TLV9002-Q1

現行

適合成本最佳化應用的車規、雙路、5.5-V、1-MHz、RRIO 運算放大器

產品詳細資料

Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 5.5 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 1.8 Rail-to-rail In, Out GBW (typ) (MHz) 1 Slew rate (typ) (V/µs) 2 Vos (offset voltage at 25°C) (max) (mV) 1.5 Iq per channel (typ) (mA) 0.06 Vn at 1 kHz (typ) (nV√Hz) 30 Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Offset drift (typ) (µV/°C) 0.6 Features Cost Optimized, EMI Hardened CMRR (typ) (dB) 90 Iout (typ) (A) 0.04 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.1 Input common mode headroom (to positive supply) (typ) (V) 0.1 Output swing headroom (to negative supply) (typ) (V) 0 Output swing headroom (to positive supply) (typ) (V) -0.055
Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 5.5 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 1.8 Rail-to-rail In, Out GBW (typ) (MHz) 1 Slew rate (typ) (V/µs) 2 Vos (offset voltage at 25°C) (max) (mV) 1.5 Iq per channel (typ) (mA) 0.06 Vn at 1 kHz (typ) (nV√Hz) 30 Rating Automotive Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Offset drift (typ) (µV/°C) 0.6 Features Cost Optimized, EMI Hardened CMRR (typ) (dB) 90 Iout (typ) (A) 0.04 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.1 Input common mode headroom (to positive supply) (typ) (V) 0.1 Output swing headroom (to negative supply) (typ) (V) 0 Output swing headroom (to positive supply) (typ) (V) -0.055
TSSOP (PW) 8 19.2 mm² (3 mm × 6.4 mm) SOIC (D) 8 29.4 mm² (4.9 mm × 6 mm) VSSOP (DGK) 8 14.7 mm² (3 mm × 4.9 mm)
  • AEC-Q100 qualified for automotive applications
    • Temperature grade 1: –40°C to +125°C, TA
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C6
  • Scalable CMOS amplifier for low-cost applications
  • Rail-to-rail input and output
  • Low input offset voltage: ±0.4mV
  • Unity-gain bandwidth: 1MHz
  • Low broadband noise: 27nV/√ Hz
  • Low input bias current: 5pA
  • Low quiescent current: 60µA\/Ch
  • Unity-gain stable
  • Internal RFI and EMI filter
  • Operational at supply voltages as low as 1.8V
  • Easier to stabilize with higher capacitive load due to resistive open-loop output impedance
  • Functional Safety-Capable
  • AEC-Q100 qualified for automotive applications
    • Temperature grade 1: –40°C to +125°C, TA
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C6
  • Scalable CMOS amplifier for low-cost applications
  • Rail-to-rail input and output
  • Low input offset voltage: ±0.4mV
  • Unity-gain bandwidth: 1MHz
  • Low broadband noise: 27nV/√ Hz
  • Low input bias current: 5pA
  • Low quiescent current: 60µA\/Ch
  • Unity-gain stable
  • Internal RFI and EMI filter
  • Operational at supply voltages as low as 1.8V
  • Easier to stabilize with higher capacitive load due to resistive open-loop output impedance
  • Functional Safety-Capable

The TLV900x-Q1 family includes single (TLV9001-Q1), dual (TLV9002-Q1), and quad-channel (TLV9004-Q1) low-voltage (1.8V to 5.5V) operational amplifiers (op amps) with rail-to-rail input and output swing capabilities. These op amps provide a cost-effective option for space-constrained automotive applications such as infotainment and lighting where low-voltage operation and high capacitive-load drive are required. The capacitive-load drive of the TLV900x-Q1 family is 500pF, and the resistive open-loop output impedance makes stabilization easier with much higher capacitive loads. These op amps are designed specifically for low-voltage operation (1.8V to 5.5V) with performance specifications similar to the TLV600x-Q1 devices.

The robust design of the TLV900x-Q1 family simplifies circuit design. The op amps feature unity-gain stability, an integrated RFI and EMI rejection filter, and no-phase reversal in overdrive conditions.

