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  • LMK61PD0A2 超低抖动引脚可选振荡器

    • ZHCSEB9A October   2015  – November 2015 LMK61PD0A2

      PRODUCTION DATA.  

  • CONTENTS
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  • LMK61PD0A2 超低抖动引脚可选振荡器
  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Control
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics - Power Supply
    6. 7.6  LVPECL Output Characteristics
    7. 7.7  LVDS Output Characteristics
    8. 7.8  HCSL Output Characteristics
    9. 7.9  OE Input Characteristics
    10. 7.10 OS, FS[1:0] Input Characteristics
    11. 7.11 Frequency Tolerance Characteristics
    12. 7.12 Power-On/Reset Characteristics (VDD)
    13. 7.13 PSRR Characteristics
    14. 7.14 PLL Clock Output Jitter Characteristics
    15. 7.15 Additional Reliability and Qualification
    16. 7.16 Typical Performance Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Device Output Configurations
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Device Block-Level Description
      2. 9.3.2 Device Configuration Control
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Jitter Considerations in Serdes Systems
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Ensuring Thermal Reliability
      2. 12.1.2 Best Practices for Signal Integrity
      3. 12.1.3 Recommended Solder Reflow Profile
  13. 13器件和文档支持
    1. 13.1 社区资源
    2. 13.2 商标
    3. 13.3 静电放电警告
    4. 13.4 Glossary
  14. 14机械、封装和可订购信息
  15. 重要声明
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DATA SHEET

LMK61PD0A2 超低抖动引脚可选振荡器

本资源的原文使用英文撰写。 为方便起见,TI 提供了译文;由于翻译过程中可能使用了自动化工具,TI 不保证译文的准确性。 为确认准确性,请务必访问 ti.com 参考最新的英文版本(控制文档)。

1 特性

  • 超低噪声、高性能
    • 抖动:fOUT > 100MHz 时的典型值为 90fs (RMS)
    • 高电源抑制比 (PSRR):-70dBc,出色的电源抗扰度
  • 灵活的输出频率和格式;用户可选择
    • 频率:62.5MHz、100MHz、106.25MHz、125MHz、156.25MHz、212.5MHz、312.5MHz
    • 格式:低电压正射极耦合逻辑 (LVPECL)、低压差分信令 (LVDS) 或高速收发器逻辑 (HSTL)
  • 总频率容差:±50ppm
  • 内部存储器存储了多个启动配置,可通过引脚控制进行选择
  • 3.3V 工作电压
  • 工业温度范围(-40ºC 至 +85ºC)
  • 7mm x 5mm 8 引脚封装

2 应用

  • 晶体振荡器、表面声波 (SAW) 振荡器或芯片振荡器的高性能替换产品
  • 开关、路由器、网卡、基带装置 (BBU)、服务器、存储/SAN
  • 测试和测量
  • 医疗成像
  • 现场可编程门阵列 (FPGA),处理器连接

3 说明

LMK61PD0A2 是一款超低抖动的 PLLatinumTM 引脚可选振荡器。该振荡器可生成通用基准时钟。 该器件在出厂前进行了预编程,可支持七种不同基准时钟频率。相应频率可通过将每个 FS[1:0] 配置为 VDD、GND 或 NC(无连接)进行选择。 输出格式可通过将操作系统 (OS) 的引脚配置为 VDD、GND 或 NC 进行选择,三种配置方式分别对应格式 LVPECL、LVDS 以及 HCSL。 内部电源调节功能提供出色的电源纹波抑制 (PSRR),降低了供电网络的成本和复杂性。 该器件由单个 3.3V ± 5% 电源供电。

器件信息(1)

部件号 封装 封装尺寸(标称值)
LMK61PD0A2 8 引脚 QFM (SIA) 7.0mm x 5.0mm
  1. 要了解所有可用封装,请见数据表末尾的可订购产品附录。

引脚分布和简化框图

LMK61PD0A2 pinout_functional_block_diagram_snas675.gif

4 修订历史记录

Changes from * Revision (October 2015) to A Revision

  • “产品预览”至“量产数据”Go

5 Device Control

Table 1. Output Frequency Mapping for FS[1:0] Selection

FS1 FS0 OUT FREQUENCY (MHz) RELEVANT STANDARDS
0 0 100 PCI Express
0 NC 312.5 10 Gbps Ethernet
0 1 125 1 Gbps Ethernet
NC 0 106.25 Fiber Channel
NC NC 156.25 10 Gbps Ethernet
NC 1 212.5 Fiber Channel
1 0 62.5 1 Gbps Ethernet
1 NC Reserved n/a
1 1 Reserved n/a

