质量、可靠性和封装数据下载

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Rating

Catalog

RoHS	Yes

RoHS	Yes

RoHS	Yes

REACH	Yes

REACH	Yes

REACH	Yes

器件标识	16U

铅涂层/焊球材料	NiPdAu

铅涂层/焊球材料	NiPdAu

铅涂层/焊球材料	NiPdAu

MSL 等级/回流焊峰	Level-1-260C-UNLIM

MSL 等级/回流焊峰	Level-1-260C-UNLIM

MSL 等级/回流焊峰	Level-1-260C-UNLIM

MTBF/FIT 估算

MTBF/FIT		MTBF/FIT 支持数据
MTBF	FIT	使用温度 (°C)	置信度 (%)	激活能量 (eV)	测试温度 (°C)	测试持续时间（小时）	样本大小	故障次数	更多建议
6.16x10⁹	0.2	55	60	0.7	125	1000	71906	0	—

材料成分

				成分含量		均质物质含量
均质物质	成分	CAS 编号	质量 (mg)	百分比 %	ppm	百分比 %	ppm
Bond Wire
Precious Metals	Gold	7440-57-5	0.029074	100.000000	1000000	1.226043	12260
Sub-total	—	—	0.029074	100	1000000	1.226043	12260
Die Attach Adhesive
Other Inorganic Materials	Aluminum Oxide	1344-28-1	0.021294	30.000423	300004	0.897963	8980
Other Inorganic Materials	Silica	7631-86-9	0.003194	4.499923	44999	0.134690	1347
Thermoplastics	Epoxy	85954-11-6	0.046491	65.499655	654997	1.960514	19605
Sub-total	—	—	0.070979	100	1000000	2.993167	29932
Lead Frame
Copper and Its Alloys	Copper	7440-50-8	0.5754	95.900000	959000	24.264475	242645
Magnesium and Its Alloys	Magnesium	7439-95-4	0.00105	0.175000	1750	0.044278	443
Nickel and Its Alloys	Nickel	7440-02-0	0.0192	3.200000	32000	0.809659	8097
Other Inorganic Materials	Silicon	7440-21-3	0.00435	0.725000	7250	0.183438	1834
Sub-total	—	—	0.60000	100	1000000	25.301851	253019
Lead Frame Plating
Nickel and Its Alloys	Nickel	7440-02-0	0.09512	95.120000	951200	4.011187	40112
Precious Metals	Gold	7440-57-5	0.00078	0.780000	7800	0.032892	329
Precious Metals	Palladium	7440-05-3	0.0041	4.100000	41000	0.172896	1729
Sub-total	—	—	0.10000	100	1000000	4.216975	42170
Mold Compound
Other Inorganic Materials	Fused Silica	60676-86-0	1.161765	90.499946	904999	48.991342	489913
Other Organic Materials	Carbon Black	1333-86-4	0.006419	0.500032	5000	0.270688	2707
Thermoplastics	Epoxy	85954-11-6	0.115535	9.000023	90000	4.872082	48721
Sub-total	—	—	1.283719	100	1000000	54.134112	541341
Semiconductor Device
Ceramics / Glass	Doped Silicon	7440-21-3	0.287596	100.000000	1000000	12.127852	121279
Sub-total	—	—	0.287596	100	1000000	12.127852	121279
Total	—	—	2.371368	—	—	100	1000000

