封装信息
| 封装 | 引脚 VQFNP-MR (RVM) | 76 |
| 工作温度范围 (°C) -40 to 85 |
| 包装数量 | 包装 2,500 | LARGE T&R |
CC2560B 的特性
- TI’s Single-Chip Bluetooth Solution With Bluetooth
Basic Rate (BR), Enhanced Data Rate (EDR), and
Low Energy (LE) Support; Available in Two
Variants:- Dual-Mode Bluetooth CC2564 Controller
- Bluetooth CC2560 Controller
- CC2564 Bluetooth 4.1 Controller Subsystem
Qualified (QDID 58852); Compliant up to the HCI
Layer - Highly Optimized for Low-Cost Designs:
- Single-Ended 50-Ω RF Interface
- Package Footprint: 76 Terminals, 0.6-mm Pitch,
8-mm x 8-mm mrQFN
- BR/EDR Features Include:
- Up to 7 Active Devices
- Scatternet: Up to 3 Piconets Simultaneously, 1
as Master and 2 as Slaves - Up to 2 SCO Links on the Same Piconet
- Support for All Voice Air-Coding – Continuously
Variable Slope Delta (CVSD), A-Law, µ-Law,
and Transparent (Uncoded) - CC2560B/CC2564B Devices Provide an
Assisted Mode for HFP 1.6 Wideband Speech
(WBS) Profile or A2DP Profile to Reduce Host
Processing and Power - Support of Multiple Bluetooth Profiles With
Enhanced QoS
- LE Features Include:
- Support of Up to 10 (CC2564B) Connections
- Multiple Sniff Instances Tightly Coupled to
Achieve Minimum Power Consumption - Independent Buffering for LE Allows Large
Numbers of Multiple Connections Without
Affecting BR/EDR Performance. - Built-In Coexistence and Prioritization Handling
for BR/EDR and LE
- Best-in-Class Bluetooth (RF) Performance
(TX Power, RX Sensitivity, Blocking)- Class 1 TX Power Up to +10 dBm
- –95 dbm Typical RX Sensitivity
- Internal Temperature Detection and
Compensation to Ensure Minimal Variation in
RF Performance Over Temperature, No
External Calibration Required - Improved Adaptive Frequency Hopping (AFH)
Algorithm With Minimum Adaptation Time - Provides Longer Range, Including 2x Range
Over Other LE-Only Solutions
- Advanced Power Management for Extended
Battery Life and Ease of Design- On-Chip Power Management, Including Direct
Connection to Battery - Low Power Consumption for Active, Standby,
and Scan Bluetooth Modes - Shutdown and Sleep Modes to Minimize Power
Consumption
- On-Chip Power Management, Including Direct
- Physical Interfaces:
- UART Interface With Support for Maximum
Bluetooth Data Rates- UART Transport Layer (H4) With Maximum
Rate of 4 Mbps - Three-Wire UART Transport Layer (H5) With
Maximum Rate of 4 Mbps (CC2560B and
CC2564B Only)
- UART Transport Layer (H4) With Maximum
- Fully Programmable Digital PCM-I2S Codec
Interface
- UART Interface With Support for Maximum
- Flexibility for Easy Stack Integration and Validation
Into Various Microcontrollers, Such as MSP430™
and ARM® Cortex®-M3 and Cortex®-M4 MCUs - CC256x Bluetooth Hardware Evaluation Tool: PC-
Based Application to Evaluate RF Performance of
the Device and Configure Service Pack - Device Pin-to-Pin Compatible With Previous
Devices or Modules
CC2560B 的说明
The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.
The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:
- Serial port profile (SPP)
- Advanced audio distribution profile (A2DP)
- Audio/video remote control profile (AVRCP)
- Handsfree profile (HFP)
- Human interface device (HID)
- Generic attribute profile (GATT)
- Several Bluetooth LE profiles and services
In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.