產品詳細資料

Configuration Audio jack Number of channels 1 Protocols Analog Audio Ron (typ) (Ω) 0.07, 0.1 Supply current (typ) (µA) 8 Operating temperature range (°C) -40 to 85 Features Autonomous headset MIC/GND detection (3 or 4 pole), Integrated Codec Sense Line, Manual I2C control Rating Catalog Supply voltage (max) (V) 4.5
Configuration Audio jack Number of channels 1 Protocols Analog Audio Ron (typ) (Ω) 0.07, 0.1 Supply current (typ) (µA) 8 Operating temperature range (°C) -40 to 85 Features Autonomous headset MIC/GND detection (3 or 4 pole), Integrated Codec Sense Line, Manual I2C control Rating Catalog Supply voltage (max) (V) 4.5
DSBGA (YFF) 16 3.24 mm² 1.8 x 1.8 WQFN (RTE) 16 9 mm² 3 x 3
  • VDD Range = 2.7 V to 4.5 V
  • Break Before Make Stereo Jack Switches
  • Ron for Ground FET Switches
    • WCSP Package: 70 mΩ
    • QFN Package: 100 mΩ
  • Autonomous Detection of GND and MIC Connections
  • Detection Triggered by I2C or External Trigger Pin
  • HDA Compatible MIC Present Indicator
  • 1.8V Compatible I2C Switch Control
  • ESD Performance Tested Per JESD 22:
    • 2000-V Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)
  • ESD Performance (SLEEVE, RING2, TIP)
    • ±8-kV Contact Discharge (IEC 61000-4-2)
  • VDD Range = 2.7 V to 4.5 V
  • Break Before Make Stereo Jack Switches
  • Ron for Ground FET Switches
    • WCSP Package: 70 mΩ
    • QFN Package: 100 mΩ
  • Autonomous Detection of GND and MIC Connections
  • Detection Triggered by I2C or External Trigger Pin
  • HDA Compatible MIC Present Indicator
  • 1.8V Compatible I2C Switch Control
  • ESD Performance Tested Per JESD 22:
    • 2000-V Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)
  • ESD Performance (SLEEVE, RING2, TIP)
    • ±8-kV Contact Discharge (IEC 61000-4-2)

The TS3A225E is an audio headset switch device. The device detects the presence of an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TS3A225E detects a certain configuration, the device automatically connects the microphone line to the appropriate pin. The device also reports the presence of an analog microphone on an audio stereo jack.

In some systems, it is desirable to connect the stereo jack pin to ground. The TS3A225E provides two internal low resistance (<100mΩ) FET switches for ground shorting.

The TS3A225E is an audio headset switch device. The device detects the presence of an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TS3A225E detects a certain configuration, the device automatically connects the microphone line to the appropriate pin. The device also reports the presence of an analog microphone on an audio stereo jack.

In some systems, it is desirable to connect the stereo jack pin to ground. The TS3A225E provides two internal low resistance (<100mΩ) FET switches for ground shorting.

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技術文件

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檢視所有 6
類型 標題 日期
* Data sheet Autonomous Audio Headset Switch datasheet (Rev. A) 2013年 5月 29日
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022年 6月 2日
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. C) PDF | HTML 2021年 11月 19日
Application note Support Selfie Sticks Using a TS3A227E Audio Jack Switch 2016年 3月 4日
Application note Preventing Excess Power Consumption on Analog Switches 2008年 7月 3日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

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子卡

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插入 LaunchPad™ 開發套件時,BOOSTXL-AUDIO BoosterPack™ 外掛程式模組可擷取來自麥克風的音訊輸入,並透過板載喇叭輸出音訊。還支援耳機輸入和輸出。此音訊輸入/輸出串流可讓開發人員實驗附加 LaunchPad 開發套件上微控制器 (MCU) 的數位訊號處理 (DSP) 和濾波功能。

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使用指南: PDF
介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

EVM-LEADLESS1 電路板允許快速測試和麵包板搭建 TI 常見的無引腳封裝。  此電路板具有封裝設計,可將 TI 的 DRC、DTP、DQE、RBW、RGY、RSE、RSV、RSW、RTE、RTJ、RUK、RUC、RUG、RUM、RUT 和 YZP 表面黏著封裝轉換為 100mil DIP 接頭。
使用指南: PDF
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模擬型號

TS3A225E HSpice (LIN) Model

SCDM145.ZIP (483 KB) - HSpice Model
模擬型號

TS3A225E HSpice (WIN) Model

SCDM146.ZIP (482 KB) - HSpice Model
封裝 針腳 CAD 符號、佔位空間與 3D 模型
DSBGA (YFF) 16 Ultra Librarian
WQFN (RTE) 16 Ultra Librarian

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