產品詳細資料

Number of channels 2 Rating Automotive Forward/reverse channels 1 forward / 1 reverse Integrated isolated power No Isolation rating Basic, Reinforced Default output High, Low Data rate (max) (Mbps) 100 Protocols GPIO, PWM, UART Surge isolation voltage (VIOSM) (VPK) 10000, 12800 Transient isolation voltage (VIOTM) (VPK) 4242, 7071, 8000 Withstand isolation voltage (VISO) (Vrms) 3000, 5000 CMTI (min) (V/µs) 85000 Operating temperature range (°C) -40 to 125 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.25 Propagation delay time (typ) (µs) 0.0107, 0.011 Current consumption per channel (DC) (typ) (mA) 1 Current consumption per channel (1 Mbps) (typ) (mA) 1.6 Creepage (min) (mm) 4, 8, 8.5 Clearance (min) (mm) 4, 8, 8.5 TI functional safety category Functional Safety-Capable
Number of channels 2 Rating Automotive Forward/reverse channels 1 forward / 1 reverse Integrated isolated power No Isolation rating Basic, Reinforced Default output High, Low Data rate (max) (Mbps) 100 Protocols GPIO, PWM, UART Surge isolation voltage (VIOSM) (VPK) 10000, 12800 Transient isolation voltage (VIOTM) (VPK) 4242, 7071, 8000 Withstand isolation voltage (VISO) (Vrms) 3000, 5000 CMTI (min) (V/µs) 85000 Operating temperature range (°C) -40 to 125 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.25 Propagation delay time (typ) (µs) 0.0107, 0.011 Current consumption per channel (DC) (typ) (mA) 1 Current consumption per channel (1 Mbps) (typ) (mA) 1.6 Creepage (min) (mm) 4, 8, 8.5 Clearance (min) (mm) 4, 8, 8.5 TI functional safety category Functional Safety-Capable
SOIC (D) 8 29.4 mm² 4.9 x 6 SOIC (DW) 16 106.09 mm² 10.3 x 10.3 SOIC (DWV) 8 67.275 mm² 5.85 x 11.5
  • Qualified for automotive applications
  • AEC-Q100 qualified With the following results:
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature range
    • Device HBM ESD classification level 3A
    • Device CDM ESD classification level C6
  • Functional Safety-Capable
  • 100 Mbps data rate
  • Robust isolation barrier:
    • >30-Year projected lifetime at 1.5 kVRMS working voltage
    • Up to 5000 VRMS Isolation Rating
    • Up to 12.8 kV surge capability
    • ±100 kV/µs Typical CMTI
  • Wide supply range: 2.25 V to 5.5 V
  • 2.25-V to 5.5-V level translation
  • Default output High (ISO772x) and Low (ISO772xF) Options
  • Low power consumption, typical 1.7 mA per channel at 1 Mbps
  • Low propagation delay: 11 ns typical
  • Robust electromagnetic compatibility (EMC)
    • System-Level ESD, EFT, and surge immunity
    • ±8 kV IEC 61000-4-2 contact discharge protection across isolation barrier
    • Low emissions
  • Wide-SOIC (DW-16, DWV-8) and Narrow-SOIC (D-8) package options
  • Safety-related Certifications
    • VDE reinforced insulation per DIN EN IEC 60747-17 (VDE 0884-17)
    • UL 1577 component recognition program
    • IEC 62368-1, IEC 61010-1, IEC 60601-1 and GB 4943.1 certifications
  • Qualified for automotive applications
  • AEC-Q100 qualified With the following results:
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature range
    • Device HBM ESD classification level 3A
    • Device CDM ESD classification level C6
  • Functional Safety-Capable
  • 100 Mbps data rate
  • Robust isolation barrier:
    • >30-Year projected lifetime at 1.5 kVRMS working voltage
    • Up to 5000 VRMS Isolation Rating
    • Up to 12.8 kV surge capability
    • ±100 kV/µs Typical CMTI
  • Wide supply range: 2.25 V to 5.5 V
  • 2.25-V to 5.5-V level translation
  • Default output High (ISO772x) and Low (ISO772xF) Options
  • Low power consumption, typical 1.7 mA per channel at 1 Mbps
  • Low propagation delay: 11 ns typical
  • Robust electromagnetic compatibility (EMC)
    • System-Level ESD, EFT, and surge immunity
    • ±8 kV IEC 61000-4-2 contact discharge protection across isolation barrier
    • Low emissions
  • Wide-SOIC (DW-16, DWV-8) and Narrow-SOIC (D-8) package options
  • Safety-related Certifications
    • VDE reinforced insulation per DIN EN IEC 60747-17 (VDE 0884-17)
    • UL 1577 component recognition program
    • IEC 62368-1, IEC 61010-1, IEC 60601-1 and GB 4943.1 certifications