				成分含量		均质物质含量
均质物质	成分	CAS 编号	质量 (mg)	百分比 %	ppm	百分比 %	ppm
Bond Wire
Precious Metals	Gold	7440-57-5	0.018025	99.994452	999945	0.588670	5887
Precious Metals	Palladium	7440-05-3	0.000001	0.005548	55	0.000033	0
Sub-total	—	—	0.018026	100	1000000	0.588703	5887
Die Attach Adhesive
Other Inorganic Materials	Inorganic Filler	—	0.000681	1.000544	10005	0.022240	222
Other Inorganic Materials	Silica	7631-86-9	0.009529	14.000264	140003	0.311203	3112
Thermoplastics	Epoxy	85954-11-6	0.057853	84.999192	849992	1.889393	18894
Sub-total	—	—	0.068063	100	1000000	2.222837	22228
Lead Frame
Copper and Its Alloys	Copper	7440-50-8	1.27757	97.449964	974500	41.723547	417235
Copper and Its Alloys	Iron	7439-89-6	0.030153	2.299998	23000	0.984752	9848
Copper and Its Alloys	Phosphorus	7723-14-0	0.001311	0.100000	1000	0.042815	428
Zinc and Its Alloys	Zinc	7440-66-6	0.001967	0.150038	1500	0.064239	642
Sub-total	—	—	1.311001	100	1000000	42.815354	428154
Lead Frame Plating
Nickel and Its Alloys	Nickel	7440-02-0	0.09512	95.120000	951200	3.106479	31065
Precious Metals	Gold	7440-57-5	0.00078	0.780000	7800	0.025474	255
Precious Metals	Palladium	7440-05-3	0.0041	4.100000	41000	0.133900	1339
Sub-total	—	—	0.10000	100	1000000	3.265852	32659
Mold Compound
Other Inorganic Materials	Fused Silica	60676-86-0	0.938816	73.499924	734999	30.660342	306603
Other Inorganic Materials	Silica	7631-86-9	0.191595	14.999977	150000	6.257209	62572
Other Organic Materials	Carbon Black	1333-86-4	0.006387	0.500038	5000	0.208590	2086
Other Organic Materials	Organic Phosphorus	1330-78-5	0.006387	0.500038	5000	0.208590	2086
Other Plastics and Rubber	Silicone	218163-11-2	0.006387	0.500038	5000	0.208590	2086
Thermoplastics	Epoxy	85954-11-6	0.12773	9.999984	100000	4.171473	41715
Sub-total	—	—	1.277302	100	1000000	41.714794	417148
Semiconductor Device
Ceramics / Glass	Doped Silicon	7440-21-3	0.287596	100.000000	1000000	9.392460	93925
Sub-total	—	—	0.287596	100	1000000	9.392460	93925
Total	—	—	3.061988	—	—	100	1000000

				成分含量		均质物质含量
均质物质	成分	CAS 编号	质量 (mg)	百分比 %	ppm	百分比 %	ppm
Bond Wire
Copper and Its Alloys	Copper	7440-50-8	0.007649	97.538893	975389	0.163653	1637
Not Categorized	Proprietary Materials	—	0.000001	0.012752	128	0.000021	0
Precious Metals	Gold	7440-57-5	0.000004	0.051007	510	0.000086	1
Precious Metals	Palladium	7440-05-3	0.000188	2.397348	23973	0.004022	40
Sub-total	—	—	0.007842	100	1000000	0.167782	1678
Die Attach Adhesive
Other Inorganic Materials	Silica	7631-86-9	0.032816	45.000274	450003	0.702108	7021
Other Plastics and Rubber	Imidazole Derivative	288-32-4	0.000729	0.999671	9997	0.015597	156
Thermoplastics	Epoxy	85954-11-6	0.039379	54.000055	540001	0.842525	8425
Sub-total	—	—	0.072924	100	1000000	1.560231	15602
Lead Frame
Copper and Its Alloys	Copper	7440-50-8	3.224354	97.707697	977077	68.986017	689860
Copper and Its Alloys	Iron	7439-89-6	0.07062	2.140000	21400	1.510936	15109
Copper and Its Alloys	Phosphorus	7723-14-0	0.001023	0.031000	310	0.021887	219
Other Nonferrous Metals and Alloys	Lead	7439-92-1	0.00001	0.000303	3	0.000214	2
Zinc and Its Alloys	Zinc	7440-66-6	0.003993	0.121000	1210	0.085431	854
Sub-total	—	—	3.300000	100	1000000	70.604486	706045
Lead Frame Plating
Nickel and Its Alloys	Nickel	7440-02-0	0.09512	95.120000	951200	2.035121	20351
Precious Metals	Gold	7440-57-5	0.00078	0.780000	7800	0.016688	167
Precious Metals	Palladium	7440-05-3	0.0041	4.100000	41000	0.087721	877
Sub-total	—	—	0.10000	100	1000000	2.139530	21395
Mold Compound
Other Inorganic Materials	Fused Silica	60676-86-0	0.860664	88.000025	880000	18.414163	184142
Other Organic Materials	Carbon Black	1333-86-4	0.002934	0.299992	3000	0.062774	628
Other Organic Materials	Chlorine	7782-50-5	0.00001	0.001022	10	0.000214	2
Thermoplastics	Epoxy	85954-11-6	0.114419	11.698961	116990	2.448029	24480
Sub-total	—	—	0.978027	100	1000000	20.925180	209252
Semiconductor Device
Ceramics / Glass	Doped Silicon	7440-21-3	0.215131	100.000000	1000000	4.602792	46028
Sub-total	—	—	0.215131	100	1000000	4.602792	46028
Total	—	—	4.673924	—	—	100	1000000

