TLV9004-Q1

現行

適合成本最佳化應用的車規、四路、5.5-V、1-MHz、RRIO 運算放大器

產品詳細資料

Number of channels 4 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 5.5 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 1.8 Rail-to-rail In, Out GBW (typ) (MHz) 1 Slew rate (typ) (V/µs) 2 Vos (offset voltage at 25°C) (max) (mV) 1.6 Iq per channel (typ) (mA) 0.06 Vn at 1 kHz (typ) (nV√Hz) 30 Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Offset drift (typ) (µV/°C) 0.6 Features Cost Optimized, EMI Hardened, Small Size CMRR (typ) (dB) 77 Iout (typ) (A) 0.04 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.1 Input common mode headroom (to positive supply) (typ) (V) 0.1 Output swing headroom (to negative supply) (typ) (V) 0.01 Output swing headroom (to positive supply) (typ) (V) -0.01
Number of channels 4 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 5.5 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 1.8 Rail-to-rail In, Out GBW (typ) (MHz) 1 Slew rate (typ) (V/µs) 2 Vos (offset voltage at 25°C) (max) (mV) 1.6 Iq per channel (typ) (mA) 0.06 Vn at 1 kHz (typ) (nV√Hz) 30 Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Offset drift (typ) (µV/°C) 0.6 Features Cost Optimized, EMI Hardened, Small Size CMRR (typ) (dB) 77 Iout (typ) (A) 0.04 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.1 Input common mode headroom (to positive supply) (typ) (V) 0.1 Output swing headroom (to negative supply) (typ) (V) 0.01 Output swing headroom (to positive supply) (typ) (V) -0.01
TSSOP (PW) 14 32 mm² (5 mm × 6.4 mm) SOT-23-THN (DYY) 14 13.692 mm² (4.2 mm × 3.26 mm) SOIC (D) 14 51.9 mm² (8.65 mm × 6 mm)
  • AEC-Q100 qualified for automotive applications
    • Temperature grade 1: –40°C to +125°C, TA
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C6
  • Scalable CMOS amplifier for low-cost applications
  • Rail-to-rail input and output
  • Low input offset voltage: ±0.4mV
  • Unity-gain bandwidth: 1MHz
  • Low broadband noise: 27nV/√ Hz
  • Low input bias current: 5pA
  • Low quiescent current: 60µA\/Ch
  • Unity-gain stable
  • Internal RFI and EMI filter
  • Operational at supply voltages as low as 1.8V
  • Easier to stabilize with higher capacitive load due to resistive open-loop output impedance
  • Functional Safety-Capable
  • AEC-Q100 qualified for automotive applications
    • Temperature grade 1: –40°C to +125°C, TA
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C6
  • Scalable CMOS amplifier for low-cost applications
  • Rail-to-rail input and output
  • Low input offset voltage: ±0.4mV
  • Unity-gain bandwidth: 1MHz
  • Low broadband noise: 27nV/√ Hz
  • Low input bias current: 5pA
  • Low quiescent current: 60µA\/Ch
  • Unity-gain stable
  • Internal RFI and EMI filter
  • Operational at supply voltages as low as 1.8V
  • Easier to stabilize with higher capacitive load due to resistive open-loop output impedance
  • Functional Safety-Capable

The TLV900x-Q1 family includes single (TLV9001-Q1), dual (TLV9002-Q1), and quad-channel (TLV9004-Q1) low-voltage (1.8V to 5.5V) operational amplifiers (op amps) with rail-to-rail input and output swing capabilities. These op amps provide a cost-effective option for space-constrained automotive applications such as infotainment and lighting where low-voltage operation and high capacitive-load drive are required. The capacitive-load drive of the TLV900x-Q1 family is 500pF, and the resistive open-loop output impedance makes stabilization easier with much higher capacitive loads. These op amps are designed specifically for low-voltage operation (1.8V to 5.5V) with performance specifications similar to the TLV600x-Q1 devices.

The robust design of the TLV900x-Q1 family simplifies circuit design. The op amps feature unity-gain stability, an integrated RFI and EMI rejection filter, and no-phase reversal in overdrive conditions.

The TLV900x-Q1 family includes single (TLV9001-Q1), dual (TLV9002-Q1), and quad-channel (TLV9004-Q1) low-voltage (1.8V to 5.5V) operational amplifiers (op amps) with rail-to-rail input and output swing capabilities. These op amps provide a cost-effective option for space-constrained automotive applications such as infotainment and lighting where low-voltage operation and high capacitive-load drive are required. The capacitive-load drive of the TLV900x-Q1 family is 500pF, and the resistive open-loop output impedance makes stabilization easier with much higher capacitive loads. These op amps are designed specifically for low-voltage operation (1.8V to 5.5V) with performance specifications similar to the TLV600x-Q1 devices.

The robust design of the TLV900x-Q1 family simplifies circuit design. The op amps feature unity-gain stability, an integrated RFI and EMI rejection filter, and no-phase reversal in overdrive conditions.

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 TLV900x-Q1 Low-Power RRIO 1MHz Automotive Operational Amplifier datasheet (Rev. G) PDF | HTML 2026/4/14
功能安全資訊 TLV900x-Q1 Functional Safety FIT Rate, FMD, and Pin FMA PDF | HTML 2021/3/4

設計與開發

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開發板

AMP-PDK-EVM — 放大器性能開發套件評估模組

放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。

AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:

  • D (SOIC-8 和 SOIC-14)
  • PW (TSSOP-14)
  • DGK (VSSOP-8)
  • DBV (SOT23-5 和 SOT23-6)
  • DCK (SC70-5 和 SC70-6)
使用指南: PDF | HTML
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開發板

DYY-AMP-EVM — 適用於採用 DYY 封裝之運算放大器的評估模組

DYY-AMP-EVM 是一款評估模組 (EVM),可測試採用 DYY-14 (SOT-23 THN) 封裝的運算放大器性能。此 EVM 可輕鬆配置為反相放大器、非反相放大器及差動放大器,讓工程師能快速評估並驗證設計概念。

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模擬型號

TLV9002 PSpice Model (Rev. D)

SBOMAL2D.ZIP (22 KB) - PSpice 模型
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模擬型號

TLV9002 TINA-TI Reference Design (Rev. A)

SBOMAL3B (43 KB) - TINA-TI 參考設計
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模擬型號

TLV9002 TINA-TI SPICE Model (Rev. B)

SBOMAH7C (5 KB) - TINA-TI Spice 模型
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封裝 針腳 CAD 符號、佔位空間與 3D 模型
TSSOP (PW) 14 Ultra Librarian
SOT-23-THN (DYY) 14 Ultra Librarian
SOIC (D) 14 Ultra Librarian

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