The ISO772x-Q1 devices are high-performance, dual-channel digital isolators with 5000 VRMS (DW and DWV packages) and 3000 VRMS (D package) isolation ratings per UL 1577. This family includes devices with reinforced insulation ratings according to VDE, CSA, TUV and CQC.

The ISO772x-Q1 devices provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by a double capacitive silicon dioxide (SiO2) insulation barrier. The ISO7720-Q1 device has both channels in the same direction while the ISO7721-Q1 device has both channels in the opposite direction. In the event of input power or signal loss, the default output is high for devices without suffix F and low for devices with suffix F. See the Device Functional Modes section for further details.

Used in conjunction with isolated power supplies, these devices help prevent noise currents on data buses, such as CAN and LIN, from damaging sensitive circuitry. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO772x-Q1 devices has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO772x-Q1 family of devices is available in 16-pin SOIC wide-body (DW), 8-pin SOIC wide-body (DWV), and 8-pin SOIC narrow-body (D) packages.

The ISO772x-Q1 devices are high-performance, dual-channel digital isolators with 5000 VRMS (DW and DWV packages) and 3000 VRMS (D package) isolation ratings per UL 1577. This family includes devices with reinforced insulation ratings according to VDE, CSA, TUV and CQC.

The ISO772x-Q1 devices provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by a double capacitive silicon dioxide (SiO2) insulation barrier. The ISO7720-Q1 device has both channels in the same direction while the ISO7721-Q1 device has both channels in the opposite direction. In the event of input power or signal loss, the default output is high for devices without suffix F and low for devices with suffix F. See the Device Functional Modes section for further details.

Used in conjunction with isolated power supplies, these devices help prevent noise currents on data buses, such as CAN and LIN, from damaging sensitive circuitry. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO772x-Q1 devices has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO772x-Q1 family of devices is available in 16-pin SOIC wide-body (DW), 8-pin SOIC wide-body (DWV), and 8-pin SOIC narrow-body (D) packages.

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技術文件

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類型 標題 日期
* Data sheet ISO772x-Q1 High-Speed, Robust EMC, Reinforced Dual-Channel Digital Isolators datasheet (Rev. C) PDF | HTML 2024年 12月 13日
Technical article Why signal isolation matters in 48-V HEV/EV systems (Rev. A) PDF | HTML 2025年 11月 10日
White paper Improve Your System Performance by Replacing Optocouplers with Digital Isolators (Rev. D) PDF | HTML 2025年 11月 7日
Certificate CSA Certificate for ISO77xxDW (Rev. B) (Rev. B) 2025年 10月 15日
Certificate VDE Certificate for Reinforced Isolation for DIN EN IEC 60747-17 (Rev. Y) 2025年 9月 22日
Certificate UL Certificate of Compliance File E181974 Vol 4 Sec 6 (Rev. R) 2025年 9月 8日
Certificate CSA Certificate for ISO77xxD (Rev. A) 2025年 8月 20日
Certificate CSA Certificate for ISO77xxDWV (Rev. A) 2025年 8月 20日
Certificate CQC Certificate for ISOxxD (Rev. B) 2025年 8月 19日
Certificate CQC Certificate for ISOxxDWV (Rev. B) 2025年 8月 19日
Certificate CQC Certificate for ISOxxDWx (Rev. K) 2025年 8月 18日
Certificate TUV Certificate for Isolation Devices (Rev. L) 2025年 8月 15日
Application note IEC60601-1-2 Compliant Dig. Iso Design W/ 16-kV Contact Discharge ESD Protection PDF | HTML 2023年 2月 16日
White paper Why are Digital Isolators Certified to Meet Electrical Equipment Standards? 2021年 11月 16日
White paper Distance Through Insulation: How Digital Isolators Meet Certification Requiremen PDF | HTML 2021年 6月 11日
Application brief How to Replace Optocouplers with Digital Isolators in Standard Interface Circuit (Rev. A) PDF | HTML 2021年 5月 19日
Functional safety information ISO7721-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA 2020年 3月 17日
User guide ISO77xxD Single- and Dual-Digital Isolator Evaluation Module (Rev. A) 2019年 2月 25日
Application brief Considerations for Selecting Digital Isolators 2018年 7月 24日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

