CY74FCT162240T 不再投入量产
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功能与比较器件相同,且具有相同引脚
SN74AHCT16244 正在供货 具有 TTL 兼容型 CMOS 输入和三态输出的 16 通道、4.5V 至 5.5V 缓冲器 Larger voltage range (2V to 5.5V)

产品详情

Technology family FCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 Supply current (max) (µA) 500 IOH (max) (mA) -24 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, High speed (tpd 10-50ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family FCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 Supply current (max) (µA) 500 IOH (max) (mA) -24 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, High speed (tpd 10-50ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1
  • Ioff supports partial-power-down mode operation
  • Edge-rate control circuitry for significantly improved noise characteristics
  • Typical output skew < 250 ps
  • ESD > 2000V
  • TSSOP (19.6-mil pitch) and SSOP (25-mil pitch) packages
  • Industrial temperature range of \x9640°C to +85°C
  • VCC = 5V ± 10%
  • CY74FCT16240T Features:
    • 64 mA sink current, 32 mA source current
    • Typical VOLP (ground bounce) <1.0V at VCC = 5V, TA = 25°C
  • CY74FCT162240T Features:
    • Balanced output drivers: 24 mA
    • Reduced system switching noise
    • Typical VOLP (ground bounce) <0.6V at VCC = 5V, TA = 25°C

  • Ioff supports partial-power-down mode operation
  • Edge-rate control circuitry for significantly improved noise characteristics
  • Typical output skew < 250 ps
  • ESD > 2000V
  • TSSOP (19.6-mil pitch) and SSOP (25-mil pitch) packages
  • Industrial temperature range of \x9640°C to +85°C
  • VCC = 5V ± 10%
  • CY74FCT16240T Features:
    • 64 mA sink current, 32 mA source current
    • Typical VOLP (ground bounce) <1.0V at VCC = 5V, TA = 25°C
  • CY74FCT162240T Features:
    • Balanced output drivers: 24 mA
    • Reduced system switching noise
    • Typical VOLP (ground bounce) <0.6V at VCC = 5V, TA = 25°C

These 16-bit buffer/line drivers are used in memory driver, clock driver, or other bus interface applications, where high speed and low power are required. With flow-through pinout and small shrink packaging, board layout is simplified. The three-state controls are designed to allow 4-, 8-, or 16-bit operation.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The CY74FCT16240T is ideally suited for driving high-capacitance loads and low-impedance backplanes.

The CY74FCT162240T has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The CY74FCT162240T is ideal for driving transmission lines.

These 16-bit buffer/line drivers are used in memory driver, clock driver, or other bus interface applications, where high speed and low power are required. With flow-through pinout and small shrink packaging, board layout is simplified. The three-state controls are designed to allow 4-, 8-, or 16-bit operation.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The CY74FCT16240T is ideally suited for driving high-capacitance loads and low-impedance backplanes.

The CY74FCT162240T has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The CY74FCT162240T is ideal for driving transmission lines.

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类型 标题 下载最新的英语版本 日期
* 数据表 16-Bit Buffers/Line Drivers 数据表 (Rev. B) 2001年 9月 19日

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点