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  • 具有集成 DDC 的 ADC12J4000 12 位 4GSPS ADC

    • ZHCSCX1D January   2014  – October 2017 ADC12J4000

      PRODUCTION DATA.  

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  • 具有集成 DDC 的 ADC12J4000 12 位 4GSPS ADC
  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      旁路 — 频谱响应 ƒS = 4GHz，FIN = 1897MHz
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Internal Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Signal Acquisition
      2. 7.3.2 The Analog Inputs
        1. 7.3.2.1 Input Clamp
        2. 7.3.2.2 AC Coupled Input Usage
        3. 7.3.2.3 DC Coupled Input Usage
        4. 7.3.2.4 Handling Single-Ended Input Signals
      3. 7.3.3 Clocking
      4. 7.3.4 Over-Range Function
      5. 7.3.5 ADC Core Features
        1. 7.3.5.1 The Reference Voltage
        2. 7.3.5.2 Common-Mode Voltage Generation
        3. 7.3.5.3 Bias Current Generation
        4. 7.3.5.4 Full Scale Range Adjust
        5. 7.3.5.5 Offset Adjust
        6. 7.3.5.6 Power-Down
        7. 7.3.5.7 Built-In Temperature Monitor Diode
      6. 7.3.6 Digital Down Converter (DDC)
        1. 7.3.6.1 NCO/Mixer
        2. 7.3.6.2 NCO Settings
          1. 7.3.6.2.1 NCO Frequency Phase Selection
          2. 7.3.6.2.2 NCO_0, NCO_1, and NCO_2 (NCO_x)
          3. 7.3.6.2.3 NCO_SEL Bits (2:0)
          4. 7.3.6.2.4 NCO Frequency Setting (Eight Total)
            1. 7.3.6.2.4.1 Basic NCO Frequency-Setting Mode
            2. 7.3.6.2.4.2 Rational NCO Frequency Setting Mode
          5. 7.3.6.2.5 NCO Phase-Offset Setting (Eight Total)
          6. 7.3.6.2.6 Programmable DDC Delay
        3. 7.3.6.3 Decimation Filters
        4. 7.3.6.4 DDC Output Data
        5. 7.3.6.5 Decimation Settings
          1. 7.3.6.5.1 Decimation Factor
          2. 7.3.6.5.2 DDC Gain Boost
      7. 7.3.7 Data Outputs
        1. 7.3.7.1 The Digital Outputs
        2. 7.3.7.2 JESD204B Interface Features and Settings
          1. 7.3.7.2.1  Scrambler Enable
          2. 7.3.7.2.2  Frames Per Multi-Frame (K-1)
          3. 7.3.7.2.3  DDR
          4. 7.3.7.2.4  JESD Enable
          5. 7.3.7.2.5  JESD Test Modes
          6. 7.3.7.2.6  Configurable Pre-Emphasis
          7. 7.3.7.2.7  Serial Output-Data Formatting
          8. 7.3.7.2.8  JESD204B Synchronization Features
          9. 7.3.7.2.9  SYSREF
          10. 7.3.7.2.10 SYNC~
          11. 7.3.7.2.11 Time Stamp
          12. 7.3.7.2.12 Code-Group Synchronization
          13. 7.3.7.2.13 Multiple ADC Synchronization
    4. 7.4 Device Functional Modes
      1. 7.4.1 DDC Bypass Mode
      2. 7.4.2 DDC Modes
      3. 7.4.3 Calibration
        1. 7.4.3.1 Foreground Calibration Mode
        2. 7.4.3.2 Background Calibration Mode
      4. 7.4.4 Timing Calibration Mode
      5. 7.4.5 Test-Pattern Modes
        1. 7.4.5.1 ADC Test-Pattern Mode
        2. 7.4.5.2 Serializer Test-Mode Details
        3. 7.4.5.3 PRBS Test Modes
        4. 7.4.5.4 Ramp Test Mode
        5. 7.4.5.5 Short and Long-Transport Test Mode
        6. 7.4.5.6 D21.5 Test Mode
        7. 7.4.5.7 K28.5 Test Mode
        8. 7.4.5.8 Repeated ILA Test Mode
        9. 7.4.5.9 Modified RPAT Test Mode
    5. 7.5 Programming
      1. 7.5.1 Using the Serial Interface
        1. 7.5.1.1 Streaming Mode
    6. 7.6 Register Map
      1. 7.6.1 Memory Map
      2. 7.6.2 Register Descriptions
        1. 7.6.2.1 Standard SPI-3.0 (0x000 to 0x00F)
          1. Table 40. Standard SPI-3.0 Registers
          2. 7.6.2.1.1  Configuration A Register (address = 0x000) [reset = 0x3C]
            1. Table 41. CFGA Field Descriptions
          3. 7.6.2.1.2  Configuration B Register (address = 0x001) [reset = 0x00]
            1. Table 42. CFGB Field Descriptions
          4. 7.6.2.1.3  Device Configuration Register (address = 0x002) [reset = 0x00]
            1. Table 43. DEVCFG Field Descriptions
          5. 7.6.2.1.4  Chip Type Register (address = 0x003) [reset = 0x03]
            1. Table 44. CHIP_TYPE Field Descriptions
          6. 7.6.2.1.5  Chip Version Register (address = 0x006) [reset = 0x13]
            1. Table 45. CHIP_VERSION Field Descriptions
          7. 7.6.2.1.6  Vendor Identification Register (address = 0x00C to 0x00D) [reset = 0x0451]
            1. Table 46. VENDOR_ID Field Descriptions
        2. 7.6.2.2 User SPI Configuration (0x010 to 0x01F)
          1. 7.6.2.2.1 User SPI Configuration Register (address = 0x010) [reset = 0x00]
            1. Table 48. USR0 Field Descriptions
        3. 7.6.2.3 General Analog, Bias, Band Gap, and Track and Hold (0x020 to 0x02F)
          1. 7.6.2.3.1 Power-On Reset Register (address = 0x021) [reset = 0x00]
            1. Table 50. POR Field Descriptions
          2. 7.6.2.3.2 I/O Gain 0 Register (address = 0x022) [reset = 0x40]
            1. Table 51. IO_GAIN_0 Field Descriptions
          3. 7.6.2.3.3 IO_GAIN_1 Register (address = 0x023) [reset = 0x00]
            1. Table 52. IO_GAIN_1 Field Descriptions
          4. 7.6.2.3.4 I/O Offset 0 Register (address = 0x025) [reset = 0x40]
            1. Table 53. IO_OFFSET_0 Field Descriptions
