ZHCSWY9E January   2001  – November 2024 CD54AC05 , CD74AC05

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 说明
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics, VCC = 1.5 V
    7. 4.7 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    8. 4.8 Switching Characteristics, VCC = 5 V ± 0.5 V
    9. 4.9 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

3 Pin Configuration and Functions

CD54AC05 CD74AC05 CD54AC05 J Package, 14-Pin CDIP; CD74AC05 D, N, or PW Packages; 14-Pin SOIC, PDIP , or TSSOP (Top View)Figure 3-1 CD54AC05 J Package, 14-Pin CDIP; CD74AC05 D, N, or PW Packages; 14-Pin SOIC, PDIP , or TSSOP (Top View)
CD54AC05 CD74AC05 CD74AC05 BQA Package, 14-Pin WQFNFigure 3-2 CD74AC05 BQA Package, 14-Pin WQFN
Table 3-1 Pin Functions
PIN I/O(1) DESCRIPTION
NAME CD74AC05 CD54AC05
BQA, D, N, PW J
1A 1 1 I 1A Input
1Y 2 2 O 1Y Output
2A 3 3 I 2A Input
2Y 4 4 O 2Y Output
3A 5 5 I 3A Input
3Y 6 6 O 3Y Output
GND 7 7 — Ground Pin
4Y 8 8 O 4Y Output
4A 9 9 I 4A Input
5Y 10 10 I 5Y Output
5A 11 11 I 5A Input
6Y 12 12 O 6Y Output
6A 13 13 I 6A Input
VCC 14 14 — Power Pin
NC — — — No Connection
Thermal pad — Connect the GND pin to the exposed thermal pad for correct operation. Connect the thermal pad to any internal PCB ground plane using multiple vias for good thermal performance.
(1) I = input, O = output, P = power, FB = feedback, GND = ground, N/A = not applicable