現在提供此產品的更新版本
功能相同,但針腳輸出與所比較的裝置不同。
功能相似於所比較的產品。
LMZ30604
- Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design - 9 mm × 11 mm × 2.8 mm package
- Pin Compatible with LMZ30602 and LMZ30606 - Efficiencies Up To 96%
- Wide-Output Voltage Adjust
0.8 V to 3.6 V, with ±1% Reference Accuracy - Adjustable Switching Frequency
(500 kHz to 2 MHz) - Synchronizes to an External Clock
- Adjustable Slow-Start
- Output Voltage Sequencing / Tracking
- Power Good Output
- Programmable Undervoltage Lockout (UVLO)
- Output Overcurrent Protection
- Over Temperature Protection
- Operating Temperature Range: –40°C to 85°C
- Enhanced Thermal Performance: 12°C/W
- Meets EN55022 Class B Emissions
- Integrated Shielded Inductor - Create a Custom Design Using the LMZ30604 With the WEBENCH® Power Designer
The LMZ30604 power module is an easy-to-use integrated power solution that combines a 4-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.
The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 4-A rated output current at 85°C ambient temperature without airflow.
The LMZ30604 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | LMZ30604 4-A Power Module With 2.95V-6V Input in QFN Package datasheet (Rev. B) | 2018/4/11 | |||
| 應用說明 | Introduction to HVDC Architecture and Solutions for Control and Protection (Rev. C) | PDF | HTML | 2026/5/19 | |||
| 應用說明 | Soldering Considerations for Power Modules (Rev. C) | PDF | HTML | 2024/3/14 | |||
| 選擇指南 | Innovative DC/DC Power Modules Selection Guide (Rev. D) | 2021/10/14 | ||||
| 應用說明 | Soldering Requirements for BQFN Packages (Rev. C) | 2020/3/5 | ||||
| 白皮書 | Simplify low EMI design with power modules | 2017/11/20 | ||||
| 應用說明 | Working With QFN Power Modules (Rev. A) | 2017/6/8 | ||||
| 應用說明 | How to Configure LMZ30604 Power Module with Ceramic Capacitor (Rev. A) | 2016/11/1 | ||||
| 應用說明 | Adjusting LMZ3 Output Voltage with LM10010/1 | 2014/2/11 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
LMZ30606EVM-003 — 2.95V 至 6V、6A 降壓式電源模組評估板
TIDA-010011 — 用於保護繼電器處理器模組的高效電源供應架構參考設計
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| B1QFN (RKG) | 39 | Ultra Librarian |
訂購與品質
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。