176-pin (PGF) package image

SM320F2812PGFMEP 正在供货

具有 150MHz 频率、256KB 闪存、EMIF 的 C2000™ 32 位 MCU(增强型产品)

等同于: V62/05601-03ZE, SM320F2812PGFMEPG4 该器件型号与上面所列的器件型号相同。您只能订购该器件型号的上述数量。

定价

数量 价格
+

质量信息

等级 HiRel Enhanced Product
RoHS
REACH
引脚镀层/焊球材料 NIPDAU
MSL 等级/回流焊峰值温度 Level-3-260C-168 HR
质量、可靠性
和封装信息

包含信息:

  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
查看或下载
更多制造信息

包含信息:

  • 制造厂地点
  • 封装厂地点
查看

出口管制分类

*仅供参考

  • 美国 ECCN:3A001A2C

更多 SM320F2812-EP 信息

封装信息

封装 | 引脚 LQFP (PGF) | 176
工作温度范围 (°C) -55 to 125
包装数量 | 包装 40 | JEDEC TRAY (10+1)

SM320F2812-EP 的特性

  • Controlled Baseline
    • One Assembly/Test/Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • High-Performance Static CMOS Technology
    • 150 MHz (6.67-ns Cycle Time)
    • Low-Power (1.8-V Core @135 MHz, 1.9-V Core @150 MHz, 3.3-V I/O) Design
  • JTAG Boundary Scan Support(2)
  • High-Performance 32-Bit CPU (320C28x)
    • 16 × 16 and 32 × 32 MAC Operations
    • 16 × 16 Dual MAC
    • Harvard Bus Architecture
    • Atomic Operations
    • Fast Interrupt Response and Processing
    • Unified Memory Programming Model
    • 4M Linear Program/Data Address Reach
    • Code-Efficient (in C/C++ and Assembly)
    • 320F24x/LF240x Processor Source Code Compatible
  • On-Chip Memory
    • Flash Devices: Up to 128K × 16 Flash
      (Four 8K × 16 and Six 16K × 16 Sectors)
    • ROM Devices: Up to 128K × 16 ROM
    • 1K × 16 OTP ROM
    • L0 and L1: 2 Blocks of 4K × 16 Each Single-Access RAM (SARAM)
    • H0: 1 Block of 8K × 16 SARAM
    • M0 and M1: 2 Blocks of 1K × 16 Each SARAM
  • Boot ROM (4K × 16)
    • With Software Boot Modes
    • Standard Math Tables
  • External Interface (2812)
    • Over 1M × 16 Total Memory
    • Programmable Wait States
    • Programmable Read/Write Strobe Timing
    • Three Individual Chip Selects
  • Clock and System Control
    • Dynamic PLL Ratio Changes Supported
    • On-Chip Oscillator
    • Watchdog Timer Module
  • Three External Interrupts
  • Peripheral Interrupt Expansion (PIE) Block
    That Supports 45 Peripheral Interrupts
  • Three 32-Bit CPU-Timers
  • 128-Bit Security Key/Lock
    • Protects Flash/ROM/OTP and L0/L1 SARAM
    • Prevents Firmware Reverse Engineering
  • Motor Control Peripherals
    • Two Event Managers (EVA, EVB)
    • Compatible to 240xA Devices
  • Serial Port Peripherals
    • Serial Peripheral Interface (SPI)
    • Two Serial Communications Interfaces (SCIs), Standard UART
    • Enhanced Controller Area Network (eCAN)
    • Multichannel Buffered Serial Port (McBSP)
  • 12-Bit ADC, 16 Channels
    • 2 × 8 Channel Input Multiplexer
    • Two Sample-and-Hold
    • Single/Simultaneous Conversions
    • Fast Conversion Rate: 80 ns/12.5 MSPS
  • Up to 56 General Purpose I/O (GPIO) Pins
  • Advanced Emulation Features
    • Analysis and Breakpoint Functions
    • Real-Time Debug via Hardware
  • Development Tools Include
    • ANSI C/C++ Compiler/Assembler/Linker
    • Code Composer Studio™ IDE
    • DSP/BIOS™
  • Low-Power Modes and Power Savings
    • IDLE, STANDBY, HALT Modes Supported
    • Disable Individual Peripheral Clocks
  • Package Options
    • 179-Ball MicroStar BGA™ (GHH), (2812)
    • 176-Pin Low-Profile Quad Flatpack (LQFP) (PGF) (2812)

TMS320C24x, Code Composer Studio, DSP/BIOS, and MicroStar BGA are trademarks of Texas Instruments.
(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
(2) IEEE Standard 1149.1-1990, IEEE Standard Test-Access Port

SM320F2812-EP 的说明

The SM320F2810-EP, SM320F2811-EP, SM320F2812-EP, SM320C2810-EP, SM320C2811-EP, and SM320C2812-EP devices, members of the TMS320C28x™ DSP generation, are highly integrated, high-performance solutions for demanding control applications. The functional blocks and the memory maps are described in Section 3, Functional Overview.

Throughout this document, SM320F2810-EP, SM320F2811-EP, and SM320F2812-EP are abbreviated as F2810, F2811, and F2812, respectively. F281x denotes all three Flash devices. SM320C2810-EP, SM320C2811-EP, and SM320C2812-EP are abbreviated as C2810, C2811, and C2812, respectively. C281x denotes all three ROM devices. 2810 denotes both F2810 and C2810 devices; 2811 denotes both F2811 and C2811 devices; and 2812 denotes both F2812 and C2812 devices.

定价

数量 价格
+

包装方式

您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

了解更多信息

可提供批次和生产日期代码选项

您可在购物车中添加器件数量以开始结算流程,并查看现有库存中可选择批次或生产日期代码的选项。

了解更多信息