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CSD97395Q4M

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CSD97395Q4M NexFET™-Leistungsstufe für synchrone Abwärtswandler mit hoher Frequenz

Produktdetails

Rating Catalog VDS (V) 30 Ploss current (A) 15 Features Ultra-low inductance package Operating temperature range (°C) -40 to 150
Rating Catalog VDS (V) 30 Ploss current (A) 15 Features Ultra-low inductance package Operating temperature range (°C) -40 to 150
VSON-CLIP (DPC) 8 15.75 mm² (4.5 mm × 3.5 mm)
  • Over 92% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A, Peak 60 A
  • High Frequency Operation (up to 2 MHz)
  • High Density – SON 3.5 mm × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System-Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode With FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootsrap Diode
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free
  • Over 92% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A, Peak 60 A
  • High Frequency Operation (up to 2 MHz)
  • High Density – SON 3.5 mm × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System-Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode With FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootsrap Diode
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free

The CSD97395Q4M NexFET7trade; Power Stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

The CSD97395Q4M NexFET7trade; Power Stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

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Technische Dokumentation

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Top-Dokumentation Typ Titel Format-Optionen Neueste englische Version herunterladen Datum
* Datenblatt CSD97395Q4M Synchronous Buck NexFET Power Stage datasheet (Rev. A) PDF | HTML 31.03.2015
Technischer Artikel How to create a power supply for Intel’s Braswell processor PDF | HTML 10.08.2015

Design und Entwicklung

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Simulationsmodell

CSD97395Q4M PSpice Transient Model

SLPM279.ZIP (56 KB) - PSpice-Modell
Unterstützte Produkte und Hardware
Simulationsmodell

CSD97395Q4M TINA-TI Reference Design

SLPM278.TSC (316 KB) - TINA-TI-Referenzdesign
Unterstützte Produkte und Hardware
Simulationsmodell

CSD97395Q4M TINA-TI Transient Spice Model

SLPM280.ZIP (53 KB) - TINA-TI Spice-Modell
Unterstützte Produkte und Hardware
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VSON-CLIP (DPC) 8 Ultra Librarian

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