          5. 7.6.2.3.5 I/O Offset 1 Register (address = 0x026) [reset = 0x00]
            1. Table 54. IO_OFFSET_1 Field Descriptions
        4. 7.6.2.4 Clock (0x030 to 0x03F)
          1. 7.6.2.4.1 Clock Generator Control 0 Register (address = 0x030) [reset = 0xC0]
            1. Table 56. CLKGEN_0 Field Descriptions
          2. 7.6.2.4.2 Clock Generator Status Register (address = 0x031) [reset = 0x07]
            1. Table 57. CLKGEN_1 Field Descriptions
          3. 7.6.2.4.3 Clock Generator Control 2 Register (address = 0x032) [reset = 0x80]
            1. Table 58. CLKGEN_2 Field Descriptions
          4. 7.6.2.4.4 Analog Miscellaneous Register (address = 0x033) [reset = 0xC3]
            1. Table 59. ANA_MISC Field Descriptions
          5. 7.6.2.4.5 Input Clamp Enable Register (address = 0x034) [reset = 0x2F]
            1. Table 60. IN_CL_EN Field Descriptions
        5. 7.6.2.5 Serializer (0x040 to 0x04F)
          1. 7.6.2.5.1 Serializer Configuration Register (address = 0x040) [reset = 0x04]
            1. Table 62. SER_CFG Field Descriptions
        6. 7.6.2.6 ADC Calibration (0x050 to 0x1FF)
          1. 7.6.2.6.1 Calibration Configuration 0 Register (address = 0x050) [reset = 0x06]
            1. Table 64. CAL_CFG0 Field Descriptions
          2. 7.6.2.6.2 Calibration Configuration 1 Register (address = 0x051) [reset = 0xF4]
            1. Table 65. CAL_CFG1 Field Descriptions
          3. 7.6.2.6.3 Calibration Background Control Register (address = 0x057) [reset = 0x10]
            1. Table 66. CAL_BACK Field Descriptions
          4. 7.6.2.6.4 ADC Pattern and Over-Range Enable Register (address = 0x058) [reset = 0x00]
            1. Table 67. ADC_PAT_OVR_EN Field Descriptions
          5. 7.6.2.6.5 Calibration Vectors Register (address = 0x05A) [reset = 0x00]
            1. Table 68. CAL_VECTOR Field Descriptions
          6. 7.6.2.6.6 Calibration Status Register (address = 0x05B) [reset = undefined]
            1. Table 69. CAL_STAT Field Descriptions
          7. 7.6.2.6.7 Timing Calibration Register (address = 0x066) [reset = 0x02]
            1. Table 70. CAL_STAT Field Descriptions
        7. 7.6.2.7 Digital Down Converter and JESD204B (0x200-0x27F)
          1. 7.6.2.7.1  Digital Down-Converter (DDC) Control Register (address = 0x200) [reset = 0x10]
            1. Table 72. DDC_CTRL1 Field Descriptions
          2. 7.6.2.7.2  JESD204B Control 1 Register (address = 0x201) [reset = 0x0F]
            1. Table 73. JESD_CTRL1 Field Descriptions
          3. 7.6.2.7.3  JESD204B Control 2 Register (address = 0x202) [reset = 0x00]
            1. Table 74. JESD_CTRL2 Field Descriptions
          4. 7.6.2.7.4  JESD204B Device ID (DID) Register (address = 0x203) [reset = 0x00]
            1. Table 75. JESD_DID Field Descriptions
          5. 7.6.2.7.5  JESD204B Control 3 Register (address = 0x204) [reset = 0x00]
            1. Table 76. JESD_CTRL3 Field Descriptions
          6. 7.6.2.7.6  JESD204B and System Status Register (address = 0x205) [reset = Undefined]
            1. Table 77. JESD_STATUS Field Descriptions
          7. 7.6.2.7.7  Overrange Threshold 0 Register (address = 0x206) [reset = 0xF2]
            1. Table 78. OVR_T0 Field Descriptions
          8. 7.6.2.7.8  Overrange Threshold 1 Register (address = 0x207) [reset = 0xAB]
            1. Table 79. OVR_T1 Field Descriptions
          9. 7.6.2.7.9  Overrange Period Register (address = 0x208) [reset = 0x00]
            1. Table 80. OVR_N Field Descriptions
          10. 7.6.2.7.10 DDC Configuration Preset Mode Register (address = 0x20C) [reset = 0x00]
            1. Table 81. NCO_MODE Field Descriptions
          11. 7.6.2.7.11 DDC Configuration Preset Select Register (address = 0x20D) [reset = 0x00]
            1. Table 82. NCO_SEL Field Descriptions
          12. 7.6.2.7.12 Rational NCO Reference Divisor Register (address = 0x20E to 0x20F) [reset = 0x0000]
            1. Table 83. NCO_RDIV Field Descriptions
          13. 7.6.2.7.13 NCO Frequency (Preset x) Register (address = see ) [reset = see ]
            1. Table 84. NCO_FREQ_x Field Descriptions
          14. 7.6.2.7.14 NCO Phase (Preset x) Register (address = see ) [reset = see ]
            1. Table 85. NCO_PHASE_x Field Descriptions
          15. 7.6.2.7.15 DDC Delay (Preset x) Register (address = see ) [reset = see ]
            1. Table 86. DDC_DLY_x Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 RF Sampling Receiver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Oscilloscope
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
    3. 8.3 Initialization Set-Up
      1. 8.3.1 JESD204B Startup Sequence
    4. 8.4 Dos and Don'ts
      1. 8.4.1 Common Application Pitfalls
  9. 9 Power Supply Recommendations
    1. 9.1 Supply Voltage
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Management
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 开发支持
      3. 11.1.3 器件命名规则
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息
  13. 重要声明
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DATA SHEET

