TS5A3153
- Isolation in the Powered-Off Mode, V+ = 0
- Specified Break-Before-Make Switching
- Low ON-State Resistance (1
) - Control Inputs Are 5.5-V Tolerant
- Low Charge Injection
- Excellent ON-State Resistance Matching
- Low Total Harmonic Distortion (THD)
- 1.65-V to 5.5-V Single-Supply Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
- APPLICATIONS
- Cell Phones
- PDAs
- Portable Instrumentation
- Audio and Video Signal Routing
- Low-Voltage Data-Acquisition Systems
- Communication Circuits
- Modems
- Hard Drives
- Computer Peripherals
- Wireless Terminals and Peripherals
NanoStar Is a trademark of Texas Instruments.
The TS5A3153 is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 5.5 V. The device offers a low ON-state resistance and an excellent on-resistance matching with the break-before-make feature, to prevent signal distortion during the transferring of a signal from one channel to another. The device has an excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications.
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| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | 1-Ohm SPDT Analog Switch 5-V/3.3-V Single-Channel 2:1 Multiplexer/Demultiplexer datasheet (Rev. A) | 2008/7/11 | |||
| 應用說明 | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022/6/2 | |||
| 應用說明 | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021/12/1 | |||
| Application brief | Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) | PDF | HTML | 2021/1/6 |
設計與開發
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介面轉接器
LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
EVM-LEADED1 板可用於快速測試和搭建 TI 常見的有引腳封裝 此電路板具備板上配置,可將 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面黏著封裝轉換為 100mil DIP 排針。
使用指南:
PDF
介面轉接器
LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器
EVM-LEADLESS1 電路板允許快速測試和麵包板搭建 TI 常見的無引腳封裝。 此電路板具有封裝設計,可將 TI 的 DRC、DTP、DQE、RBW、RGY、RSE、RSV、RSW、RTE、RTJ、RUK、RUC、RUG、RUM、RUT 和 YZP 表面黏著封裝轉換為 100mil DIP 接頭。
使用指南:
PDF
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YZP) | 8 | Ultra Librarian |
| VSSOP (DCU) | 8 | Ultra Librarian |
訂購與品質
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