DIGI-ISO-EVM — 通用數位隔離器評估模組

DIGI-ISO-EVM 是一款評估模組 (EVM),可評估任何 TI 單通道、雙通道、三通道、四通道或六通道數位隔離器裝置,並提供五種不同封裝 - 8 接腳窄體 SOIC (D)、8 接腳寬體 SOIC (DWV)、16 接腳寬體 SOIC (DWW)、16 接腳超寬體 SOIC (DWW) 和 16 接腳 (DBQ) 封裝。EVM 具備足夠 Berg 接腳選項,可用於評估具最少外部零組件的裝置。

使用指南: PDF | HTML
TI.com 無法提供
開發板

ISO7721DEVM — EMC 性能優異的 D 封裝 ISO7721 高速雙通道數位隔離器評估模組

ISO7721DEVM 是一款評估模組 (EVM),用於評估採用 8 腳窄體 SOIC 封裝(封裝代碼為 D)的 ISO7721 高性能強化型雙通道數位隔離器。EVM 具備足夠的測試點和跨接器選項,可用於評估具最少外部零組件的裝置。
使用指南: PDF
TI.com 無法提供
開發板

ISO7741EVM — EMC 性能優異的 ISO7741 高速四通道數位隔離器評估模組

ISO7741EVM 是用於評估 ISO7741 的評估模組 (EVM)。ISO7741 是一款高性能、強化型四通道數位隔離器,並採用寬體 SOIC 封裝(封裝代碼 DW)。EVM 具備足夠的測試點和跨接器選項,可用於評估具最少外部零組件的裝置。
使用指南: PDF
TI.com 無法提供
模擬型號

ISO7721 IBIS Model (Rev. B)

SLLM332B.ZIP (52 KB) - IBIS Model
模擬型號

ISO7721 PSpice Transient Model

SLLM474.ZIP (183 KB) - PSpice Model
參考設計

TIDA-01605 — 具有二級關閉保護功能的車用雙通道 SiC MOSFET 閘極驅動器參考設計

此參考設計是一種符合車用資格的隔離式閘極驅動器解決方案,適用於在半橋配置中驅動碳化矽 (SiC) MOSFET。此設計包含兩個分別用於雙通道隔離式閘極驅動器的推拉式偏壓電源,其中每個電源提供 +15V 和 -4V 輸出電壓以及 1W 輸出功率。閘極驅動器可提供 4A 源極和 6A 汲極峰值電流。此驅動器採用強化型隔離,可承受 8kV 峰值隔離電壓和 5.7kV RMS 隔離電壓以及 > 100V/ns 共模暫態抗擾度 (CMTI)。此參考設計包含兩階關斷電路,可在短路情況下保護 MOSFET 免受電壓過衝的影響。DESAT 偵測閾值和第二級關斷延遲時間是可配置的。此設計採用 (...)
Design guide: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
SOIC (D) 8 Ultra Librarian
SOIC (DW) 16 Ultra Librarian
SOIC (DWV) 8 Ultra Librarian

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  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

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