具有集成 DDC 的 ADC12J4000 12 位 4GSPS ADC

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

  • 出色的噪声和线性性能，最高可达 FIN = 3GHz 以上
  • 可配置数字下变频器 (DDC)
  • 抽取因数范围为 4 至 32（复杂基带输出）
  • 在 4x 抽取率和 4000MSPS 条件下，
    可用输出带宽为 800MHz
  • 在 32x 抽取率和 4000MSPS 条件下，
    可用输出带宽为 100MHz
  • 旁路模式适用于整个奈奎斯特输出带宽
  • 低引脚数目 JESD204B 子类 1 接口
  • 自动优化输出通道计数
  • 嵌入式低延迟信号范围指示
  • 低功耗
  • 主要规格：
    • 最大采样率：4000MSPS
    • 最小采样率：1000MSPS
    • DDC 输出字大小：15 位复数（共 30 位）
    • 旁路输出字大小：12 位偏移二进制数
    • 噪底：−149dBFS/Hz 或 −150.8dBm/Hz
    • 三阶互调失真 (IMD3)：−64dBc（−13dBFS 时，FIN = 2140MHz ± 30MHz）
    • 全功率带宽 (FPBW) (–3dB)：3.2GHz））
    • 峰值噪声功率比 (NPR)：46dB
    • 电源电压：1.9V 和 1.2V
    • 功耗
      • 旁路 (4000MSPS)：2W
      • 10 倍抽取率 (4000MSPS)：2W
      • 断电模式：< 50mW

