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WL1831

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WiLink™ 8 單頻工業級 Wi-Fi® 與 Bluetooth® 雙模收發器

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最新 CC3301MOD 現行 SimpleLink™ Wi-Fi 6 和 Bluetooth® 低功耗配套模組 Certified modules with upgraded functionality of Wi-Fi 6 and Bluetooth Low Energy for cost-optimized applications

WL1831

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產品詳細資料

CPU External MPU Type Transceiver Technology Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE, Wi-Fi Protocols Combo (Wi-Fi + Bluetooth), Qualified against Bluetooth® Core 5.1, Wi-Fi 2.4 GHz Operating system Linux Throughput UDP (max) (Mbps) 100 Features 802.11abgn, AP, Advanced audio distribution profile, COEX, Classic audio, Hands-free profile, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Edge AI enabled No Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 105
CPU External MPU Type Transceiver Technology Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE, Wi-Fi Protocols Combo (Wi-Fi + Bluetooth), Qualified against Bluetooth® Core 5.1, Wi-Fi 2.4 GHz Operating system Linux Throughput UDP (max) (Mbps) 100 Features 802.11abgn, AP, Advanced audio distribution profile, COEX, Classic audio, Hands-free profile, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Edge AI enabled No Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 105
DSBGA (YFV) 130 22.87520000000000493 mm² (— mm × — mm)
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.
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CC3301 現行 SimpleLink™ 2.4GHz Wi-Fi® 6 和 Bluetooth® 低功耗配套 IC Upgraded functionality with Wi-Fi 6 and Bluetooth Low Energy for cost-optimized applications

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 WL18x1 WiLink™ 8 Single-Band Combo Device Supporting Wi-Fi® , Bluetooth® , and Bluetooth® Low Energy datasheet PDF | HTML 2021/5/14
應用說明 CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A) PDF | HTML 2022/10/20
應用說明 Antenna Impedance Measurement and Matching PDF | HTML 2022/3/22
使用指南 WiLink8 Getting Started Guide (Rev. B) PDF | HTML 2021/12/20
網路安全諮詢 Bluetooth® Low Energy, Basic/Enhanced Data Rate–PIN-Code Pairing Key Derivation 2021/5/27
網路安全諮詢 FragAttacks - FRagmentation and AGgregation Attacks (Rev. A) 2021/5/19
使用指南 Bluetopia Stack Build Guide for Linux PDF | HTML 2021/1/15
使用指南 WiLink8 R8.8 Linux Wi-Fi Driver Release Build User's Guide (Rev. A) PDF | HTML 2020/10/27
白皮書 Charging stations: Toward an EV support infrastructure 2017/5/9

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

軟體開發套件 (SDK)

PROCESSOR-SDK-LINUX-AM335X — Linux Processor SDK for AM335x

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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軟體開發套件 (SDK)

PROCESSOR-SDK-LINUX-RT-AM335X — Linux-RT Processor SDK for AM335x

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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軟體開發套件 (SDK)

PROCESSOR-SDK-RTOS-AM335X — TI-RTOS Processor SDK for AM335x and AMIC110 devices (No design support from TI available. Refer to Overview- RTOS Highlights for details.)

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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應用軟體及架構

WILINK-BT_WIFI-WIRELESS_TOOLS — 適用於 WL18XX 模組的 WiLink™ 無線工具

此套件包括以下應用程式：

  • WLAN 即時調整工具 (RTTT)
  • Bluetooth® 記錄器
  • WLAN gLogger
  • 連結品質監測器 (LQM)
  • HCITester 工具
    • BTSout
    • BTSTransform
    • ScriptPad

應用程式提供使用主機偵錯及監控 WiLink™ WLAN/Bluetooth/Bluetooth 低功耗韌體、執行 RF 驗證測試、執行法規認證測試的預先測試，以及偵錯硬體與軟體平台整合問題時所需的所有功能。

WLAN 和 Bluetooth 的無線偵錯和校準工具需要四個 UART 連接埠。將這些連接埠驅動至 PC 的最有效方式是使用 UART 至 USB 轉換器。TI 建議使用 (...)

lock = 需要匯出核准 (1 分鐘)
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應用軟體及架構

WILINK-WIFI_MESH_VISUALIZATION_TOOL — 適用於 WL18XX 模組的 WiLink™ Mesh 視覺化工具

Wireless Mesh Explorer is a Microsoft® Windows® based software tool for exploring and displaying mesh networks based on the Texas Instruments WiLink8.0 chipset.
lock = 需要匯出核准 (1 分鐘)
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驅動程式或資料庫

TI-BT-STACK-LINUX-ADDON — 適用於 AM335x EVM、AM437x EVM 以及具有 WL18xx 和 CC256x 之 BeagleBone 的 TI Bluetooth Linux 外掛程式

本套件包含 TI Bluetooth 堆疊與 Platform Manager 的安裝套件、預編譯物件與原始碼，可輕鬆升級 AM437x EVM、AM335x EVM 或 BeagleBone 上的預設 LINUX EZSDK 二進位。該軟體使用 Linaro GCC 4.7 建置，可以新增到其他平台上使用類似工具鏈的 Linux SDK 中。

Bluetooth 堆疊已完全通過認證（QDID172096 和 QDID172097），提供簡易的命令行範例應用程式以加速開發，並且根據需求提供 MFI 功能。

有關授權資訊、發行說明和支援的設定檔，請下載套件。如需 TI Bluetooth 堆疊和 (...)