Table 2. Output Type Mapping for OS, OE Selection

OS OE OUTPUT TYPE
X 0 Disabled (PLL functional)
0 1 LVPECL
NC 1 LVDS
1 1 HCSL

6 Pin Configuration and Functions

SIA Package
8 pin QFM
LMK61PD0A2 pinout_snas675.gif

Table 3. Pin Functions

PIN I/O DESCRIPTION
NAME NO.
POWER
GND 3 Ground Device Ground.
VDD 6 Analog 3.3 V Power Supply.
OUTPUT BLOCK
OUTP, OUTN 4, 5 Universal Differential Output Pair (LVPECL, LVDS or HCSL).
DIGITAL CONTROL / INTERFACES
FS[1:0] 7, 8 LVCMOS Output Frequency Select. Refer toTable 1.
OE 1 LVCMOS Output Enable (internal pullup). Refer toTable 2.
OS 3 LVCMOS Output Type Select. Refer toTable 2.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD Device Supply Voltage -0.3 3.6 V
VIN Output Voltage Range for Logic Inputs -0.3 VDD + 0.3 V
VOUT Output Voltage Range for Clock Outputs -0.3 VDD + 0.3 V
TJ Junction Temperature 150 °C
TSTG Storage Temperature -40 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD Device Supply Voltage 3.135 3.3 3.465 V
TA Ambient Temperature -40 25 85 °C
TJ Junction Temperature 125 °C
tRAMP VDD Power-Up Ramp Time 0.1 100 ms

7.4 Thermal Information

THERMAL METRIC(1) LMK61PD0A2 (2) (3) (4) UNIT
QFM (SIA)
8 PINS
Airflow (LFM) 0 Airflow (LFM) 200 Airflow (LFM) 400
RθJA Junction-to-ambient thermal resistance 54 44 41.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 34 n/a n/a
RθJB Junction-to-board thermal resistance 36.7 n/a n/a
ψJT Junction-to-top characterization parameter 11.2 16.9 21.9
ψJB Junction-to-board characterization parameter 36.7 37.8 38.9
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) The package thermal resistance is calculated on a 4 layer JEDEC board.
(3) Connected to GND with 3 thermal vias (0.3-mm diameter).
(4) ψJB (junction to board) is used when the main heat flow is from the junction to the GND pad. Please refer to Thermal Considerations section for more information on ensuring good system reliability and quality.

7.5 Electrical Characteristics - Power Supply(1)

VDD = 3.3 V ± 5%, TA = -40C to 85°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IDD Device Current Consumption LVPECL(2) 162 208 mA
LVDS 152 196
HCSL 155 196
IDD-PD Device Current Consumption when output is disabled OE = GND 136
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) On-chip power dissipation should exclude 40 mW, dissipated in the 150 ohm termination resistors, from total power dissipation.

7.6 LVPECL Output Characteristics(1)

VDD = 3.3 V ± 5%, TA = -40C to 85°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fOUT Output Frequency(2) 62.5 312.5 MHz
VOD Output Voltage Swing
(VOH - VOL)(2)
700 800 1200 mV
VOUT, DIFF, PP Differential Output Peak-to-Peak Swing 2 x |VOD| V
VOS Output Common Mode Voltage VDD – 1.55 V
tR / tF Output Rise/Fall Time (20% to 80%)(3) 120 200 ps
PN-Floor Output Phase Noise Floor (fOFFSET > 10 MHz) 156.25 MHz -165 dBc/Hz
ODC Output Duty Cycle(3) 45% 55%
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) An output frequency over fOUT max spec is possible, but output swing may be less than VOD min spec.
(3) Ensured by characterization.

