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LMZ30604

現行

採用 9x11x2.8mm QFN 封裝的 2.95V 至 6V、4A 降壓電源模組

現在提供此產品的更新版本

open-in-new 比較替代產品
功能相同,但針腳輸出與所比較的裝置不同。
TPSM82810 現行 採用 μSIP 及 MagPack 封裝、具備可調式開關頻率的 4A 降壓模組,輸入電壓範圍為 2.75V 至 6V Newer solution with smaller BOM size, higher efficiency, higher voltage accuracy
功能相似於所比較的產品。
TPSM82864A 現行 採用 3.5-mm x 4-mm QFN 封裝,且具有整合式電感器的 2.4-V 至 5.5-V 輸入、4-A 薄型降壓電源模組 Smaller total BOM size of 35 mm² (saves >80% area) and 4-µA IQ

LMZ30604

現行

產品詳細資料

Rating Catalog Topology Buck, Step-Down Converter, Synchronous Buck Iout (max) (A) 4 Vin (max) (V) 6 Vin (min) (V) 2.95 Vout (max) (V) 3.6 Vout (min) (V) 0.8 Features EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking Operating temperature range (°C) -40 to 125 Type Converter (Integrated Switch), DC/DC converter, Module Duty cycle (max) (%) 91 Control mode Voltage mode Switching frequency (min) (kHz) 400 Switching frequency (max) (kHz) 2000
Rating Catalog Topology Buck, Step-Down Converter, Synchronous Buck Iout (max) (A) 4 Vin (max) (V) 6 Vin (min) (V) 2.95 Vout (max) (V) 3.6 Vout (min) (V) 0.8 Features EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking Operating temperature range (°C) -40 to 125 Type Converter (Integrated Switch), DC/DC converter, Module Duty cycle (max) (%) 91 Control mode Voltage mode Switching frequency (min) (kHz) 400 Switching frequency (max) (kHz) 2000
B1QFN (RKG) 39 99 mm² (11 mm × 9 mm)
  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 9 mm × 11 mm × 2.8 mm package
    - Pin Compatible with LMZ30602 and LMZ30606
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.8 V to 3.6 V, with ±1% Reference Accuracy
  • Adjustable Switching Frequency
    (500 kHz to 2 MHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection
  • Over Temperature Protection
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 12°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ30604 With the WEBENCH® Power Designer
  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 9 mm × 11 mm × 2.8 mm package
    - Pin Compatible with LMZ30602 and LMZ30606
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.8 V to 3.6 V, with ±1% Reference Accuracy
  • Adjustable Switching Frequency
    (500 kHz to 2 MHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection
  • Over Temperature Protection
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 12°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ30604 With the WEBENCH® Power Designer

The LMZ30604 power module is an easy-to-use integrated power solution that combines a 4-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 4-A rated output current at 85°C ambient temperature without airflow.

The LMZ30604 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

The LMZ30604 power module is an easy-to-use integrated power solution that combines a 4-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 4-A rated output current at 85°C ambient temperature without airflow.

The LMZ30604 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 LMZ30604 4-A Power Module With 2.95V-6V Input in QFN Package datasheet (Rev. B) 2018/4/11
應用說明 Introduction to HVDC Architecture and Solutions for Control and Protection (Rev. C) PDF | HTML 2026/5/19
應用說明 Soldering Considerations for Power Modules (Rev. C) PDF | HTML 2024/3/14
選擇指南 Innovative DC/DC Power Modules Selection Guide (Rev. D) 2021/10/14
應用說明 Soldering Requirements for BQFN Packages (Rev. C) 2020/3/5
白皮書 Simplify low EMI design with power modules 2017/11/20
應用說明 Working With QFN Power Modules (Rev. A) 2017/6/8
應用說明 How to Configure LMZ30604 Power Module with Ceramic Capacitor (Rev. A) 2016/11/1
應用說明 Adjusting LMZ3 Output Voltage with LM10010/1 2014/2/11

設計與開發

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開發板

LMZ30606EVM-003 — 2.95V 至 6V、6A 降壓式電源模組評估板

The LMZ30606EVM-003 is a fully assembled and tested circuit for evaluating the LMZ30606. The output voltage can be selected from four preset values using a jumper (3.3V, 2.5V, 1.8V, 1.2V, and 0.8V) and has an adjustable switching frequency of 500 kHz to 1 MHz. Solder pads and jumpers are available (...)
使用指南: PDF
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模擬型號

LMZ30604 PSpice Transient Model

SNVM539.ZIP (133 KB) - PSpice 模型
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模擬型號

LMZ30604 Unencrypted PSpice Transient Model

SNVM793.ZIP (7 KB) - PSpice 模型
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參考設計

TIDA-010011 — 用於保護繼電器處理器模組的高效電源供應架構參考設計

此參考設計展示各種電源架構,可為需要 >1A 負載電流和高效率的應用處理器模組產生多重電壓軌。所需的電源是使用來自背板的 5、12 或 24-V DC 輸入所產生。電源供應器是使用配備整合式 FET 的 DC-DC 轉換器,以及具尺寸整合式電感器的電源模組所產生。此設計採用 HotRod™ 封裝類型,適合需要低 EMI 的應用。此外也最適合設計時間有限的應用。其他功能包括 DDR 終端穩壓器、輸入電源 OR-ing、電壓序列、用於過載保護的 eFuse,以及電壓和負載電流監控。此設計可搭配處理器、數位訊號處理器以及現場可編程邏輯閘陣列使用。已通過輻射發射測試,符合 A 類和 B 要求的 (...)
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封裝 針腳 CAD 符號、佔位空間與 3D 模型
B1QFN (RKG) 39 Ultra Librarian

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