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電壓轉換器及電平移位器
電壓轉換器

TXS0104E

現行

適用開汲極和推拉式應用的四位元雙向電壓位準移位器

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產品規格表

TXS0104E

現行
產品規格表 立即訂購

產品詳細資料

Bits (#) 4 Data rate (max) (Mbps) 24 Topology Open drain, Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 1.65 Vin (max) (V) 3.6 Vout (min) (V) 2.3 Vout (max) (V) 5.5 Applications GPIO, I2C, JTAG, MDIO, SDIO, SMBus, SPI, UART Features Edge rate accelerator, Output enable Prop delay (ns) 124 Technology family TXS Supply current (max) (mA) 0.025 Rating Catalog Operating temperature range (°C) -40 to 125
Bits (#) 4 Data rate (max) (Mbps) 24 Topology Open drain, Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 1.65 Vin (max) (V) 3.6 Vout (min) (V) 2.3 Vout (max) (V) 5.5 Applications GPIO, I2C, JTAG, MDIO, SDIO, SMBus, SPI, UART Features Edge rate accelerator, Output enable Prop delay (ns) 124 Technology family TXS Supply current (max) (mA) 0.025 Rating Catalog Operating temperature range (°C) -40 to 125
VQFN (RGY) 14 12.25 mm² (3.5 mm × 3.5 mm) SOIC (D) 14 51.9 mm² (8.65 mm × 6 mm) NFBGA (NMN) 12 5 mm² (2 mm × 2.5 mm) WQFN (BQA) 14 7.5 mm² (3 mm × 2.5 mm) UQFN (RUT) 12 3.4 mm² (2 mm × 1.7 mm) DSBGA (YZT) 12 3.9375 mm² (— mm × — mm) TSSOP (PW) 14 32 mm² (5 mm × 6.4 mm)
  • No direction-control signal needed
  • Maximum data rates:
    • 24Mbps (push pull)
    • 2Mbps (open drain)
  • Available in the Texas Instruments NanoFree™ package
  • 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on B port (V CCA ≤ V CCB)
  • No power-supply sequencing required – V CCA or V CCB can be ramped first
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • ESD protection exceeds JESD 22:
    • A port:
      • 2000-V Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1000-V Charged-Device Model (C101)
    • B port:
      • 15-kV Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1000-V Charged-Device Model (C101)
  • IEC 61000-4-2 ESD (B port):
    • ±8-kV contact discharge
    • ±10-kV air-gap discharge
  • No direction-control signal needed
  • Maximum data rates:
    • 24Mbps (push pull)
    • 2Mbps (open drain)
  • Available in the Texas Instruments NanoFree™ package
  • 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on B port (V CCA ≤ V CCB)
  • No power-supply sequencing required – V CCA or V CCB can be ramped first
  • Latch-up performance exceeds 100 mA per JESD 78, class II
  • ESD protection exceeds JESD 22:
    • A port:
      • 2000-V Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1000-V Charged-Device Model (C101)
    • B port:
      • 15-kV Human-Body Model (A114-B)
      • 200-V Machine Model (A115-A)
      • 1000-V Charged-Device Model (C101)
  • IEC 61000-4-2 ESD (B port):
    • ±8-kV contact discharge
    • ±10-kV air-gap discharge

This 4-bit non-inverting translator uses two separate configurable power-supply rails. The A port is designed to track V CCA. V CCA accepts any supply voltage from 1.65 V to 3.6 V. V CCA must be less than or equal to V CCB. The B port is designed to track V CCB. V CCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

The TXS0104E is designed so that the OE input circuit is supplied by V CCA.

For the high-impedance state during power up or power down, tie OE to GND through a pull-down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

This 4-bit non-inverting translator uses two separate configurable power-supply rails. The A port is designed to track V CCA. V CCA accepts any supply voltage from 1.65 V to 3.6 V. V CCA must be less than or equal to V CCB. The B port is designed to track V CCB. V CCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

The TXS0104E is designed so that the OE input circuit is supplied by V CCA.

For the high-impedance state during power up or power down, tie OE to GND through a pull-down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 TXS0104E4-Bit Bidirectional Voltage-Level Translator forOpen-Drain and Push-Pull Applications datasheet (Rev. K) PDF | HTML 2023/10/3
應用說明 Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 2024/7/12
應用說明 Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 2024/7/3
Application brief Integrated vs. Discrete Open Drain Level Translation PDF | HTML 2024/1/9
應用說明 Leveraging Edge Rate Accelerators with Auto-Sensing Level Shifters PDF | HTML 2023/9/29
Application brief Future-Proofing Your Level Shifter Design with TI's Dual Footprint Packages PDF | HTML 2023/9/5
應用說明 Do’s and Don’ts for TXB and TXS Voltage Level-Shifters with Edge Rate Accelerato PDF | HTML 2023/6/28
Application brief Enabling Next Generation Processors, FPGA, and ASSP with Voltage Level Translat PDF | HTML 2023/1/17
Application brief Enabling Smart Solar Inverter Designs with Level Translation PDF | HTML 2022/10/31
選擇指南 Voltage Translation Buying Guide (Rev. A) 2021/4/15
應用說明 Effects of pullup and pulldown resistors on TXS and TXB devices (Rev. A) 2018/3/28
應用說明 A Guide to Voltage Translation With TXS-Type Translators 2010/6/29

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14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組

14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。

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14-24-NL-LOGIC-EVM 是一款靈活的評估模組 (EVM)，設計用於支援任何具有 14 針腳至 24 針腳 BQA、BQB、RGY、RSV、RJW 或 RHL 封裝的邏輯或轉換裝置。

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CC256XMS432BTBLESW — MSP432 MCU 的 TI 雙模式藍牙架構

TI’s Dual-mode Bluetooth stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886), provides (...)

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模擬型號

TXS0104E IBIS Model (Rev. C)

SCEM560C.ZIP (64 KB) - IBIS 模型
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參考設計

TIDA-00403 — 使用 TLV320AIC3268 miniDSP 轉碼器的超音波距離量測參考設計

TIDA-00403 參考設計使用針對超音波距離量測解決方案的現成 EVM，該解決方案使用 TLV320AIC3268 miniDSP 中的演算法。與 TI 的 PurePath Studio 設計套件搭配使用，只需按滑鼠即可設計穩固且使用者可配置的超音波距離量測系統。使用者可修改超音波突衝產生特性和偵測演算法，以配合工業和測量應用的特定使用案例，讓使用者能夠克服其他固定功能感測器的限制，同時提高量測可靠性。TLV320AIC3268 上的兩個 GPIO 會自動觸發，表示發射與接收的超音波突衝。透過監控這些 GPIO 的主機 MCU，即可擷取飛行時間。

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VQFN (RGY) 14 Ultra Librarian
SOIC (D) 14 Ultra Librarian
NFBGA (NMN) 12 Ultra Librarian
WQFN (BQA) 14 Ultra Librarian
UQFN (RUT) 12 Ultra Librarian
DSBGA (YZT) 12 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian
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