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SN74LV86A-EP

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4 通道、2 输入、2V 至 5.5V XOR（异或）门（增强型产品）

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SN74LV86A-EP

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产品详情

Technology family LV-A Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 50 Input type Standard CMOS IOH (max) (mA) -50 Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 70 Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 105
Technology family LV-A Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 50 Input type Standard CMOS IOH (max) (mA) -50 Output type Push-Pull Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Data rate (max) (Mbps) 70 Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 105
TSSOP (PW) 14 32 mm² 5 x 6.4
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 105°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • 2-V to 5.5-V VCC Operation
  • Typical VOLP (Output Ground Bounce)
       <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
       >2.3 V at VCC = 3.3 V, TA = 25°C
  • Support Mixed-Mode Voltage Operation on All Ports

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 105°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • 2-V to 5.5-V VCC Operation
  • Typical VOLP (Output Ground Bounce)
       <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
       >2.3 V at VCC = 3.3 V, TA = 25°C
  • Support Mixed-Mode Voltage Operation on All Ports

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The SN74LV86A is a quadruple 2-input exclusive-OR gate designed for 2-V to 5.5-V VCC operation.

This device contains four independent 2-input exclusive-OR gates. It performs the Boolean function Y = A B or Y = A\B + AB\ in positive logic.

A common application is as a true/complement element. If one of the inputs is low, the other input is reproduced in true form at the output. If one of the inputs is high, the signal on the other input is reproduced inverted at the output.

The SN74LV86A is a quadruple 2-input exclusive-OR gate designed for 2-V to 5.5-V VCC operation.

This device contains four independent 2-input exclusive-OR gates. It performs the Boolean function Y = A B or Y = A\B + AB\ in positive logic.

A common application is as a true/complement element. If one of the inputs is low, the other input is reproduced in true form at the output. If one of the inputs is high, the signal on the other input is reproduced inverted at the output.
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类型 标题 下载最新的英语版本 日期
* 数据表 SN74LV86A-EP 数据表 (Rev. A) 2004年 5月 11日
* VID SN74LV86A-EP VID V6204694 2016年 6月 21日
* 辐射与可靠性报告 SN74LV86ATPWREP Reliability Report 2014年 12月 22日

设计和开发

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封装 引脚 下载
TSSOP (PW) 14 查看选项
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订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

支持和培训

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