The TLV900x-Q1 family includes single (TLV9001-Q1), dual (TLV9002-Q1), and quad-channel (TLV9004-Q1) low-voltage (1.8V to 5.5V) operational amplifiers (op amps) with rail-to-rail input and output swing capabilities. These op amps provide a cost-effective option for space-constrained automotive applications such as infotainment and lighting where low-voltage operation and high capacitive-load drive are required. The capacitive-load drive of the TLV900x-Q1 family is 500pF, and the resistive open-loop output impedance makes stabilization easier with much higher capacitive loads. These op amps are designed specifically for low-voltage operation (1.8V to 5.5V) with performance specifications similar to the TLV600x-Q1 devices.

The robust design of the TLV900x-Q1 family simplifies circuit design. The op amps feature unity-gain stability, an integrated RFI and EMI rejection filter, and no-phase reversal in overdrive conditions.

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LMV358A-Q1 現行 汽車級、雙路、5.5-V、1-MHz、4-mV 偏移電壓、RRO 運算放大器 No rail-to-rail I/O, higher offset voltage (4 mV)

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 TLV900x-Q1 Low-Power RRIO 1MHz Automotive Operational Amplifier datasheet (Rev. G) PDF | HTML 2026/4/14
功能安全資訊 TLV900x-Q1 Functional Safety FIT Rate, FMD, and Pin FMA PDF | HTML 2021/3/4
類比設計期刊 Comparing two‐wire microphone circuits for automotive applications 2020/6/23

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

AMP-PDK-EVM — 放大器性能開發套件評估模組

放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。

AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:

  • D (SOIC-8 和 SOIC-14)
  • PW (TSSOP-14)
  • DGK (VSSOP-8)
  • DBV (SOT23-5 和 SOT23-6)
  • DCK (SC70-5 和 SC70-6)
使用指南: PDF | HTML
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開發板

DIP-ADAPTER-EVM — DIP 轉接器評估模組

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

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開發板

DUAL-DIYAMP-EVM — 用於 SOIC 封裝的雙通道通用自製 (DIY) 放大器電路評估模組

DUAL-DIYAMP-EVM 是一系列評估模組 (EVM),提供工程師與自組愛好者 (DIYer) 實作型放大器電路,協助快速評估設計概念並驗證模擬結果。其是專為採用業界標準 SOIC-8 封裝的雙封裝運算放大器而設計。其可實現反向及非反向放大器、Sallen key 濾波器、多回饋濾波器、含參考緩衝器的差動放大器、含雙回饋的 Riso、單端輸入至差動輸出、差動輸入至差動輸出、雙運算放大器儀器放大器和並聯運算放大器。

DUAL-DIYAMP-EVM 可快速製作電路原型,並採用常見的 0805 或 0603 表面裝載元件。透過多種組合方式,此 EVM (...)

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模擬型號

TLV9002 PSpice Model (Rev. D)

SBOMAL2D.ZIP (22 KB) - PSpice 模型
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模擬型號

TLV9002 TINA-TI Reference Design (Rev. A)

SBOMAL3B (43 KB) - TINA-TI 參考設計
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模擬型號

TLV9002 TINA-TI SPICE Model (Rev. B)

SBOMAH7C (5 KB) - TINA-TI Spice 模型
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參考設計

TIDA-010985 — 適用於具有大型 Y 電容參考設計的 800V DC 系統的電阻橋絕緣監控裝置

此參考設計採用電阻橋絕緣監控裝置 (IMD)。此設計可準確偵測對稱和不對稱隔離電阻故障。此參考設計也可測量具有大型 Y 電容的高電壓 DC 系統電容。此設計符合 UL 標準的反應時間要求。

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參考設計

TIDA-020069 — 車用高電壓連鎖迴路 (HVIL) 參考設計

此參考設計展示如何設計高電壓連鎖迴路 (HVIL),作為電動車高電壓纜線的電池連接安全電路。此設計會用到放大器、比較器、LDO 和邏輯閘組合,以提供 HVIL 連接器狀態的類比和數位讀數。

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封裝 針腳 CAD 符號、佔位空間與 3D 模型
TSSOP (PW) 8 Ultra Librarian
SOIC (D) 8 Ultra Librarian
VSSOP (DGK) 8 Ultra Librarian

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