48-pin (DGV) package image

SN74VMEH22501ADGVR 正在供货

具有三态输出的 8 位通用总线收发器和两个 1 位总线收发器

正在供货 custom-reels 定制 可提供定制卷带

定价

数量 价格
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质量信息

等级 Catalog
RoHS
REACH
引脚镀层/焊球材料 NIPDAU
MSL 等级/回流焊峰值温度 Level-1-260C-UNLIM
质量、可靠性
和封装信息

包含信息:

  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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更多制造信息

包含信息:

  • 制造厂地点
  • 封装厂地点
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出口管制分类

*仅供参考

  • 美国 ECCN:EAR99

更多 SN74VMEH22501A 信息

封装信息

封装 | 引脚 TVSOP (DGV) | 48
工作温度范围 (°C) -40 to 85
包装数量 | 包装 2,000 | LARGE T&R

SN74VMEH22501A 的特性

  • Member of the Texas Instruments Widebus™ Family
  • UBT™ Transceiver Combines D-Type Latches and D-Type Flip-Flops
    for Operation in Transparent, Latched, or Clocked Modes
  • OEC™ Circuitry Improves Signal Integrity and Reduces
    Electromagnetic Interference (EMI)
  • Compliant With VME64, 2eVME, and 2eSST Protocols
  • Bus Transceiver Split LVTTL Port Provides a Feedback Path for Control
    and Diagnostics Monitoring
  • I/O Interfaces Are 5-V Tolerant
  • B-Port Outputs (–48 mA/64 mA)
  • Y and A-Port Outputs (–12 mA/12 mA)
  • Ioff, Power-Up 3-State, and BIAS VCC Support Live Insertion
  • Bus Hold on 3A-Port Data Inputs
  • 26- Equivalent Series Resistor on 3A Ports and Y Outputs
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

MicroStar is a trademark of Texas Instruments.
(1) VME320 is a patented backplane construction by Arizona Digital, Inc.

SN74VMEH22501A 的说明

The SN74VMEH22501A 8-bit universal bus transceiver has two integral 1-bit three-wire bus transceivers and is designed for 3.3-V VCC operation with 5-V tolerant inputs. The UBT™ transceiver allows transparent, latched, and flip-flop modes of data transfer, and the separate LVTTL input and outputs on the bus transceivers provide a feedback path for control and diagnostics monitoring. This device provides a high-speed interface between cards operating at LVTTL logic levels and VME64, VME64x, or VME320(1) backplane topologies.

The SN74VMEH22501A is pin-for-pin capatible to the SN74VMEH22501 (TI literature number SCES357), but operates at a wider operating temperature (−40°C to 85°C) range.

High-speed backplane operation is a direct result of the improved OEC™ circuitry and high drive that has been designed and tested into the VME64x backplane model. The B-port I/Os are optimized for driving large capacitive loads and include pseudo-ETL input thresholds (½ VCC ± 50 mV) for increased noise immunity. These specifications support the 2eVME protocols in VME64x (ANSI/VITA 1.1) and 2eSST protocols in VITA 1.5. With proper design of a 21-slot VME system, a designer can achieve 320-Mbyte transfer rates on linear backplanes and, possibly, 1-Gbyte transfer rates on the VME320 backplane.

All inputs and outputs are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs.

Active bus-hold circuitry holds unused or undriven 3A-port inputs at a valid logic state. Bus-hold circuitry is not provided on 1A or 2A inputs, any B-port input, or any control input. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioff circuitry prevents damaging current to backflow through the device when it is powered off/on. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, output-enable (OE and OEBY) inputs should be tied to VCC through a pullup resistor and output-enable (OEAB) inputs should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the drive capability of the device connected to this input.

定价

数量 价格
+

包装方式

您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

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可提供批次和生产日期代码选项

您可在购物车中添加器件数量以开始结算流程,并查看现有库存中可选择批次或生产日期代码的选项。

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