CY74FCT16823T 不再投入量产
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SN74ALVCH16823 正在供货 具有三态输出的 18 位总线接口触发器 Replacement

产品详情

Number of channels 18 Technology family FCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 100 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 500 Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 18 Technology family FCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 100 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 500 Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
TSSOP (DGG) 56 113.4 mm² 14 x 8.1
  • Ioff supports partial-power-down mode operation
  • Edge-rate control circuitry for significantly improved noise characteristics
  • Typical output skew < 250 ps
  • ESD > 2000V
  • TSSOP (19.6-mil pitch) and SSOP (25-mil pitch) packages
  • Industrial temperature range of -40°C to +85°C
  • VCC = 5V ± 10%
  • CY74FCT16823T Features:
    • 64 mA sink current, 32 mA source current
    • Typical VOLP (ground bounce) <1.0V at VCC = 5V, TA = 25°C
  • CY74FCT162823T Features:
    • Balanced 24 mA output drivers
    • Reduced system switching noise
    • Typical VOLP (ground bounce) <0.6V at VCC = 5V, TA = 25°C

  • Ioff supports partial-power-down mode operation
  • Edge-rate control circuitry for significantly improved noise characteristics
  • Typical output skew < 250 ps
  • ESD > 2000V
  • TSSOP (19.6-mil pitch) and SSOP (25-mil pitch) packages
  • Industrial temperature range of -40°C to +85°C
  • VCC = 5V ± 10%
  • CY74FCT16823T Features:
    • 64 mA sink current, 32 mA source current
    • Typical VOLP (ground bounce) <1.0V at VCC = 5V, TA = 25°C
  • CY74FCT162823T Features:
    • Balanced 24 mA output drivers
    • Reduced system switching noise
    • Typical VOLP (ground bounce) <0.6V at VCC = 5V, TA = 25°C

The CY74FCT16823T and the CY74FCT162823T 18-bit bus interface registers are designed for use in high-speed, low-power systems needing wide registers and parity. 18-bit operation is achieved by connecting the control lines of the two 9-bit registers. Flow-through pinout and small shrink packaging aids in simplifying board layout.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The CY74FCT16823T is ideally suited for driving high-capacitance loads and low-impedance backplanes.

The CY74FCT162823T has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The CY74FCT162823T is ideal for driving transmission lines.

The CY74FCT16823T and the CY74FCT162823T 18-bit bus interface registers are designed for use in high-speed, low-power systems needing wide registers and parity. 18-bit operation is achieved by connecting the control lines of the two 9-bit registers. Flow-through pinout and small shrink packaging aids in simplifying board layout.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The CY74FCT16823T is ideally suited for driving high-capacitance loads and low-impedance backplanes.

The CY74FCT162823T has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The CY74FCT162823T is ideal for driving transmission lines.

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类型 标题 下载最新的英语版本 日期
* 数据表 18-Bit Registers 数据表 (Rev. B) 2001年 9月 19日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点