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驅動程式或資料庫

WILINK8-WIFI-NLCP — WiLink8 NLCP Wi-Fi driver package for Linux OS

WiLink™ 8 NLCP 套件包含用於更新 WiLink™ 8 Linux 驅動程式、韌體二進位、wpa supplicant、hostapd 等的建置指令碼。更多詳細信息請參閱版本說明和使用指南

軟體區塊概覽：

WL18xx Linux 驅動程式使用開源元件以及裝置的介面驅動程式來實現 Wi-Fi 功能。下方列出了幾個 NLCP 驅動程式套件元件：

  • WiLink™ 8 FW：FW 在裝置硬體上執行，以提供 Wi-Fi 的 PHY 和 MAC 功能。主機透過 SDIO 與 WLAN 裝置通訊。在裝置端，WLAN MAC 負責 802.11 MAC 功能，並在外部主機和韌體之間傳輸 WLAN (...)
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驅動程式或資料庫

WL18XX-BT-SP — 適用於 WL18xx 的 Bluetooth Service Pack

Bluetooth Service Pack 由以下四個檔案組成：

  • BTS 檔案 (TIInit_11.8.32.bts)
  • ILI 檔案 (TIInit_11.8.32.ili)
  • XML (TIInit_11.8.32.xml)
  • 發行說明文件
  • 授權協議

請注意，檔案名中的版本號對於硬體和韌體的組合是唯一的，但不會在每次發布時更新。版本資訊會在檔案內部進行更新。

請先閱讀授權協議和發行說明。Service Pack 檔案如下所述。

  • BTS 檔案
      • 什麼是 BTS 檔案？
        • BTS 是 Bluetooth 指令碼的縮寫。BTS 檔案為二進位檔案，內含德州儀器 Bluetooth 裝置的命令和動作。

          HCI (...)
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CLRNX-3P-CLARIFI — Clarinox ClariFi 嵌入式無線偵錯器

ClariFi™ 提供內建通訊協定分析器支援，可加快複雜無線裝置的偵錯速度，並可搭配我們方便使用的 SoftFrame 抽象層中介軟體使用。其提供執行緒、記憶體使用和記憶體洩漏分析。這些工具共同支援應用程式的調整，並有助於溝通問題。使用者可以根據需要新增自訂外掛程式，並透過單一實體媒體使用控制台介面。

 

提供兩種不同的模式。首先，作為進階記錄器，其次，作為使用 ClariFi™ 測試架構在目標裝置上執行測試的互動式工具。測試架構平台為嵌入式開發人員提供自動化測試環境，無需重新編譯即可在目標裝置上快速執行測試。這是透過一個簡單的 Lua 指令碼介面進行，目標裝置會配置為伺服器裝置，回應來自 (...)

從：Clarinox
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CLRNX-3P-CLARINOX-BLUE — ClarinoxBlue 嵌入式 Bluetooth® 通訊協定堆疊

ClarinoxBlue™ 通訊協定堆疊是由嵌入式開發人員為嵌入式開發人員所設計。ClarinoxBlue 通訊協定堆疊透過簡單且靈活的方式，讓您能將更多時間花在應用程式上，而不是花在 Bluetooth 技術的內部運作。我們的解決方案專為傳統 Bluetooth (BR/EDR) 和 Bluetooth 低耗能設計，可解決工程師在 Bluetooth 專案中面臨的主要問題：缺乏彈性、增加偵錯複雜性和難度。ClarinoxBlue 通訊協定堆疊擁有優異的彈性與可攜性，可成功管理複雜性並簡化偵錯工作，讓您的下一個 Bluetooth 專案變得更加容易！

從：Clarinox
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CLRNX-3P-CLARINOX-WIFI — ClarinoxWiFi 嵌入式 Wi-Fi 通訊協定堆疊

ClarinoxWiFi 是經過驗證的 Wi-Fi 通訊協定堆疊，具有 AP、STA、P2P 和 Mesh 角色，同時也支援多種不同的 RTOS/MCU。ClarinoxWiFi 讓開發人員能夠為各種無線嵌入式應用建立可靠且高性能的 Wi-Fi 連線。

 

十多年來，Clarinox 一直與國內和國際客戶合作開發突破性的無線嵌入式產品。我們運用我們的經驗，為一系列嵌入式平台實作了 IEEE802.11a/b/g/n、AP、STA、P2P 和 GO。您已經歷了艱難的過程，Clarinox 能讓您下一個嵌入式 WiFi 專案變得更容易。

從：Clarinox
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設計工具

3P-WIRELESS-MODULES — 第三方無線模組搜尋工具

第三方無線模組搜尋工具協助開發人員識別符合其終端設備規格的產品，並採購可投入生產的無線模組。搜尋工具中包含的第三方模組供應商是獨立的第三方公司，擁有使用 TI 無線連接產品設計與製造無線模組的專業知識。

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DSBGA (YFV) 130 Ultra Librarian
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