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CPU 1 Arm Cortex-A8 Frequency (MHz) 800, 1000 Display type 2 LCD Protocols Ethernet Hardware accelerators Image video accelerator Operating system Linux, RTOS Security Cryptographic acceleration Rating Catalog Power supply solution TPS650250, TPS65216 Operating temperature range (°C) -40 to 105
CPU 1 Arm Cortex-A8 Frequency (MHz) 800, 1000 Display type 2 LCD Protocols Ethernet Hardware accelerators Image video accelerator Operating system Linux, RTOS Security Cryptographic acceleration Rating Catalog Power supply solution TPS650250, TPS65216 Operating temperature range (°C) -40 to 105
FCCSP (CBP) 515 144 mm² (12 mm × 12 mm) FCCSP (CBC) 515 196 mm² (14 mm × 14 mm) FCCSP (CUS) 423 256 mm² (16 mm × 16 mm)
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

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기술 자료

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16개 모두 보기
상위 문서 유형 직함 형식 옵션 최신 영어 버전 다운로드 날짜
* 데이터 시트 DM3730, DM3725 Digital Media Processors datasheet (Rev. D) 2011. 4. 11
* 정오표 DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) 2014. 2. 13
애플리케이션 노트 OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles PDF | HTML 2019. 3. 20
기술 문서 Spring has sprung. A sale has sprung. PDF | HTML 2016. 4. 4
사용 설명서 AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 2012. 9. 10
사용 설명서 Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 2012. 9. 10
추가 자료 DM37x Design Network Partners 2012. 6. 5
애플리케이션 노트 Introduction to TMS320C6000 DSP Optimization 2011. 10. 6
애플리케이션 노트 PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 2011. 6. 15
애플리케이션 노트 PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 2010. 6. 23
애플리케이션 노트 PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 2010. 6. 23
애플리케이션 노트 AM/DM37x Power Estimation Spreadsheet 2010. 6. 7
애플리케이션 노트 AM/DM37x Overview 2010. 6. 3
애플리케이션 노트 Setting up AM37x SDRC Registers 2010. 6. 3
애플리케이션 노트 AM37x CUS Routing Guidelines 2010. 6. 3
애플리케이션 노트 AM3715/03 Memory Subsystem 2010. 6. 3

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

디버그 프로브

TMDSEMU200-U — XDS200 USB 디버그 프로브

XDS200은 TI 임베디드 장치를 디버깅하는 데 사용되는 디버그 프로브(에뮬레이터)입니다. 대부분의 장치의 경우 더욱 저렴한 신형 XDS110(www.ti.com/tool/TMDSEMU110-U)을 사용하실 것을 권장합니다. XDS200은 단일 포드에서 다양한 표준(IEEE1149.1, IEEE1149.7, SWD)을 지원합니다. 모든 XDS 디버그 프로브는 ETB(임베디드 트레이스 버퍼)가 포함되어 있는 모든 Arm® 및 DSP 프로세서에서 코어 및 시스템 트레이스를 지원합니다.

XDS200은 TI 20핀 커넥터(TI 14핀, (...)

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TMDSEMU560V2STM-U — XDS560™ 소프트웨어 v2 시스템 추적 USB 디버그 프로브

XDS560v2는 디버그 프로브의 XDS560™ 제품군 중 최고의 성능을 가진 제품으로, 기존의 JTAG 표준(IEEE1149.1)과 cJTAG(IEEE1149.7)를 모두 지원합니다.  SWD(직렬 와이어 디버그)는 지원하지 않습니다.

모든 XDS 디버그 프로브는 ETB(임베디드 추적 버퍼)가 있는 모든 ARM 및 DSP 프로세서에서 코어와 시스템 트레이스를 지원합니다.  핀을 통한 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

XDS560v2는 MIPI HSPT 60핀 커넥터(TI 14핀, TI 20핀 및 ARM (...)

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TMDSEMU560V2STM-UE — XDS560v2 시스템 추적 USB 및 이더넷 디버그 프로브

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

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소프트웨어 개발 키트(SDK)

ANDROIDEVKIT-FROYO — Android FROYO - Dev Kit for DM37x (TI_Android_DevKit/02_02_00)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

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소프트웨어 개발 키트(SDK)

ANDROIDEVKIT-GINGERBREAD — Android GINGERBREAD 2.3 - Dev Kit for DM37x (TI_Android_GingerBread_2_3_DevKit_1_0)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

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소프트웨어 개발 키트(SDK)

LINUXDVSDK-DM37X — DM3730/3725 디지털 미디어 프로세서용 DVSDK(Linux 디지털 비디오 소프트웨어 개발 키트)

The Linux Digital Video Software Development Kit (DVSDK) for DaVinci™ processors provides everything developers need to evaluate and start developing on the DM37x Cortex™-A8 DSP+ARM® microprocessors. With the included Graphical User Interface (GUI)-based Matrix Application Launcher, launching (...)

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소프트웨어 프로그래밍 도구

FLASHTOOL — FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices

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시뮬레이션 모델

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507 (9 KB) - BSDL 모델
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AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS 모델
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AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL 모델
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AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS 모델
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AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL 모델
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AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS 모델
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패키지 CAD 기호, 풋프린트 및 3D 모델
FCCSP (CBP) 515 Ultra Librarian
FCCSP (CBC) 515 Ultra Librarian
FCCSP (CUS) 423 Ultra Librarian

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