7.7 LVDS Output Characteristics(1)

VDD = 3.3 V ± 5%, TA = -40°C to 85°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fOUT Output Frequency(1) 62.5 312.5 MHz
VOD Output Voltage Swing
(VOH - VOL)(1)
300 390 480 mV
VOUT, DIFF, PP Differential Output Peak-to-Peak Swing 2 x |VOD| V
VOS Output Common Mode Voltage 1.2 V
tR / tF Output Rise/Fall Time (20% to 80%)(2) 150 250 ps
PN-Floor Output Phase Noise Floor (fOFFSET > 10 MHz) 156.25 MHz -162 dBc/Hz
ODC Output Duty Cycle(2) 45% 55%
ROUT Differential Output Impedance 125 Ohm
(1) An output frequency over fOUT max spec is possible, but output swing may be less than VOD min spec.
(2) Ensured by characterization.

7.8 HCSL Output Characteristics(1)

VDD = 3.3 V ± 5%, TA = -40°C to 85°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fOUT Output Frequency 62.5 312.5 MHz
VOH Output High Voltage 600 850 mV
VOL Output Low Voltage -100 100 mV
VCROSS Absolute Crossing Voltage(2)(3) 250 475 mV
VCROSS-DELTA Variation of VCROSS(2)(3) 0 140 mV
dV/dt Slew Rate(4) 0.8 2 V/ns
PN-Floor Output Phase Noise Floor (fOFFSET > 10 MHz) 100 MHz -164 dBc/Hz
ODC Output Duty Cycle(4) 45% 55%
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) Measured from -150 mV to +150 mV on the differential waveform with the 300 mVpp measurement window centered on the differential zero crossing.
(3) Ensured by design.
(4) Ensured by characterization.

7.9 OE Input Characteristics

VDD = 3.3 V ± 5%, TA = -40°C to 85°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH Input High Voltage 1.4 V
VIL Input Low Voltage 0.6 V
IIH Input High Current VIH = VDD -40 40 uA
IIL Input Low Current VIL = GND -40 40 uA
CIN Input Capacitance 2 pF

7.10 OS, FS[1:0] Input Characteristics

VDD = 3.3 V ± 5%, TA = -40°C to 85°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH Input High Voltage 1.4 V
VIL Input Low Voltage 0.4 V
IIH Input High Current VIH = VDD -40 40 uA
IIL Input Low Current VIL = GND -40 40 uA
CIN Input Capacitance 2 pF

7.11 Frequency Tolerance Characteristics(1)

VDD = 3.3 V ± 5%, TA = -40°C to 85°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fT Total Frequency Tolerance All output formats, frequency bands and device junction temperature up to 125°C; includes initial freq tolerance, temperature & supply voltage variation, solder reflow and aging (10 years) -50 50 ppm
(1) Ensured by characterization.

7.12 Power-On/Reset Characteristics (VDD)

VDD = 3.3 V ± 5%, TA = -40°C to 85°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VTHRESH Threshold Voltage(1) 2.72 2.95 V
VDROOP Allowable Voltage Droop(2) 0.1 V
tSTARTUP Startup Time (1) Time elapsed from VDD at 3.135 V to output enabled 10 ms
tOE-EN Output enable time(2) Time elapsed from OE at VIH to output enabled 50 us
tOE-DIS Output disable time(2) Time elapsed from OE at VIL to output disabled 50 us
(1) Ensured by characterization.
(2) Ensured by design.

7.13 PSRR Characteristics(1)

VDD = 3.3 V, TA = 25°C, FS[1:0] = NC, NC
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PSRR Spurs Induced by 50 mV Power Supply Ripple(2)(3) at 156.25 MHz output, all output types Sine wave at 50 kHz -70 dBc
Sine wave at 100 kHz -70
Sine wave at 500 kHz -70
Sine wave at 1 MHz -70
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) Measured max spur level with 50 mVpp sinusoidal signal between 50 kHz and 1 MHz applied on VDD pin
(3) DJSPUR (ps, pk-pk) = [2*10(SPUR/20) / (π*fOUT)]*1e6, where PSRR or SPUR in dBc and fOUT in MHz.

7.14 PLL Clock Output Jitter Characteristics(1)(3)

VDD = 3.3 V ± 5%, TA = -40°C to 85°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RJ RMS Phase Jitter(2)
(12 kHz – 20 MHz)
(1 kHz – 5 MHz)
fOUT ≥ 100 MHz, All output frequencies and output types 100 200 fs RMS
RJ RMS Phase Jitter(2)
(12 kHz – 20 MHz)
(1 kHz – 5 MHz)
fOUT = 62.5 MHz, All output frequencies and output types 200 400 fs RMS
(1) Refer to Parameter Measurement Information for relevant test conditions.
(2) Ensured by characterization.
(3) Phase jitter measured with Agilent E5052 signal source analyzer using a differential-to-single ended converter (balun or buffer).

