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SN74ALVTH162245

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具有三态输出的 2.5V/3.3V 16 位总线收发器

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SN74ALVTH162245 不再投入量产
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SN74ALVCHR162245 正在供货 具有三态输出的 16 位总线收发器 Replacement
SN74LVCR162245 正在供货 具有三态输出的 16 位总线收发器 Replacement

SN74ALVTH162245

已停产
数据表 立即订购

产品详情

Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -8 Input type TTL Output type TTL Features Bias Vcc, Bus-hold, Damping resistors, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Technology family ALVT Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -8 Input type TTL Output type TTL Features Bias Vcc, Bus-hold, Damping resistors, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Technology family ALVT Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Widebus™ Design for 2.5-V and 3.3-V Operation and Low Static-Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce)
       <0.8 V at VCC = 3.3 V, TA = 25°C
  • High Drive
    • A Port = –12/12 mA at 3.3-V VCC
    • B port = –32/64 mA at 3.3-V VCC
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Use Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • A-Port Outputs Have Equivalent 30- Series Resistors, So No External Resistors Are Required
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

Widebus is a trademark of Texas Instruments.
  • State-of-the-Art Advanced BiCMOS Technology (ABT) Widebus™ Design for 2.5-V and 3.3-V Operation and Low Static-Power Dissipation
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
  • Typical VOLP (Output Ground Bounce)
       <0.8 V at VCC = 3.3 V, TA = 25°C
  • High Drive
    • A Port = –12/12 mA at 3.3-V VCC
    • B port = –32/64 mA at 3.3-V VCC
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Use Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
  • A-Port Outputs Have Equivalent 30- Series Resistors, So No External Resistors Are Required
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

Widebus is a trademark of Texas Instruments.

The ’ALVTH162245 devices are 16-bit (dual-octal) noninverting 3-state transceivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

These devices can be used as two 8-bit transceivers or one 16-bit transceiver. They allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE)\ input can be used to disable the device so that the buses are effectively isolated.

The A-port outputs, which are designed to source or sink up to 12 mA, include equivalent 30- series resistors to reduce overshoot and undershoot.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The ’ALVTH162245 devices are 16-bit (dual-octal) noninverting 3-state transceivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

These devices can be used as two 8-bit transceivers or one 16-bit transceiver. They allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE)\ input can be used to disable the device so that the buses are effectively isolated.

The A-port outputs, which are designed to source or sink up to 12 mA, include equivalent 30- series resistors to reduce overshoot and undershoot.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
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类型 标题 下载最新的英语版本 日期
* 数据表 2.5-V/3.3-V 16-Bit Bus Transceivers With 3-State Outputs 数据表 (Rev. A) 2002年 4月 1日

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点