LMV7275
- (VS = 1.8 V, TA = 25°C,
Typical Values Unless Specified). - Single or Dual Supplies
- Ultra Low Supply Current 9 µA Per Channel
- Low Input Bias Current 10 nA
- Low Input Offset Current 200 pA
- Low Ensured VOS 4 mV
- Propagation Delay 880 ns (20-mV Overdrive)
- Input Common Mode Voltage Range 0.1 V
Beyond Rails - LMV7272 is Available in DSBGA Package
The LMV727x devices are rail-to-rail input low power comparators, characterized at supply voltages 1.8 V, 2.7 V, and 5 V. They consume as little as 9-µA supply current per channel while achieving a 800-ns propagation delay.
The LMV7271 and LMV7275 (single) are available in SC70 and SOT-23 packages. The LMV7272 (dual) is available in the DSBGA package. With these tiny packages, the PCB area can be significantly reduced. They are ideal for low voltage, low power, and space-critical designs.
The LMV7271 and LMV7272 both feature a push-pull output stage which allows operation with minimum power consumption when driving a load.
The LMV7275 features an open-drain output stage that allows for wired-OR configurations. The open-drain output also offers the advantage of allowing the output to be pulled to any voltage up to 5.5 V, regardless of the supply voltage of the LMV7275, which is useful for level-shifting applications.
The LMV727x devices are built with Texas Instruments advance submicron silicon-gate BiCMOS process. They all have bipolar inputs for improved noise performance, and CMOS outputs for rail-to-rail output swing.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | LMV727x Single and Dual, 1.8-V Low Power Comparators With Rail-to-Rail Input datasheet (Rev. I) | PDF | HTML | 2015/9/3 | ||
| 應用說明 | Nano-Power Battery Monitoring in Personal Electronics | 2017/12/8 | ||||
| 電子書 | The Signal e-book: A compendium of blog posts on op amp design topics | PDF | HTML | 2017/3/28 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOT-SC70 (DCK) | 5 | Ultra Librarian |
| SOT-23 (DBV) | 5 | Ultra Librarian |
訂購與品質
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。