7.15 Additional Reliability and Qualification

PARAMETER CONDITION / TEST METHOD
Mechanical Shock MIL-STD-202, Method 213
Mechanical Vibration MIL-STD-202, Method 204
Moisture Sensitivity Level J-STD-020, MSL3

7.16 Typical Performance Characteristics

LMK61PD0A2 D001_SNAS674.png Figure 1. Phase Noise of LVPECL Differential Output at 156.25 MHz with FS[1:0] = NC, NC, OS = GND
LMK61PD0A2 D003_SNAS674.png Figure 3. Phase Noise of HCSL Differential Output at 156.25 MHz with FS[1:0] = NC, NC, OS = VDD
LMK61PD0A2 D017_SNAS675.gif Figure 5. LVDS Differential Output Swing vs Frequency
LMK61PD0A2 D002_SNAS674.png Figure 2. Phase Noise of LVDS Differential Output at 156.25 MHz with FS[1:0] = NC, NC, OS = NC
LMK61PD0A2 D016_SNAS675.gif Figure 4. LVPECL Differential Output Swing vs Frequency
LMK61PD0A2 D018_SNAS675.gif Figure 6. HCSL Differential Output Swing vs Frequency

8 Parameter Measurement Information

8.1 Device Output Configurations

LMK61PD0A2 lvpecl_output_dc_configuration_snas675.gif Figure 7. LVPECL Output DC Configuration during Device Test
LMK61PD0A2 lvds_output_dc_configuration_snas675.gif Figure 8. LVDS Output DC Configuration during Device Test
LMK61PD0A2 hcsl_output_dc_configuration_snas675.gif Figure 9. HCSL Output DC Configuration during Device Test
LMK61PD0A2 lvpecl_output_ac_configuration_snas675.gif Figure 10. LVPECL Output AC Configuration during Device Test
LMK61PD0A2 lvds_output_ac_configuration_snas675.gif Figure 11. LVDS Output AC Configuration during Device Test
LMK61PD0A2 hcsl_output_ac_configuration_snas675.gif Figure 12. HCSL Output AC Configuration during Device Test
LMK61PD0A2 psrr_test_setup_snas675.gif Figure 13. PSRR Test Setup
LMK61PD0A2 differential_output_voltage_rise_fall_time_snas674.gif Figure 14. Differential Output Voltage and Rise/Fall Time

9 Detailed Description

9.1 Overview

The LMK61PD0A2 is a pin selectable oscillator that generates commonly used reference clocks, greater than 100 MHz, with less than 200 fs, rms max random jitter.

9.2 Functional Block Diagram

LMK61PD0A2 functional_block_diagram_snas675.gif

NOTE

Control blocks are compatible with 1.8/2.5/3.3 V I/O voltage levels.

9.3 Feature Description

9.3.1 Device Block-Level Description

The LMK61PD0A2 comprises of an integrated oscillator that includes a 50 MHz crystal, a fractional PLL with integrated VCO. Completing the device is the combination of an integer output divider and a universal differential output buffer. The on-chip ROM contains seven pre-programmed output frequency plans that selects the appropriate settings for the integrated oscillator, PLL blocks and output divider. Table 1 lists the supported output frequency plans that can be selected by pin-strapping FS[1:0] as required. Table 2 lists the supported output types that can be selected by pin-strapping OS and OE as required. The device is powered by on-chip low dropout (LDO) linear voltage regulators and the regulated supply network is partitioned such that the sensitive analog supplies are running from separate LDOs than the digital supplies which use their own LDO. The LDOs provide isolation from any noise in the external power supply rail with a PSRR of better than -70 dBc at 50 kHz to 1 MHz ripple frequencies at 3.3 V device supply.

9.3.2 Device Configuration Control

The LMK61PD0A2 selects an output frequency plan and output type using control pins FS[1:0].

10 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

10.1 Application Information

The LMK61PD0A2 is an ultra-low jitter pin selectable oscillator that can be used to provide reference clocks for high-speed serial links resulting in improved system performance.

