TS3A27518E-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 2: –40°C to 105°C ambient operating temperature range
- Device HBM ESD classification level H2
- Device CDM ESD classification level C3B
- Functional Safety-Capable
- 1.65-V to 3.6-V single-supply operation
- Powered-off protection (isolation in powerdown mode, Hi-Z when V+ = 0)
- Low capacitance switches, 21.5 pF (typical)
- Bandwidth up to 240 MHz for high-speed rail-to-rail signal handling
- Crosstalk and off isolation of −62 dB
- 1.8-V logic threshold compatibility for control inputs
- 3.6-V tolerant control inputs
- ESD performance: NC/NO ports
- ±6-kV contact discharge (IEC 61000-4-2)
- 24-pin TSSOP (7.80 mm × 4.40 mm) and 24-pin QFN (4.00 mm × 4.00 mm) package
The TS3A27518E-Q1 is a 6-bit 1-of-2 multiplexer-demultiplexer designed to operate from 1.65 V to 3.6 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction. The TS3A27518E-Q1 has two control pins, each controlling three 1-of-2 muxes at the same time, and an enable pin that is used to put all outputs in high-impedance mode. The control pins are compatible with 1.8-V logic thresholds and are backward compatible with 2.5-V and 3.3-V logic thresholds as well.
The TS3A27518E-Q1 allows any SD, SDIO, and multimedia card host controllers to be expanded out to multiple cards or peripherals because the SDIO interface consists of 6-bits: CMD, CLK, and Data[0:3] signals. The TS3A27518E-Q1 has two control pins that give additional flexibility to the user, for example, the ability to mux two different audio-video signals in equipment such as an LCD television, an LCD monitor, or a notebook docking station.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 |
|---|---|---|---|---|---|
| * | 데이터 시트 | TS3A27518E-Q1 6-bit, 1-of-2 Multiplexer or Demultiplexer With Integrated IEC L-4 ESD and 1.8-V Logic Compatible Control Inputs datasheet (Rev. D) | PDF | HTML | 2022. 10. 3 | |
| Product overview | How to Communicate I2S Signals Between MCU, DSPs, & Amplifiers Using Multiplexer (Rev. A) | PDF | HTML | 2023. 6. 23 | ||
| 기능 안전 정보 | TS3A27518E-Q1 Functional Safety FIT Rate, FMD and Pin FMA | PDF | HTML | 2022. 9. 28 | ||
| 애플리케이션 노트 | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022. 6. 2 | ||
| 애플리케이션 노트 | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021. 12. 1 | ||
| Application brief | Enabling SPI-Based Flash Memory Expansion by Using Multiplexers (Rev. B) | PDF | HTML | 2021. 10. 7 | ||
| Application brief | Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) | PDF | HTML | 2021. 1. 6 | ||
| 추가 자료 | Automotive Logic Devices Brochure | 2014. 8. 27 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
EVM-LEADED1 보드를 사용하면 TI의 공통 리드가 있는 패키지를 브레드보드 방식으로 빠르게 테스트할 수 있습니다. 이 보드에는 TI의 D, DBQ, DCT, DCU, DDF, DGS, DGV 및 PW 표면 실장 패키지를 100mil DIP 헤더로 변환할 수 있는 풋프린트가 있습니다.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| WQFN (RTW) | 24 | Ultra Librarian |
| TSSOP (PW) | 24 | Ultra Librarian |
주문 및 품질
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.