TLV2373

現行

具備關機功能的雙路、16-V、3-MHz、RRIO 運算放大器

現在提供此產品的更新版本

open-in-new 比較替代產品
具備升級功能,可直接投入使用替代所比較的裝置。
TLV9152 現行 雙路、16-V、4.5-MHz、低功耗運算放大器 Higher GBW (4.5 MHz), faster slew rate (21 V/us), lower offset voltage (0.75 mV), lower noise (10.8 nV/√Hz), higher output current (75 mA)

產品詳細資料

Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 16 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.7 Rail-to-rail In, Out GBW (typ) (MHz) 3 Slew rate (typ) (V/µs) 2.4 Vos (offset voltage at 25°C) (max) (mV) 4.5 Iq per channel (typ) (mA) 0.55 Vn at 1 kHz (typ) (nV√Hz) 39 Rating Catalog Operating temperature range (°C) -40 to 125 Offset drift (typ) (µV/°C) 2 Features Shutdown Input bias current (max) (pA) 60 CMRR (typ) (dB) 72 Iout (typ) (A) 0.007 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) 0 Input common mode headroom (to positive supply) (typ) (V) 0 Output swing headroom (to negative supply) (typ) (V) 0.05 Output swing headroom (to positive supply) (typ) (V) -0.07
Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 16 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.7 Rail-to-rail In, Out GBW (typ) (MHz) 3 Slew rate (typ) (V/µs) 2.4 Vos (offset voltage at 25°C) (max) (mV) 4.5 Iq per channel (typ) (mA) 0.55 Vn at 1 kHz (typ) (nV√Hz) 39 Rating Catalog Operating temperature range (°C) -40 to 125 Offset drift (typ) (µV/°C) 2 Features Shutdown Input bias current (max) (pA) 60 CMRR (typ) (dB) 72 Iout (typ) (A) 0.007 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) 0 Input common mode headroom (to positive supply) (typ) (V) 0 Output swing headroom (to negative supply) (typ) (V) 0.05 Output swing headroom (to positive supply) (typ) (V) -0.07
PDIP (N) 14 181.42 mm² (19.3 mm × 9.4 mm) VSSOP (DGS) 10 14.7 mm² (3 mm × 4.9 mm) SOIC (D) 14 51.9 mm² (8.65 mm × 6 mm)
  • Rail-to-Rail Input and Output
  • Wide Bandwidth: 3 MHz
  • High Slew Rate: 2.4 V/µs
  • Supply Voltage Range: 2.7 V to 16 V
  • Supply Current: 550 µA/Channel
  • Low-Power Shutdown Mode
    • IDD(SHDN): 25 µA/Channel
  • Input Noise Voltage: 39 nV/√Hz
  • Input Bias Current: 1 pA
  • Specified Temperature Range:
    • −40°C to +125°C (Industrial Grade)
  • Ultra-Small Packaging:
    • 5- or 6-Pin SOT-23 (TLV2370, TLV2371)
    • 8- or 10-Pin MSOP (TLV2372, TLV2373)
  • Rail-to-Rail Input and Output
  • Wide Bandwidth: 3 MHz
  • High Slew Rate: 2.4 V/µs
  • Supply Voltage Range: 2.7 V to 16 V
  • Supply Current: 550 µA/Channel
  • Low-Power Shutdown Mode
    • IDD(SHDN): 25 µA/Channel
  • Input Noise Voltage: 39 nV/√Hz
  • Input Bias Current: 1 pA
  • Specified Temperature Range:
    • −40°C to +125°C (Industrial Grade)
  • Ultra-Small Packaging:
    • 5- or 6-Pin SOT-23 (TLV2370, TLV2371)
    • 8- or 10-Pin MSOP (TLV2372, TLV2373)

The TLV237x single-supply operational amplifiers provide rail-to-rail input and output capability. The TLV237x takes the minimum operating supply voltage down to 2.7 V over the extended industrial temperature range while adding the rail-to-rail output swing feature. The TLV237x also provides 3-MHz bandwidth from only 550 µA. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from (±8-V supplies down to ±1.35 V) a variety of rechargeable cells.

The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making an ideal alternative for the TLC227x in battery-powered applications. The rail-to-rail input stage further increases its versatility. The TLV237x is the seventh member of a rapidly growing number of RRIO products available from TI, and it is the first to allow operation up to 16-V rails with good ac performance.

All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP, and quads in the TSSOP package.

The 2.7-V operation makes the TLV237x compatible with Li-Ion powered systems and the operating supply voltage range of many micro-power microcontrollers available today including TI’s MSP430.

The TLV237x single-supply operational amplifiers provide rail-to-rail input and output capability. The TLV237x takes the minimum operating supply voltage down to 2.7 V over the extended industrial temperature range while adding the rail-to-rail output swing feature. The TLV237x also provides 3-MHz bandwidth from only 550 µA. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from (±8-V supplies down to ±1.35 V) a variety of rechargeable cells.

The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making an ideal alternative for the TLC227x in battery-powered applications. The rail-to-rail input stage further increases its versatility. The TLV237x is the seventh member of a rapidly growing number of RRIO products available from TI, and it is the first to allow operation up to 16-V rails with good ac performance.

All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP, and quads in the TSSOP package.

The 2.7-V operation makes the TLV237x compatible with Li-Ion powered systems and the operating supply voltage range of many micro-power microcontrollers available today including TI’s MSP430.

下載 觀看有字幕稿的影片 影片

技術文件

找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 3
重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 TLV237x 500-µA/Ch, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers With Shutdown datasheet (Rev. F) PDF | HTML 2016/8/1
電子書 The Signal e-book: A compendium of blog posts on op amp design topics PDF | HTML 2017/3/28
應用說明 TLV2370/71/72/73/74/75 EMI Immunity Performance (Rev. A) 2012/11/14

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

AMP-PDK-EVM — 放大器性能開發套件評估模組

放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。

AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:

  • D (SOIC-8 和 SOIC-14)
  • PW (TSSOP-14)
  • DGK (VSSOP-8)
  • DBV (SOT23-5 和 SOT23-6)
  • DCK (SC70-5 和 SC70-6)
使用指南: PDF | HTML
支援產品和硬體
模擬型號

TLV2373 PSpice Model (Rev. B)

SLOC064B.ZIP (38 KB) - PSpice 模型
支援產品和硬體
模擬型號

TLV2373 TINA-TI Reference Design (Rev. A)

SBOM377A.TSC (112 KB) - TINA-TI 參考設計
支援產品和硬體
模擬型號

TLV2373 TINA-TI Spice Model (Rev. A)

SBOM371A.ZIP (6 KB) - TINA-TI Spice 模型
支援產品和硬體
封裝 針腳 CAD 符號、佔位空間與 3D 模型
PDIP (N) 14 Ultra Librarian
VSSOP (DGS) 10 Ultra Librarian
SOIC (D) 14 Ultra Librarian

訂購與品質

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片