BOOST-CC2564MODA 具有集成天线 BoosterPack 插件模块的双模蓝牙 CC2564 模块 top board image

BOOST-CC2564MODA

TMP107 BoosterPack 模块

定价

数量 价格
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BOOST-CC2564MODA 的特性

  • Dual-mode (Bluetooth & Bluetooth low energy) Bluetooth Specification v4.1

  • Integrated antenna on CC2564MODA  for ready to use application

  • FCC, IC, CE certified with a certified and royalty-free TI Bluetooth stack, getting started guide, demos, and UART and PCM/I2S Interface

  • Class 1.5 Transmit Power (+10dBm) and High sensitivity (-93 dBm typ.)

  • BoosterPack connectors compatible with TI LaunchPads and BoosterPacks such as:

    • MSP-EXP432P401R

    • CC3200AUDBOOST

    • CC31XXEMUBOOST

BOOST-CC2564MODA 的说明

The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA).  The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design effort and enables fast time to market. The CC2564MODA modules provides best-in-class RF performance with a transmit power and receive sensitivity that provides range of about 2X compared to other BLE-only solutions.

For a complete evaluation solution, the BOOST-CC2564MODA board plugs directly into TI LaunchPad™ development kits and BoosterPack plug-in modules such as: MSP-EXP432P401R, CC3200AUDBOOST and CC31XXEMUBOOST. Moreover, a certified and royalty-free TI Bluetooth stack (TIBLUETOOTHSTACK-SDK) is available for the MSP430™ and MSP432™ MCUs.

定价

数量 价格
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