12-pin (YFQ) package image

LM48861TM/NOPB 正在供货

24mW 立体声模拟输入耳机放大器

正在供货 custom-reels 定制 可提供定制卷带

定价

数量 价格
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质量信息

等级 Catalog
RoHS
REACH
引脚镀层/焊球材料 SNAGCU
MSL 等级/回流焊峰值温度 Level-1-260C-UNLIM
质量、可靠性
和封装信息

包含信息:

  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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更多制造信息

包含信息:

  • 制造厂地点
  • 封装厂地点
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出口管制分类

*仅供参考

  • 美国 ECCN:EAR99

封装信息

封装 | 引脚 DSBGA (YFQ) | 12
工作温度范围 (°C) -40 to 85
包装数量 | 包装 250 | SMALL T&R

LM48861 的特性

  • Ground Referenced Outputs – Eliminates Output Coupling Capacitors
  • Common-Mode Sensing
  • Advanced Click-and-Pop Suppression
  • Low Supply Current
  • Minimum External Components
  • Micro-Power Shutdown
  • ESD Protection of 8kV HBM Contact
  • Available in Space-Saving 12-Bump DSBGA Package

Key Specifications

  • Output Power/Channel at
    VDD = 1.5V,THD+N = 1%
    • RL = 16Ω 12mW (typ)
    • RL = 32Ω 13mW (typ)
  • Output Power/Channel at
    VDD = 1.8V, THD+N = 1%
    • RL = 16Ω 24mW (typ)
    • RL = 32Ω 22mW (typ)
  • Quiescent Power Supply Current at 1.5V
    2mA (typ)
  • PSRR at 217Hz 83dB (typ)
  • Shutdown Current 0.01μA (typ)

PowerWise is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

LM48861 的说明

The LM48861 is a single supply, ground-referenced stereo headphone amplifier. Part of TI's PowerWise product family, the LM48861 consumes only 3mW of power, yet still provides great audio performance. The ground-referenced architecture eliminates the larger DC blocking capacitors required by traditional headphone amplifier's saving board space and reducing cost.

The LM48861 features common-mode sensing that corrects for any differences between the amplifier ground and the potential at the headphone return terminal, minimizing noise created by any ground mismatches.

The LM48861 delivers 22mW/channel into a 32Ω load with <1% THD+N with a 1.8V supply. Power supply requirements allow operation from 1.2V to 2.8V. High power supply rejection ratio (PSRR), 83dB at 217Hz, allows the device to operate in noisy environments without additional power supply conditioning. A low power shutdown mode reduces supply current consumption to 0.01µA.

Superior click and pop suppression eliminates audible transients on power-up/down and during shutdown. The LM48861 is available in an ultra-small 12-bump, 0.4mm pitch, DSBGA package (1.215mm x 1.615mm).

定价

数量 价格
+

包装方式

您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

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可提供批次和生产日期代码选项

您可在购物车中添加器件数量以开始结算流程,并查看现有库存中可选择批次或生产日期代码的选项。

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