Produktdetails

CPU 1 Arm Cortex-A8 Frequency (MHz) 800, 1000 Display type 2 LCD Protocols Ethernet Hardware accelerators Image video accelerator Operating system Linux, RTOS Security Cryptographic acceleration Rating Catalog Power supply solution TPS650250, TPS65216 Operating temperature range (°C) -40 to 105
CPU 1 Arm Cortex-A8 Frequency (MHz) 800, 1000 Display type 2 LCD Protocols Ethernet Hardware accelerators Image video accelerator Operating system Linux, RTOS Security Cryptographic acceleration Rating Catalog Power supply solution TPS650250, TPS65216 Operating temperature range (°C) -40 to 105
FCCSP (CBP) 515 144 mm² (12 mm × 12 mm) FCCSP (CBC) 515 196 mm² (14 mm × 14 mm) FCCSP (CUS) 423 256 mm² (16 mm × 16 mm)
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Neueste englische Version herunterladen Datum
* Datenblatt DM3730, DM3725 Digital Media Processors datasheet (Rev. D) 11.04.2011
* Errata DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) 13.02.2014
Anwendungshinweis OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles PDF | HTML 20.03.2019
Technischer Artikel Spring has sprung. A sale has sprung. PDF | HTML 04.04.2016
Benutzerhandbuch AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 10.09.2012
Benutzerhandbuch Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 10.09.2012
Weitere Dokumente DM37x Design Network Partners 05.06.2012
Anwendungshinweis Introduction to TMS320C6000 DSP Optimization 06.10.2011
Anwendungshinweis PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 15.06.2011
Anwendungshinweis PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 23.06.2010
Anwendungshinweis PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 23.06.2010
Anwendungshinweis AM/DM37x Power Estimation Spreadsheet 07.06.2010
Anwendungshinweis AM/DM37x Overview 03.06.2010
Anwendungshinweis Setting up AM37x SDRC Registers 03.06.2010
Anwendungshinweis AM37x CUS Routing Guidelines 03.06.2010
Anwendungshinweis AM3715/03 Memory Subsystem 03.06.2010

Design und Entwicklung

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Debug-Tastkopf

TMDSEMU200-U — XDS200-USB-Debug-Tastkopf

Der XDS200 ist ein Debug-Tastkopf (Emulator) zum Debugging von Embedded-Bausteinen von TI. Für die meisten Bausteine wird die Verwendung der neueren, kostengünstigeren XDS110 (www.ti.com/tool/TMDSEMU110-U) empfohlen. Der XDS200 unterstützt eine große Zahl von Standards (IEEE1149.1, IEEE1149.7, SWD) (...)

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TMDSEMU560V2STM-U — XDS560™-Software v2 – System-Trace-USB-Debug-Sonde

XDS560v2 ist die Debug-Sonde mit der höchsten Leistung der XDS560™-Produktfamilie und unterstützt sowohl den herkömmlichen JTAG-Standard (IEEE1149.1) als auch cJTAG (IEEE1149.7).  Beachten Sie, dass das Serial Wire Debugging (SWD) nicht unterstützt wird.

Alle XDS-Debug-Sonden unterstützen Core- und (...)

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TMDSEMU560V2STM-UE — XDS560v2 System-Trace-USB-und Ethernet-Debug-Tastkopf

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

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Software-Entwicklungskit (SDK)

ANDROIDEVKIT-FROYO — Android FROYO - Dev Kit for DM37x (TI_Android_DevKit/02_02_00)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

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Software-Entwicklungskit (SDK)

ANDROIDEVKIT-GINGERBREAD — Android GINGERBREAD 2.3 - Dev Kit for DM37x (TI_Android_GingerBread_2_3_DevKit_1_0)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

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Software-Entwicklungskit (SDK)

LINUXDVSDK-DM37X — Linux Digital Video Software Development Kit (DVSDK) für die Digitalmedienprozessoren DM3730/3725

The Linux Digital Video Software Development Kit (DVSDK) for DaVinci™ processors provides everything developers need to evaluate and start developing on the DM37x Cortex™-A8 DSP+ARM® microprocessors. With the included Graphical User Interface (GUI)-based Matrix Application Launcher, launching (...)

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Software-Programmiertool

FLASHTOOL — FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices

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Simulationsmodell

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507 (9 KB) - BSDL-Modell
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AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS-Modell
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AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL-Modell
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AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS-Modell
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AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL-Modell
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AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS-Modell
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Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
FCCSP (CBP) 515 Ultra Librarian
FCCSP (CBC) 515 Ultra Librarian
FCCSP (CUS) 423 Ultra Librarian

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