FDC2212-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to +125°C ambient operating temperature range
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- EMI-resistant architecture
- Maximum output rates (one active channel):
- 13.3kSPS (FDC2112-Q1, FDC2114-Q1)
- 4.08kSPS (FDC2212-Q1, FDC2214-Q1)
- Maximum input capacitance: 250nF (at 10kHz with 1mH inductor)
- Sensor excitation frequency: 10kHz to 10MHz
- Number of channels: 2, 4
- Resolution: up to 28 bits
- RMS noise: 0.3fF at 100SPS and fSENSOR = 5MHz
- Supply voltage: 2.7V to 3.6V
- power consumption: active: 2.1mA
- Low-power sleep mode: 35µA
- Shutdown: 200nA
- Interface: I2C
- Temperature range: –40°C to +125°C
Capacitive sensing is a low-power, high-resolution contactless sensing technique that can be applied to a variety of applications ranging from proximity detection to gesture recognition. The sensor in a capacitive sensing system is any metal or conductor, allowing for highly flexible system design.
The main challenge limiting sensitivity in capacitive sensing applications is noise susceptibility of the sensors. With the FDC2x1x-Q1 resonant sensing architecture, performance can be maintained even in presence of fluorescent light.
The FDC2x1x-Q1 is a multi-channel family of high-resolution, high-speed capacitance-to-digital converters for implementing capacitive sensing solutions. The devices employ an innovative narrow-band based architecture to offer high rejection of noise while providing high resolution at high speed. The devices support a wide excitation frequency range, offering flexibility in system design.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 日期 |
|---|---|---|---|---|
| * | Data sheet | FDC2x1x-Q1 Multi-Channel, High Resolution Capacitance-to-Digital Converter for Capacitive Sensing Applications datasheet (Rev. A) | 2024年 10月 10日 | |
| Application note | Common Inductive and Capacitive Sensing Applications (Rev. B) | PDF | HTML | 2021年 6月 22日 | |
| Application note | Simulate Inductive Sensors Using FEMM (Finite Element Method Magnetics) (Rev. A) | PDF | HTML | 2021年 6月 16日 | |
| Application note | Capacitive Proximity Sensing Using FDC2x1y (Rev. A) | 2017年 10月 20日 | ||
| Application note | Ground Shifting in Capacitive Sensing Applications | PDF | HTML | 2016年 5月 27日 | |
| Application note | Power Consumption Analysis for Low Power Capacitive Sensing Applications | PDF | HTML | 2016年 1月 18日 | |
| Application note | Derivative Integration Algorithm for Proximity Sensing | 2015年 9月 29日 | ||
| Application note | Capacitive Sensing: Direct vs Remote Liquid Level Sensing Performance Analysis (Rev. A) | 2015年 7月 24日 |
設計與開發
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- 在 PCB 電容感測器與 FDC2214 之間
- FDC2214 和 MSP430 介面之間
第一個穿孔可讓使用者選擇從模組中拆下 PCB 線圈,並使用自訂感測器線圈進行實驗,第二個穿孔則可讓使用者將 FDC2214 和感測器線圈連接至不同的微控制器系統,或在單一系統中使用多個感測器。隨附的 GUI (...)
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支援產品和硬體
TIDA-01409 — 車用電容式腳踢開啟參考設計
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| WSON (DNT) | 12 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。