SPMZ864 march   2023

 

  1.   Abstract
  2.   Trademarks
  3. 1Package Redesign Details

1 Package Redesign Details

Explanation

The devices in the MicroStar Junior™ BGA packaging were redesigned using a laminate nfBGA package. This nfBGA package offers data sheet-equivalent electrical performance. It is also footprint equivalent to the MicroStar Junior BGA. For more details, please refer to this nfBGA Packaging Application Report.

When referencing the device data sheet, use the new package designator in place of the discontinued package designator throughout the document.

The orderable addendum at the end of the device data sheet will reflect the new package designator.

See the following page or the end of the device data sheet for the updated nfBGA package drawing.

Table 1-1 Package Designator
Old Package DesignatorNew Package Designator
ZRBNMR

Reason for Discontinuance

Due to an equipment End-Of-Life notice from our substrate supplier, we are phasing out certain MicroStar BGA™ and MicroStar Junior BGA packaging devices and offering a Last Time Buy.

These devices have now been converted to an nfBGA package.

Devices Affected

The following table describes the devices affected, the old and new package designators, and references to the device data sheet.

Table 1-2 Devices and Nomenclature
Device Discontinued MicroStar Junior BGA Device(1)Redesigned Laminate nfBGA Device(1)Device Data Sheet
TM4C123BH6xTM4C123BH6ZRBITM4C123BH6NMRISPMS370
TM4C123BH6ZRBI7TM4C123BH6NMRI7
TM4C123BH6ZRBI7RTM4C123BH6NMRI7R
TM4C123BH6ZRBIRTM4C123BH6NMRIR
TM4C123GH6xTM4C123GH6ZRBITM4C123GH6NMRISPMS378
TM4C123GH6ZRBI7TM4C123GH6NMRI7
TM4C123GH6ZRBI7RTM4C123GH6NMRI7R
TM4C123GH6ZRBIRTM4C123GH6NMRIR
TM4C123GH6ZRBTTM4C123GH6NMRT
TM4C123GH6ZRBT7TM4C123GH6NMRT7
TM4C123GH6ZRBT7RTM4C123GH6NMRT7R
(1) Discontinued and redesigned devices are pin-for-pin compatible.