TMUX154E

現行

產品詳細資料

Protocols Analog, I2C, I3C, LVDS, UART Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 900 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 7 ESD HBM (typ) (kV) 8 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -54 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 64 COFF (typ) (pF) 2 CON (typ) (pF) 7.5 Off isolation (typ) (dB) -40 OFF-state leakage current (max) (µA) 2 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 Turnoff time (disable) (max) (ns) 30 Turnon time (enable) (max) (ns) 30 VIH (min) (V) 1.3 VIL (max) (V) 0.5 Rating Catalog
Protocols Analog, I2C, I3C, LVDS, UART Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 900 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 7 ESD HBM (typ) (kV) 8 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -54 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 64 COFF (typ) (pF) 2 CON (typ) (pF) 7.5 Off isolation (typ) (dB) -40 OFF-state leakage current (max) (µA) 2 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 Turnoff time (disable) (max) (ns) 30 Turnon time (enable) (max) (ns) 30 VIH (min) (V) 1.3 VIL (max) (V) 0.5 Rating Catalog
UQFN (RSW) 10 2.52 mm² (1.8 mm × 1.4 mm) VSSOP (DGS) 10 14.7 mm² (3 mm × 4.9 mm)
  • VCC Operation at 3 V to 4.3 V
  • I/O Pins Can Tolerate up to 5.25 V
  • 1.8-V Compatible Control Logic
  • Supports Powered-off Protection I/O Pins Hi-Z When VCC = 0 V
  • RON = 10 Ω Maximum
  • ΔRON = 0.35 Ω Typical
  • Cio(ON) = 7.5 pF Typical
  • Low Power Consumption (1 uA Maximum)
  • –3-dB Bandwidth = 900 MHz Typical
  • Latch-Up Performance Exceeds
    100 mA Per JESD 78, Class II (1)
  • ESD Performance Tested Per JESD 22
    • 8000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance I/O Port to GND (2)
    • 15000-V Human-Body Model

(1)Except EN and SEL Inputs

(2)High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only.

  • VCC Operation at 3 V to 4.3 V
  • I/O Pins Can Tolerate up to 5.25 V
  • 1.8-V Compatible Control Logic
  • Supports Powered-off Protection I/O Pins Hi-Z When VCC = 0 V
  • RON = 10 Ω Maximum
  • ΔRON = 0.35 Ω Typical
  • Cio(ON) = 7.5 pF Typical
  • Low Power Consumption (1 uA Maximum)
  • –3-dB Bandwidth = 900 MHz Typical
  • Latch-Up Performance Exceeds
    100 mA Per JESD 78, Class II (1)
  • ESD Performance Tested Per JESD 22
    • 8000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance I/O Port to GND (2)
    • 15000-V Human-Body Model

(1)Except EN and SEL Inputs

(2)High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only.

The TMUX154E is a high-bandwidth 2:1 switch specially designed for the switching of high-speed signals in applications with limited I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of high-speed signals. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation.

The TMUX154E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8 mm × 1.4 mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.

The TMUX154E is a high-bandwidth 2:1 switch specially designed for the switching of high-speed signals in applications with limited I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of high-speed signals. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation.

The TMUX154E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8 mm × 1.4 mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.

下載 觀看有字幕稿的影片 影片

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

AM261-SOM-EVM — AM261x 控制系統模組 (SOM) 評估模組

AM261-SOM-EVM 是德州儀器 Sitara™ AM261x 系列微控制器 (MCU) 的評估與開發電路板。該系統模組設計採用三個 120 針腳高速高密度連接器,非常適合初期評估與快速原型開發。使用 AM261-SOM-EVM 進行評估時,需搭配 XDS110ISOEVM(需另行購買或與 AM261-SOM-EVM 成套購買)。
使用指南: PDF | HTML
支援產品和硬體
有庫存
限制:
??asset.out-of-stock-ti_zh_TW??
無法提供
開發板

HSEC180ADAPEVM-AM2 — 適用於 AM261x 系統模組 (SOM) 評估模組的 HSEC180 轉接器電路板

此評估模組是用於 TI AM261x 系統模組 (SOM) 平台的 180 針腳高速邊緣卡 (HSEC) 轉接器,允許 SOM 型平台與 Sitara™/C2000™ HSEC 型 EVM 向下相容。HSEC180ADAPEVM-AM2 可將來自 SOM 電路板的 180 針腳連接至 HSEC 針腳,以便與舊版 Sitara/C2000 HSEC 擴充底座(如 TMDSHSECDOCK-AM263 和 TMDSHSECDOCK)一起使用。

使用指南: PDF | HTML
支援產品和硬體
有庫存
限制:
??asset.out-of-stock-ti_zh_TW??
無法提供
介面轉接器

LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器

EVM-LEADED1 板可用於快速測試和搭建 TI 常見的有引腳封裝  此電路板具備板上配置,可將 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面黏著封裝轉換為 100mil DIP 排針。     

使用指南: PDF
支援產品和硬體
有庫存
限制:
??asset.out-of-stock-ti_zh_TW??
無法提供
介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

EVM-LEADLESS1 電路板允許快速測試和麵包板搭建 TI 常見的無引腳封裝。  此電路板具有封裝設計,可將 TI 的 DRC、DTP、DQE、RBW、RGY、RSE、RSV、RSW、RTE、RTJ、RUK、RUC、RUG、RUM、RUT 和 YZP 表面黏著封裝轉換為 100mil DIP 接頭。
使用指南: PDF
支援產品和硬體
有庫存
限制:
??asset.out-of-stock-ti_zh_TW??
無法提供
模擬型號

TMUX154E TINA-TI Reference Design

SCDM178.TSC (409 KB) - TINA-TI 參考設計
支援產品和硬體
模擬型號

TMUX154E TINA-TI Spice Model

SCDM179.ZIP (5 KB) - TINA-TI Spice 模型
支援產品和硬體
封裝 針腳 CAD 符號、佔位空間與 3D 模型
UQFN (RSW) 10 Ultra Librarian
VSSOP (DGS) 10 Ultra Librarian

訂購與品質

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片