10.2 Typical Application

10.2.1 Jitter Considerations in Serdes Systems

Jitter-sensitive applications such as 10 Gbps or 100 Gbps Ethernet, deploy a serial link utilizing a Serializer in the transmit section (TX) and a De-serializer in the receive section (RX). These SERDES blocks are typically embedded in an ASIC or FPGA. Estimating the clock jitter impact on the link budget requires understanding of the TX PLL bandwidth and the RX CDR bandwidth.

As can be seen in Figure 15, the pass band region between the TX low pass cutoff and RX high pass cutoff frequencies is the range over which the reference clock jitter adds without any attenuation to the jitter budget of the link. Outside of these frequencies, the SERDES link will attenuate the reference clock jitter with a 20 dB/dec or even steeper roll-off. Modern ASIC or FPGA designs have some flexibility on deciding the optimal RX CDR bandwidth and TX PLL bandwidth. These bandwidths are typically set based on what is achievable in the ASIC or FPGA process node, without increasing design complexity, and on any jitter tolerance or wander specification that needs to be met, as related to the RX CDR bandwidth.

The overall allowable jitter in a serial link is dictated by IEEE or other relevant standards. For example, IEEE802.3ba states that the maximum transmit jitter (peak-peak) for 10 Gbps Ethernet should be no more than 0.28 * UI and this equates to a 27.1516 ps, p-p for the overall allowable transmit jitter.

The jitter contributing elements are made up of the reference clock, generated potentially from a device like LMK61PD0A2, the transmit medium, transmit driver etc. Only a portion of the overall allowable transmit jitter is allocated to the reference clock, typically 20% or lower. Therefore, the allowable reference clock jitter, for a 20% clock jitter budget, is 5.43 ps, p-p.

Jitter in a reference clock is made up of deterministic jitter (arising from spurious signals due to supply noise or mixing from other outputs or from the reference input) and random jitter (usually due to thermal noise and other uncorrelated noise sources). A typical clock tree in a serial link system consists of clock generators and fanout buffers. The allowable reference clock jitter of 5.43 ps, p-p is needed at the output of the fanout buffer. Modern fanout buffers have low additive random jitter (less than 100 fs, rms) with no substantial contribution to the deterministic jitter. Therefore, the clock generator and fanout buffer contribute to the random jitter while the primary contributor to the deterministic jitter is the clock generator. Rule of thumb, for modern clock generators, is to allocate 25% of allowable reference clock jitter to the deterministic jitter and 75% to the random jitter. This amounts to an allowable deterministic jitter of 1.36 ps, p-p and an allowable random jitter of 4.07 ps, p-p. For serial link systems that need to meet a bit error rate (BER) of 10-12, the allowable random jitter in root-mean-square is 0.29 ps, rms. This is calculated by dividing the p-p jitter by 14 for a BER of 10-12. Accounting for random jitter from the fanout buffer, the random jitter needed from the clock generator is 0.27 ps, rms. This is calculated by the root-mean-square subtraction from the desired jitter at the fanout buffer's output assuming 100 fs, rms of additive jitter from the fanout buffer.

With careful frequency planning techniques, like spur optimization (covered in the Spur Mitigation Techniques section) and on-chip LDOs to suppress supply noise, the LMK61PD0A2 is able to generate clock outputs with deterministic jitter that is below 1 ps, p-p and random jitter that is below 0.2 ps, rms. This gives the serial link system with additional margin on the allowable transmit jitter resulting in a BER better than 10-12.

LMK61PD0A2 dependence_of_clock_jitter_serial_links_snas674.gif Figure 15. Dependence of Clock Jitter in Serial Links

11 Power Supply Recommendations

For best electrical performance of LMK61PD0A2, it is preferred to utilize a combination of 10 uF, 1 uF and 0.1 uF on its power supply bypass network. It is also recommended to utilize component side mounting of the power supply bypass capacitors and it is best to use 0201 or 0402 body size capacitors to facilitate signal routing. Keep the connections between the bypass capacitors and the power supply on the device as short as possible. Ground the other side of the capacitor using a low impedance connection to the ground plane. Figure 16 shows the layout recommendation for power supply decoupling of LMK61PD0A2.

 

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