48-pin (PHP) package image

DAC5675MPHPREP

正在供货

增强型产品 14 位 400Msps 数模转换器 | PHP | 48 | -55 to 125

正在供货 可提供定制卷带
等同于: V62/05619-01XE 该器件型号与上面所列的器件型号相同。您只能订购上述器件型号的对应数量。
  • 库存:
    限制: 此限制是为了保护样片库存以支持客户设计评估阶段使用,将会在库存充裕时取消此限制。
缺货
Not available

定价

数量 价格
+

其他包装数量 | 包装选项 这些产品完全相同,仅包装类型不同

DAC5675MPHPEP 正在供货
包装数量 | 包装 250 | JEDEC TRAY (10+1)
库存
缺货
Not available
数量 | 价格 1ku | +
限制: 此限制是为了保护样片库存以支持客户设计评估阶段使用,将会在库存充裕时取消此限制。
缺货
Not available

质量信息

等级 HiRel Enhanced Product
RoHS Yes
REACH Yes
引脚镀层/焊球材料 NiPdAu
MSL 等级/回流焊峰值温度 Level-3-260C-168 HR
质量、可靠性
和封装信息

包含信息:

  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
查看或下载
更多制造信息

包含信息:

  • 制造厂地点
  • 封装厂地点
查看

出口管制分类

*仅供参考

  • 美国 ECCN:3A001A2C

封装信息

封装 | 引脚 HTQFP (PHP) | 48
工作温度范围 (°C) -55 to 125
包装数量 | 包装 1,000 | LARGE T&R

DAC5675-EP 的特性

  • 400-MSPS Update Rate
  • Controlled Baseline
    • One Assembly
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • LVDS-Compatible Input Interface
  • Spurious-Free Dynamic Range (SFDR) to Nyquist
    • 69 dBc at 70 MHz IF, 400 MSPS
  • W-CDMA Adjacent Channel Power Ratio (ACPR)
    • 73 dBc at 30.72-MHz IF, 122.88 MSPS
    • 71 dBc at 61.44-MHz IF, 245.76 MSPS
  • Differential Scalable Current Outputs: 2 mA to 20 mA
  • On-Chip 1.2-V Reference
  • Single 3.3-V Supply Operation
  • Power Dissipation: 660 mW at fCLK = 400 MSPS, fOUT = 20 MHz
  • Package: 48-Pin PowerPAD Thermally-Enhanced Thin Quad Flat Pack (HTQFP) TJA = 29.1°C/W
  • APPLICATIONS
    • Cellular Base Transceiver Station Transmit Channel:
      • CDMA: WCDMA, CDMA2000, IS-95
      • TDMA: GSM, IS-136, EDGE/GPRS
      • Supports Single-Carrier and Multicarrier Applications
    • Test and Measurement: Arbitrary Waveform Generation
    • Military Communications

PowerPAD is a trademark of Texas Instruments.

DAC5675-EP 的说明

The DAC5675 is a 14-bit resolution high-speed digital-to-analog converter (DAC). The DAC5675 is designed for high-speed digital data transmission in wired and wireless communication systems, high-frequency direct-digital synthesis (DDS), and waveform reconstruction in test and measurement applications. The DAC5675 has excellent spurious-free dynamic range (SFDR) at high intermediate frequencies, which makes it well-suited for multicarrier transmission in TDMA- and CDMA-based cellular base transceiver stations (BTSs).

The DAC5675 operates from a single-supply voltage of 3.3 V. Power dissipation is 660 mW at fCLK = 400 MSPS, fOUT = 70 MHz. The DAC5675 provides a nominal full-scale differential current output of 20 mA, supporting both single-ended and differential applications. The output current can be directly fed to the load with no additional external output buffer required. The output is referred to the analog supply voltage AVDD.

The DAC5675 comprises a low-voltage differential signaling (LVDS) interface for high-speed digital data input. LVDS features a low differential voltage swing with a low constant power consumption across frequency, allowing for high-speed data transmission with low noise levels; that is, with low electromagnetic interference (EMI). LVDS is typically implemented in low-voltage digital CMOS processes, making it the ideal technology for high-speed interfacing between the DAC5675 and high-speed low-voltage CMOS ASICs or FPGAs. The DAC5675 current-source-array architecture supports update rates of up to 400 MSPS. On-chip edge-triggered input latches provide for minimum setup and hold times, thereby relaxing interface timing.

The DAC5675 has been specifically designed for a differential transformer-coupled output with a 50- doubly-terminated load. With the 20-mA full-scale output current, both a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (-2 dBm) is supported. The last configuration is preferred for optimum performance at high output frequencies and update rates. The outputs are terminated to AVDD and have voltage compliance ranges from AVDD - 1 to AVDD + 0.3 V.

An accurate on-chip 1.2-V temperature-compensated bandgap reference and control amplifier allows the user to adjust this output current from 20 mA down to 2 mA. This provides 20-dB gain range control capabilities. Alternatively, an external reference voltage may be applied. The DAC5675 features a SLEEP mode, which reduces the standby power to approximately 18 mW.

The DAC5675 is available in a 48-pin PowerPAD™ thermally-enhanced thin quad flat pack (HTQFP). This package increases thermal efficiency in a standard size IC package. The device is specified for operation over the military temperature range of -55°C to 125°C.

  • 库存:
    限制: 此限制是为了保护样片库存以支持客户设计评估阶段使用,将会在库存充裕时取消此限制。
缺货
Not available

定价

数量 价格
+

其他包装数量 | 包装选项 这些产品完全相同,仅包装类型不同

DAC5675MPHPEP 正在供货
包装数量 | 包装 250 | JEDEC TRAY (10+1)
库存
缺货
Not available
数量 | 价格 1ku | +
限制: 此限制是为了保护样片库存以支持客户设计评估阶段使用,将会在库存充裕时取消此限制。
缺货
Not available

包装类型

您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

了解更多信息

可提供批次和生产日期代码选项

您可在购物车中添加器件数量以开始结算流程,并查看现有库存中可选择批次或生产日期代码的选项。

了解更多信息