|
11.699000
|
116990
|
7.981751
|
79818
|
|
Sub-total
|
— | — |
11.988324
|
100
|
1000000
|
68.225926
|
682259
|
| Semiconductor Device | |||||||
|
Ceramics / Glass
|
Doped Silicon
|
7440-21-3
|
0.050048
|
100.000000
|
1000000
|
0.284825
|
2848
|
|
Sub-total
|
— | — |
0.050048
|
100
|
1000000
|
0.284825
|
2848
|
|
Total
|
— | — |
17.571508
|
— | — |
100
|
1000000
|
认证摘要
| 应力 | 基准 | 最小批量 | SS/批次 | 测试名称/条件 | 有效期 | 结果 | 笔记 |
|---|---|---|---|---|---|---|---|
| HTOL | JESD22-A108 | 3 | 77 | Life test, 125C | 1000 hours | Pass | Or equivalent JEDEC condition |
| HTSL | JESD22-A103 | 3 | 25 | High temp storage bake, 150C | 1000 hours | Pass | Or equivalent JEDEC condition |
| AC/UHAST | JESD22-A102/JESD22-A118 | 3 | 25 | Unbiased HAST 130C / 85% RH | 96 hours | Pass | Or equivalent JEDEC condition |
| THB/HAST | JESD22-A101/JESD22-A110 | 3 | 25 | HAST 130C/85%RH | 96 hours | Pass | Or equivalent JEDEC condition |
| TC | JESD22-A104 | 3 | 25 | Temperature cycle -65/150C | 500 cycles | Pass | Or equivalent JEDEC condition |
| SD | J-STD-002 | 3 | 22 | Per specification | >95% lead coverage | Pass | — |
| HBM | JS-001 | 1 | 3 | ESD - HBM | Classification | See data sheet | — |
| CDM | JS-002 | 1 | 3 | ESD - CDM | Classification | See data sheet | — |
| LU | JESD78 | 1 | 3 | Latch-up | Per JESD78 | Pass | As applicable per JESD78 |
| MSL | J-STD-020 | — | — | Per J-STD-020 | Classification | See data sheet | — |
持续可靠性监测
芯片制造工艺流程可靠性数据。
| 制造工艺 | 可靠性测试 | 滚动式的年度（2024 年第 2 季度 - 2025 年第 1 季度）样本大小 | 累计样本大小 | 结论 |
|---|---|---|---|---|
| CMOS | Life test 125C, 1000 Hours or Equivalent JEDEC Condition | 425 | 53536 | Pass |
装配工艺可靠性数据。
| 封装系列 | 可靠性测试 | 滚动式的年度（2024 年第 2 季度 - 2025 年第 1 季度）样本大小 | 累计样本大小 | 结论 |
|---|---|---|---|---|
| SOP/SOT | Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition | 8786 | 108818 | Pass |
| SOP/SOT | High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition | 8330 | 85426 | Pass |
| SOP/SOT | Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition | 16243 | 199318 | Pass |
| SOP/SOT | Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition | 10703 | 163221 | Pass |