2 应用

  • 无线基础设施
  • RF 采样软件定义无线电
  • 宽带微波回程
  • 军用通信
  • 通信情报
  • 雷达和激光雷达
  • 电缆数据服务接口规范 (DOCSIS)/电缆基础设施
  • 测试和测量

3 说明

ADC12J4000 器件为宽带采样和数字调谐器件。德州仪器 (TI) 的千兆次采样模数转换器 (ADC) 技术支持采用射频直接对大范围频谱采样。集成 DDC（数字下变频器）可进行数字滤波和下变频转换。所选频率块适用于 JESD204B 串行接口。数据以基带 15 位复数信息形式输出，以减轻下游处理压力。根据数字下变频器 (DDC) 抽取率和链接输出率设置，该数据将通过串行接口的 1 至 5 通道输出。

DDC 旁路模式还支持输出全速率 12 位原始 ADC 数据。此运行模式需要 8 个串行输出通道。

ADC12J4000器件采用68 引脚超薄四方扁平无引线 (VQFN) 封装。该器件的工业环境运行温度范围为 –40°C ≤ TA ≤ 85°C。

器件信息(1)

器件型号封装封装尺寸（标称值）
ADC12J4000 VQFN (68) 10.00mm x 10.00mm
  1. 如需了解所有可用封装，请见数据表末尾的可订购产品附录。

Device Images

旁路 — 频谱响应
ƒS = 4GHz，FIN = 1897MHz

ADC12J4000 C003_SLAS989.png

4 修订历史记录

Changes from C Revision (July 2015) to D Revision

  • Changed reset value of address 0x006 from 0x03 to 0x13 in Memory Map tableGo
  • Changed reset value of address 0x006 from 0x03 to 0x13 in Standard SPI-3.0 Registers tableGo
  • Changed 0x03 to 0x13 in reset value and description of bits 7-0 and changed 0000 0011 to 0001 0011 in Chip Version Register sectionGo

Changes from B Revision (September 2014) to C Revision

  • Added additional voltage difference parameters to the Absolute Maximum Ratings tableGo
  • Added junction temperature to the Absolute Maximum Ratings tableGo
  • Added common mode voltage parameter to the Recommended Operating Conditions table. Changed CLK to SYSREF, and ~SYNC Go
  • Changed the ƒS / 4 + FIN spur MAX limit from –58.7 dBFS to –60 dBFS to align with the SFDR max limit of 60 dBFS Go
  • Deleted the Differential Analog Input Connection image in The Analog Inputs section Go
  • Added note about offset adjust in Background Calibration Mode to the Offset Adjust section and I/O offset register tablesGo
  • Added the Calibration Cycle Timing for Different Calibration Modes and Options table in the Timing Calibration Mode section Go
  • Changed 0x004-0x005 to RESERVED in the Standard SPI-3.0 Registers summary tableGo

Changes from A Revision (February 2014) to B Revision

  • Changed 器件状态，从产品预览改为量产数据Go

5 Pin Configuration and Functions

NKE Package
68-Pin VQFN With Thermal Pad
Top View
ADC12J4000 po_nke_68_snoi222.gif
DNC = Make no external connection

