TLV342S
- 1.8V and 5V performance
- Low offset (A grade)
- 1.25mV maximum (25°C)
- 1.7mV maximum (–40°C to 125°C)
- Rail-to-rail output swing
- Wide common-mode input voltage range: –0.2V to (V+ – 0.5V)
- Input bias current: 1pA (typical)
- Input offset voltage: 0.3mV (typical)
- Low supply current: 70µA/channel
- Low shutdown current: 10pA (typical) per channel
- Gain bandwidth: 2.3MHz (typical)
- Slew rate: 0.9V/µs (typical)
- Turnon time from shutdown: 5µs (typical)
- Input referred voltage noise (at 10kHz): 20nV/√ Hz
- ESD protection exceeds JESD 22:
- 2000V Human-Body Model (HBM)
- 750V Charged-device model (CDM)
The TLV34xx devices are single and dual CMOS operational amplifiers, respectively, with low-voltage, low-power, and rail-to-rail output swing capabilities. The PMOS input stage offers an ultra-low input bias current of 1pA (typical) and an offset voltage of 0.3mV (typical). For applications requiring excellent dc precision, the A grade (TLV34xA) has a low offset voltage of 1.25mV (maximum) at 25°C.
These single-supply amplifiers are designed specifically for ultra-low-voltage (1.5V to 5V) operation, with a common-mode input voltage range that typically extends from –0.2V to 0.5V from the positive supply rail.
The TLV341 (single) and TLV342 (dual) in the RUG package also offer a shutdown (SHDN) pin that can be used to disable the device. In shutdown mode, the supply current is reduced to 45pA (typical). Offered in both the SOT-23 and smaller SC70 packages, the TLV341 is an excellent choice for the most space-constrained applications. The dual TLV342 is offered in the standard SOIC, VSSOP, and X2QFN packages.
An extended industrial temperature range from –40°C to 125°C makes the TLV34xx flexible for use in a wide variety of commercial and industrial applications.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 | |
|---|---|---|---|---|---|---|
| * | 데이터 시트 | TLV34xx Low-Voltage Rail-to-Rail Output CMOS Operational Amplifiers With Shutdown datasheet (Rev. E) | PDF | HTML | 2025. 6. 30 | ||
| e북 | The Signal e-book: A compendium of blog posts on op amp design topics | PDF | HTML | 2017. 3. 28 |
설계 및 개발
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SMALL-AMP-DIP-EVM — 소형 패키지를 갖춘 연산 증폭기용 평가 모듈
SMALL-AMP-DIP-EVM은 여러 업계 표준 소형 패키지와 빠르고 쉬운 인터페이스를 통해 소형 패키지 연산 증폭기 프로토타입 제작 속도를 높여줍니다. SMALL-AMP-DIP-EVM은 DPW-5(X2SON), DSG-8(WSON), DCN-8(SOT), DDF-8(SOT), RUG-10(X2QFN), RUC-14(X2QFN), RGY-14(VQFN) 및 RTE-16(WQFN)을 포함한 8가지 소형 패키지 옵션을 지원합니다.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| X2QFN (RUG) | 10 | Ultra Librarian |