产品详情

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Stereo Control interface Hardware Output power (W) 0.3 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) to
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Stereo Control interface Hardware Output power (W) 0.3 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) to
SOIC (D) 8 29.4 mm² 4.9 x 6
  • 300-mW Stereo Output
  • PC Power Supply Compatibility 5-V and 3.3-V Specified Operation
  • Shutdown Control
  • Internal Midrail Generation
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
  • Functional Equivalent of the LM4880
  • 300-mW Stereo Output
  • PC Power Supply Compatibility 5-V and 3.3-V Specified Operation
  • Shutdown Control
  • Internal Midrail Generation
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
  • Functional Equivalent of the LM4880

The TPA302 is a stereo audio power amplifier capable of delivering 250 mW of continuous average power into an 8- loads, the TPA302 delivers 60 mW of continuous average power at less than 0.06% THD+N. The amplifier features a shutdown function for power-sensitive applications as well as internal thermal and short-circuit protection. The amplifier is available in an 8-pin SOIC (D) package that reduces board space and facilitates automated assembly.

The TPA302 is a stereo audio power amplifier capable of delivering 250 mW of continuous average power into an 8- loads, the TPA302 delivers 60 mW of continuous average power at less than 0.06% THD+N. The amplifier features a shutdown function for power-sensitive applications as well as internal thermal and short-circuit protection. The amplifier is available in an 8-pin SOIC (D) package that reduces board space and facilitates automated assembly.

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* 数据表 TPA302: 300-mW Stereo Audio Power Amplifier 数据表 (Rev. C) 2004年 6月 24日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训