ADC081000
- Internal Sample-and-Hold
- Single +1.9V ±0.1V Operation
- Adjustable Output Levels
- Ensured No Missing Codes
- Low Power Standby Mode
The ADC081000 is a low power, high performance CMOS analog-to-digital converter that digitizes signals to 8 bits resolution at sampling rates up to 1.6 GSPS. Consuming a typical 1.4 Watts at 1 GSPS from a single 1.9 Volt supply, this device is ensured to have no missing codes over the full operating temperature range. The unique folding and interpolating architecture, the fully differential comparator design, the innovative design of the internal sample-and-hold amplifier and the self-calibration scheme enable a very flat response of all dynamic parameters beyond Nyquist, producing a high 7.5 ENOB with a 500 MHz input signal and a 1 GHz sample rate while providing a 10-18 B.E.R. Output formatting is offset binary and the LVDS digital outputs are compliant with IEEE 1596.3-1996, with the exception of a reduced common mode voltage of 0.8V.
The converter has a 1:2 demultiplexer that feeds two LVDS buses, reducing the output data rate on each bus to half the sampling rate. The data on these buses are interleaved in time to provide a 500 MHz output rate per bus and a combined output rate of 1 GSPS.
The converter typically consumes less than 10 mW in the Power Down Mode and is available in a 128-lead HLQFP and operates over the industrial (–40°C ≤ TA ≤ +85°C) temperature range.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | ADC081000 High-Performance Low-Power 8-Bit 1-GSPS ADC 数据表 (Rev. G) | 2013年 5月 2日 | |||
EVM 用户指南 | AN-1615 LMH6555 Evaluation Board (Rev. A) | 2013年 4月 26日 | ||||
应用手册 | Generating Precision Clocks for Time- Interleaved ADCs | 2007年 8月 2日 | ||||
白皮书 | Interleaving ADCs for Higher Sample Rates | 2005年 2月 1日 | ||||
白皮书 | Ultra-High Speed ADCs Revolutionize Digital Receiver Design | 2004年 2月 1日 |
设计和开发
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
HLQFP (NNB) | 128 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点