20-pin (J) package image

5962-8515518RA 不推荐用于新设计

高性能 Impact X PAL 电路

不推荐用于新设计 barcode 批次/生产日期 可提供批次和生产日期代码选项

定价

数量 价格
+

质量信息

等级 Military
RoHS
REACH 受影响
引脚镀层/焊球材料 SNPB
MSL 等级/回流焊峰值温度 N/A for Pkg Type
质量、可靠性
和封装信息

包含信息:

  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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更多制造信息

包含信息:

  • 制造厂地点
  • 封装厂地点
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出口管制分类

*仅供参考

  • 美国 ECCN:3A001A2C

更多 TIBPAL16R8-10M 信息

封装信息

封装 | 引脚 CDIP (J) | 20
工作温度范围 (°C) -55 to 125
包装数量 | 包装 20 | TUBE

TIBPAL16R8-10M 的特性

  • High-Performance Operation:
    • fmax (no feedback)
      • TIBPAL16R’-7C Series . . . 100 MHz Min
      • TIBPAL16R’-10M Series . . . 62.5 MHz Min
    • fmax (internal feedback)
      • TIBPAL16R’-7C Series . . . 100 MHz Min
      • TIBPAL16R’-10M Series . . . 62.5 MHz Min
    • fmax (external feedback)
      • TIBPAL16R’-7C Series . . . 74 MHz Min
      • TIBPAL16R’-10M Series . . . 52.5 MHz Min
    • Propagation Delay
      • TIBPAL16L’-7C Series . . . 7 ns Max
      • TIBPAL16L’-10M Series . . . 10 ns Max
  • Functionally Equivalent, but Faster than, Existing 20-Pin PLDs
  • Preload Capability on Output Registers Simplifies Testing
  • Power-Up Clear on Registered Devices (All Register Outputs are Set Low, but Voltage Levels at the Output Pins Go High)
  • Package Options Include Both Plastic and Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
  • Security Fuse Prevents Duplication
  • Dependable Texas Instruments Quality and Reliability
DEVICE
I
INPUTS
3-STATE
O OUTPUTS
REGISTERED
Q OUTPUTS
I/O
PORT
S
PAL16L8 10 2 0 6
PAL16R4 8 0 4 (3-state buffers) 4
PAL16R6 8 0 6 (3-state buffers) 2
PAL16R8 8 0 8 (3-state buffers) 0

IMPACT-X is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

TIBPAL16R8-10M 的说明

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT-XTM circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

All of the register outputs are set to a low level during power-up. Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence.

The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.

定价

数量 价格
+

包装方式

您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

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可提供批次和生产日期代码选项

您可在购物车中添加器件数量以开始结算流程,并查看现有库存中可选择批次或生产日期代码的选项。

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