认证摘要

应力	基准	最小批量	SS/批次	测试名称/条件	有效期	结果	笔记
HTOL	JESD22-A108	3	77	Life test, 125C	1000 hours	Pass	Or equivalent JEDEC condition
HTSL	JESD22-A103	3	25	High temp storage bake, 150C	1000 hours	Pass	Or equivalent JEDEC condition
AC/UHAST	JESD22-A102/JESD22-A118	3	25	Unbiased HAST 130C / 85% RH	96 hours	Pass	Or equivalent JEDEC condition
THB/HAST	JESD22-A101/JESD22-A110	3	25	HAST 130C/85%RH	96 hours	Pass	Or equivalent JEDEC condition
TC	JESD22-A104	3	25	Temperature cycle -65/150C	500 cycles	Pass	Or equivalent JEDEC condition
SD	J-STD-002	3	22	Per specification	>95% lead coverage	Pass	—
HBM	JS-001	1	3	ESD - HBM	Classification	See data sheet	—
CDM	JS-002	1	3	ESD - CDM	Classification	See data sheet	—
LU	JESD78	1	3	Latch-up	Per JESD78	Pass	As applicable per JESD78
MSL	J-STD-020	—	—	Per J-STD-020	Classification	See data sheet	—

持续可靠性监测

芯片制造工艺流程可靠性数据。

制造工艺	可靠性测试	滚动式的年度（2025 年第 3 季度 - 2026 年第 2 季度）样本大小	累计样本大小	结论
High-Precision CMOS	Life test 125C, 1000 Hours or Equivalent JEDEC Condition	3314	63808	Pass

装配工艺可靠性数据。

封装系列	可靠性测试	滚动式的年度（2025 年第 3 季度 - 2026 年第 2 季度）样本大小	累计样本大小	结论
QFN	Biased HAST 130C/85%RH, 96 Hours or Equivalent JEDEC Condition	14477	173028	Pass
QFN	High temp storage bake 150C, 1000 Hours or Equivalent JEDEC Condition	13550	164308	Pass
QFN	Temperature cycle -65/150C, 500 Hours or Equivalent JEDEC Condition	40279	424113	Pass
QFN	Unbiased HAST 130C/85% RH, 96 Hours or Equivalent JEDEC Condition	22747	303584	Pass

质量、可靠性和封装数据下载

INA211CIRSWR 正在供货

Rating

MTBF/FIT 估算

材料成分

认证摘要

持续可靠性监测

芯片制造工艺流程可靠性数据。

装配工艺可靠性数据。

其他资源

通用质量指南

认证

冲突矿产专用披露报告

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数据类型定义

RoHS

REACH

器件标识

引脚镀层/焊球材料֙

MSL 等级/回流焊峰值温度

MTBF/FIT 估算

材料成分

认证摘要

持续可靠性监测