TSD36C
- IEC 61000-4-2 ESD protection:
- ±30kV contact discharge
- ±30kV air gap discharge
- IEC 61000-4-5 surge protection:
- 6.5-30A (8/20µs)
- Low IO capacitance < 7pF (typical)
- Ultra low leakage current: 10nA (maximum)
- Industrial temperature range: –55°C to +150°C
- Industry standard SOD-323 leaded package (2.65mm × 1.3mm)
The TSDxxC are a family of bidirectional TVS protection diodes designed for clamping harmful transients such as ESD and surge. The TSDxxC devices are rated to dissipate ESD strikes up to ±30kV (contact and air gap discharge) which exceeds the maximum level specified in the IEC 61000-4-2 international standard (Level 4).
Combining the robust clamping performance and low capacitance of these devices, TSDxxC are excellent TVS diodes to protect both data lines and power lines in many different applications.
The TSDxxC family is offered in the industry standard, leaded SOD-323 package to enable easy solderability.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | TSDxxC Bidirectional TVS Diodes in SOD-323 Package datasheet (Rev. C) | PDF | HTML | 2024/10/24 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
ESDEVM — 適用於 ESD 二極體封裝的通用評估模組，包括 0402、0201等
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前，建立完整的終端設備設計和解決方案原型，進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中，您可以搜尋 TI (...)
TINA-TI — 基於 SPICE 的類比模擬程式
TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOT (DYF) | 2 | Ultra Librarian |
訂購與品質
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。