MSP430FR6007IPZ 具有 256KB FRAM、LCD、12 位高速 8MSPS Σ-Δ ADC 和集成传感器 AFE 的 16MHz MCU | PZ | 100 | -40 to 85 package image

MSP430FR6007IPZ 正在供货

具有 256KB FRAM、LCD、12 位高速 8MSPS Σ-Δ ADC 和集成传感器 AFE 的 16MHz MCU

定价

数量 价格
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其他包装数量 | 包装选项 这些产品完全相同,仅包装类型不同

MSP430FR6007IPZR 正在供货 custom-reels 定制 可提供定制卷带
包装数量 | 包装 1,000 | LARGE T&R
库存
数量 | 价格 1ku | +

质量信息

等级 Catalog
RoHS
REACH
引脚镀层/焊球材料 NIPDAU
MSL 等级/回流焊峰值温度 Level-3-260C-168 HR
质量、可靠性
和封装信息

包含信息:

  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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更多制造信息

包含信息:

  • 制造厂地点
  • 封装厂地点
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出口管制分类

*仅供参考

  • 美国 ECCN:EAR99

更多 MSP430FR6007 信息

封装信息

封装 | 引脚 LQFP (PZ) | 100
工作温度范围 (°C) -40 to 85
包装数量 | 包装 90 | JEDEC TRAY (10+1)

MSP430FR6007 的特性

  • Best-in-class ultrasonic water-flow measurement with ultra-low power consumption
    • <100-ps differential time-of-flight (dTOF) accuracy
    • High-precision time measurement resolution of 20 ps
    • Ability to detect low flow rates (4-6 liters per hour)
    • Approximately 4-µA current consumption with one measurement per second
  • Compliant to and exceeds ISO 4064, OIML R49, and EN 1434 accuracy standards
  • Ability to directly interface standard ultrasonic sensors (up to 2.5 MHz)
  • Integrated analog front end – ultrasonic sensing solution (USS)
    • Programmable pulse generation (PPG) to generate pulses at different frequencies
    • Integrated physical interface (PHY) with low-impedance (4-Ω) output driver to control input and output channels
    • High-performance high-speed 12-bit sigma-delta ADC (SDHS) with output data rates up to 8 Msps
    • Programmable gain amplifier (PGA) with –6.5 dB to 30.8 dB
    • High-performance phase-locked loop (PLL) with output range of 68 MHz to 80 MHz
  • Low-energy accelerator (LEA)
    • Operation independent of CPU
    • 4KB of RAM shared with CPU
    • Efficient 256-point complex FFT: Up to 40× faster than Arm Cortex-M0+ core
  • Embedded microcontroller
    • 16-bit RISC architecture up to 16‑MHz clock
    • Wide supply voltage range from 3.6 V down to 1.8 V (minimum supply voltage is restricted by SVS levels, see the SVS specifications)
  • Optimized ultra-low-power modes
    • Active mode: approximately 120 µA/MHz
    • Standby mode with real-time clock (RTC) (LPM3.5): 450 nA (1)
    • Shutdown (LPM4.5): 30 nA
  • Ferroelectric random access memory (FRAM)
    • Up to 256KB of nonvolatile memory
    • Ultra-low-power writes
    • Fast write at 125 ns per word (64KB in 4 ms)
    • Unified memory = program + data + storage in one space
    • 1015 write cycle endurance
    • Radiation resistant and nonmagnetic
  • Intelligent digital peripherals
    • 32-bit hardware multiplier (MPY)
    • 6-channel internal DMA
    • RTC with calendar and alarm functions
    • Six 16-bit timers with up to seven capture/compare registers each
    • 32-bit and 16-bit cyclic redundancy check (CRC)
  • High-performance analog
    • 16-channel analog comparator
    • 12-bit SAR ADC featuring window comparator, internal reference, and sample-and-hold, up to 16 external input channels
    • Integrated LCD driver with contrast control for up to 264 segments
  • Multifunction input/output ports
    • Accessible bit-, byte-, and word-wise (in pairs)
    • Edge-selectable wake from LPM on all ports
    • Programmable pullup and pulldown on all ports
  • Code security and encryption
    • 128- or 256-bit AES security encryption and decryption coprocessor
    • Random number seed for random number generation algorithms
    • IP encapsulation protects memory from external access
    • FRAM provides inherent security advantages
  • Enhanced serial communication
    • Up to four eUSCI_A serial communication ports
      • UART with automatic baud-rate detection
      • IrDA encode and decode
    • Up to two eUSCI_B serial communication ports
      • I2C with multiple-slave addressing
    • Hardware UART or I2C bootloader (BSL)
  • Flexible clock system
    • Fixed-frequency DCO with 10 selectable factory-trimmed frequencies
    • Low-power low-frequency internal clock source (VLO)
    • 32-kHz crystals (LFXT)
    • High-frequency crystals (HFXT)
  • Development tools and software (also see Tools and Software)
  • Device Comparison summarizes the available device variants and package options

(1)The RTC is clocked by a 3.7-pF crystal.

MSP430FR6007 的说明

The Texas Instruments MSP430FR600x family of ultrasonic sensing and measurement SoCs are powerful, highly integrated microcontrollers (MCUs) that are optimized for water and heat meters. The MSP430FR600x MCUs offer an integrated ultrasonic sensing solution (USS) module, which provides high accuracy for a wide range of flow rates. The USS module helps achieve ultra-low-power metering combined with lower system cost due to maximum integration requiring very few external components. MSP430FR600x MCUs implement a high-speed ADC-based signal acquisition followed by optimized digital signal processing using the integrated low-energy accelerator (LEA) module to deliver a high-accuracy metering solution with ultra-low power optimum for battery-powered metering applications.

The USS module includes a programmable pulse generator (PPG) and a physical interface (PHY) with a low-impedance output driver for optimum sensor excitation to deliver best results for zero-flow drift (ZFD). The module also includes a programmable gain amplifier (PGA) and a high-speed 12-bit 8-Msps sigma-delta ADC (SDHS) for accurate signal acquisition from industry-standard ultrasonic transducers.

Additionally, MSP430FR600x MCUs integrate other peripherals to improve system integration for metering. The MSP430FR600x MCUs also have an on-chip 8-mux LCD driver, an RTC, a 12-bit SAR ADC, an analog comparator, an advanced encryption accelerator (AES256), and a cyclic redundancy check (CRC) module.

MSP430FR600x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get your design started quickly. Development kits include the MSP‑TS430PZ100E 100-pin target development board and EVM430‑FR6047 ultrasonic water flow meter EVM. TI also provides free software including the ultrasonic sensing design center, ultrasonic sensing software library, and MSP430Ware™ software.

TI’s MSP430 ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, letting system designers increase performance while lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and endurance of RAM with the nonvolatility of flash.

For complete module descriptions, see the MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User’s Guide .

定价

数量 价格
+

其他包装数量 | 包装选项 这些产品完全相同,仅包装类型不同

MSP430FR6007IPZR 正在供货 custom-reels 定制 可提供定制卷带
包装数量 | 包装 1,000 | LARGE T&R
库存
数量 | 价格 1ku | +

包装方式

您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

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可提供批次和生产日期代码选项

您可在购物车中添加器件数量以开始结算流程,并查看现有库存中可选择批次或生产日期代码的选项。

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