Pin Functions

PINEQUIVALENT CIRCUITTYPEDESCRIPTION
NAMENO.
ANALOG
RBIAS+ 1 ADC12J4000 New_RBIAS.gif I/O External Bias Resistor Connections
External bias resistor terminals. A 3.3 kΩ (±0.1%) resistor should be connected between RBIAS+ and RBIAS–. The RBIAS resistor is used as a reference for internal circuits which affect the linearity of the converter. The value and precision of this resistor should not be compromised. These pins must be isolated from all other signals and grounds.
RBIAS– 2
TDIODE– 63 ADC12J4000 30180116.gif Passive Temperature Diode
These pins are the positive (anode) and negative (cathode) diode connections for die temperature measurements. Leave these pins unconnected if they are not used. See the Built-In Temperature Monitor Diode section for more details.
TDIODE+ 64
VBG 68 ADC12J4000 30180109.gif O Bandgap Output Voltage
This pin is capable of sourcing or sinking 100 μA and can drive a load up to 80 pF. Leave this pin unconnected if it is not used in the application. See the The Reference Voltage section for more details.
VCMO 3 O Common Mode Voltage
The voltage output at this pin must be the common-mode input voltage at the VIN+ and VIN– pins when DC coupling is used. This pin is capable of sourcing or sinking 100 μA and can drive a load up to 80 pF. Leave this pin unconnected if it is not used in the application.
VIN+ 8 ADC12J4000 30180107.gif I Signal Input
The differential full-scale input range is determined by the full-scale voltage adjust register. An internal peaking inductor (LPEAK) of 5 nH is included for parasitic compensation.
VIN– 9
DATA
DS0– 32 ADC12J4000 30175610.gif
 O Data
CML These pins are the high-speed serialized-data outputs with user-configurable pre-emphasis. These outputs must always be terminated with a 100-Ω differential resistor at the receiver.
DS0+ 33
DS1– 35
DS1+ 36
DS2– 38
DS2+ 39
DS3– 41
DS3+ 42
DS4– 44
DS4+ 45
DS5–/NCO_0 47 ADC12J4000 CML_driver_with_input.gif
 O/I Data

DS5–/NCO_0, DS5+/NCO_0, DS6–/NCO_1, DS6+/NCO_1, DS7–/NCO_2 and DS7+/NCO_2: When decimation is enabled, these pins become LVCMOS inputs and allow the host device to select the specific NCO frequency or phase accumulator that is active. In this mode the positive (+) and negative (–) pins should be connected together and both driven. An acceptable alternative is to let one of the pair float while the other pin is driven. Connect these inputs to GND if they are not used in the application.

DS5+/NCO_0 48
DS6−/NCO_1 50
DS6+/NCO_1 51
DS7−/NCO_2 53
DS7+/NCO_2 54
GROUND, RESERVED, DNC
DNC 67 — Do Not Connect
Do not connect DNC to any circuitry, power, or ground signals.
RSV 66 ADC12J4000 30180126.gif — Reserved
Connect to Ground or Leave Unconnected: This reserved pin is a logic input for possible future device versions. It is recommended to connect this pin to ground. Floating this pin is also permissible.
RSV2 61 — Reserved
Connect to Ground Connect this reserved input pin to ground for proper operation.
Thermal Pad — Ground (GND)
The exposed pad on the bottom of the package is the ground return for all supplies. This pad must be connected with multiple vias to the printed circuit board (PCB) ground planes to ensure proper electrical and thermal performance.
The exposed center pad on the bottom of the package must be thermally and electrically connected (soldered) to a ground plane to ensure rated performance.
LVCMOS
OR_T0 25 ADC12J4000 30180108.gif O Over-Range
Over-range detection status for T0 and T1 thresholds. Leave these pins unconnected if they are not used in the application.
OR_T1 26
SCLK 58 ADC12J4000 30180126.gif I Serial Interface Clock
This pin functions as the serial-interface clock input which clocks the serial data in and out. The Using the Serial Interface section describes the serial interface in more detail.
SDI 57 I Serial Data In
This pin functions as the serial-interface data input. The Using the Serial Interface section describes the serial interface in more detail.
SYNC~ 30 I SYNC~
This pin provides the JESD204B-required synchronizing request input. A logic-low applied to this input initiates a lane alignment sequence. The choice of LVCMOS or differential SYNC~ is selected through bit 6 of the configuration register 0x202h. Connect this input to GND or VA19 if differential SYNC~ input is used.
SCS 59 I Serial Chip Select (active low)
This pin functions as the serial-interface chip select. The Using the Serial Interface section describes the serial interface in more detail.
SDO 56 ADC12J4000 30180108.gif O Serial Data Out
This pin functions as the serial-interface data output. The Using the Serial Interface section describes the serial interface in more detail.
DIFFERENTIAL INPUT
DEVCLK+ 15 ADC12J4000 30180112.gif I Device Clock Input
The differential device clock signal must be AC coupled to these pins. The input signal is sampled on the rising edge of CLK.
DEVCLK– 16
SYSREF+ 19 I SYSREF
The differential periodic waveform on these pins synchronizes the device per JESD204B. If JESD204B subclass 1 synchronization is not required and these inputs are not utilized they may be left unconnected. In that case ensure SysRef_Rcvr_En=0 and SysRef_Pr_En=0.
SYSREF– 20
SYNC~+/TMST+ 22 I SYNC~/TMST
This differential input provides the JESD204B-required synchronizing request input. A differential logic-low applied to these inputs initiates a lane alignment sequence. For differential SYNC~ usage, ensure that SYNC_DIFF_PD = 0 and SYNC_DIFFSEL = 1.
When the LVCMOS SYNC~ is selected these inputs can be used as the differential TIMESTAMP input. For TMST usage, ensure that SYNC_DIFF_PD = 0, SYNC_DIFFSEL = 0, and TIME_STAMP_EN = 1. For additional information see the Time Stamp section.
These inputs may be left unconnected if they are not used for either the SYNC~ or TIMESTAMP functions.
SYNC~-/TMST– 23
POWER
VA12 6 — Analog 1.2 V power supply pins
Bypass these pins to ground using one 10-µF capacitor and two 1-µF capacitors for bulk decoupling plus one 0.1-µF capacitor per pin for individual decoupling.
11
14
17
18
21
65
VA19 4 — Analog 1.9 V power supply pins
Bypass these pins to ground using one 10-µF capacitor and two 1-µF capacitors for bulk decoupling plus one 0.1-µF capacitor per pin for individual decoupling.
7
10
13
24
27
60
62
VD12 28 — Digital 1.2 V power supply pins
Bypass these pins to ground using one 10-µF capacitor and two 1-µF capacitors for bulk decoupling plus one 0.1-µF capacitor per pin for individual decoupling.
31
34
37
40
43
46
49
52
55
VNEG 5 I VNEG
These pins must be decoupled to ground with a 0.1-µF ceramic capacitor near each pin. These power input pins must be connected to the VNEG_OUT pin with a low resistance path. The connections must be isolated from any noisy digital signals and must also be isolated from the analog input and clock input pins.
12
VNEG_OUT 29 O VNEG_OUT
The voltage on this output can range from –1V to +1V. This pin must be decoupled to ground with a 4.7-µF, low ESL, low ESR multi-layer ceramic chip capacitor and connected to the VNEG input pins. This voltage must be isolated from any noisy digital signals, clocks, and the analog input.

