• Menu
  • Product
  • Email
  • PDF
  • Order now
  • Tiva™ C Series TM4C123x Microcontrollers MicroStar Junior™ BGA Discontinued and Redesigned

    • SPMZ864 march   2023 TM4C123BH6ZRB , TM4C123GH6ZRB

       

  • CONTENTS
  • SEARCH
  • Tiva™ C Series TM4C123x Microcontrollers MicroStar Junior™ BGA Discontinued and Redesigned
  1.   Abstract
  2.   Trademarks
  3. 1Package Redesign Details
  4. IMPORTANT NOTICE
search No matches found.
  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
  • Card for each section
  • Card with all content

 

ERRATA

Tiva™ C Series TM4C123x Microcontrollers MicroStar Junior™ BGA Discontinued and Redesigned

Abstract

This document should be used in conjuction with the device data sheet and describes the updated package designator for the indicated devices.

Trademarks

MicroStar Junior™ and MicroStar BGA™ are trademarks of Texas Instruments.

All trademarks are the property of their respective owners.

1 Package Redesign Details

Explanation

The devices in the MicroStar Junior™ BGA packaging were redesigned using a laminate nfBGA package. This nfBGA package offers data sheet-equivalent electrical performance. It is also footprint equivalent to the MicroStar Junior BGA. For more details, please refer to this nfBGA Packaging Application Report.

When referencing the device data sheet, use the new package designator in place of the discontinued package designator throughout the document.

The orderable addendum at the end of the device data sheet will reflect the new package designator.

See the following page or the end of the device data sheet for the updated nfBGA package drawing.

Table 1-1 Package Designator
Old Package DesignatorNew Package Designator
ZRBNMR

Reason for Discontinuance

Due to an equipment End-Of-Life notice from our substrate supplier, we are phasing out certain MicroStar BGA™ and MicroStar Junior BGA packaging devices and offering a Last Time Buy.

These devices have now been converted to an nfBGA package.

Devices Affected

The following table describes the devices affected, the old and new package designators, and references to the device data sheet.

Table 1-2 Devices and Nomenclature
Device Discontinued MicroStar Junior BGA Device(1)Redesigned Laminate nfBGA Device(1)Device Data Sheet
TM4C123BH6xTM4C123BH6ZRBITM4C123BH6NMRISPMS370
TM4C123BH6ZRBI7TM4C123BH6NMRI7
TM4C123BH6ZRBI7RTM4C123BH6NMRI7R
TM4C123BH6ZRBIRTM4C123BH6NMRIR
TM4C123GH6xTM4C123GH6ZRBITM4C123GH6NMRISPMS378
TM4C123GH6ZRBI7TM4C123GH6NMRI7
TM4C123GH6ZRBI7RTM4C123GH6NMRI7R
TM4C123GH6ZRBIRTM4C123GH6NMRIR
TM4C123GH6ZRBTTM4C123GH6NMRT
TM4C123GH6ZRBT7TM4C123GH6NMRT7
TM4C123GH6ZRBT7RTM4C123GH6NMRT7R
(1) Discontinued and redesigned devices are pin-for-pin compatible.

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 

Copyright © 2023, Texas Instruments Incorporated

 

Texas Instruments

© Copyright 1995-2025 Texas Instruments Incorporated. All rights reserved.
Submit documentation feedback | IMPORTANT NOTICE | Trademarks | Privacy policy | Cookie policy | Terms of use | Terms of sale