6 Specifications

6.1 Absolute Maximum Ratings

The soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.(5)(1)(3)
MINMAXUNIT
Supply voltage 1.2-V supply VA12, VD12 1.4 V
1.9-V supply VA19 2.2
1.2-V supply difference between VA12 and VD12 –200 200 mV
Voltage On any input pin (except VIN+ or VIN–) –0.15 V(VA19) + 0.15 V
On VIN+ or VIN– 0 2
Voltage difference |(VIN+) – (VIN–)|(2) 2 V
|(DEVCLK+) – (DEVCLK–)| 2
|(SYSREF+) – (SYSREF–)| 2
|(~SYNC+) – (~SYNC–)| 1
RF input power, PI On VIN+, VIN–, with proper input common mode maintained. FIN ≥ 3 GHz, Z(SOURCE) = 100 Ω, Input_Clamp_EN = 0 or 1 11.07 dBm
On VIN+, VIN–, with proper input common mode maintained. FIN = 1 GHz, Z(SOURCE) = 100 Ω, Input_Clamp_EN = 1 14.95
On VIN+, VIN–, with proper input common mode maintained. FIN ≤ 100 MHz, Z(SOURCE) = 100 Ω, Input_Clamp_EN = 1 20.97
Input current At any pin other than VIN+ or VIN–(4) –25 25 mA
VIN+ or VIN– –50 50 mA DC
Package(4) (sum of absolute value of all currents forced in or out, not including power supply current) 100 mA
Junction temperature, TJ Power applied. Verified by High Temperature Operation Life testing to 1000 hours. –40 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The analog inputs are protected as in the following circuit. Input-voltage magnitudes beyond the Absolute Maximum Ratings may damage this device.
ADC12J4000 30180104.gif
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(4) When the input voltage at any pin (other than VIN+ or VIN–) exceeds the power supply limits (that is, less than GND or greater than VA19), the current at that pin must be limited to 25 mA. The 100-mA maximum package input current rating limits the number of pins that can safely exceed the power supplies. This limit is not placed upon the power pins or thermal pad (GND).
(5) Reflow temperature profiles are different for lead-free and non-lead-free packages.

 
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