ZHCSWV4C November   2004  – February 2025 SN74AC08-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 说明
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Switching Characteristics, VCC = 3.3V ± 0.3V
    6. 4.6 Switching Characteristics, VCC = 5V ± 0.5V
    7. 4.7 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Pin Configuration and Functions

SN74AC08-Q1 D or PW Package, 14-Pin
                        SOIC or TSSOP (Top View)Figure 3-1 D or PW Package, 14-Pin SOIC or TSSOP (Top View)
SN74AC08-Q1 BQA Package, 14-Pin WQFN
                        (Top View)Figure 3-2 BQA Package, 14-Pin WQFN (Top View)
Table 3-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1A 1 Input Channel 1, Input A
1B 2 Input Channel 1, Input B
1Y 3 Output Channel 1, Output Y
2A 4 Input Channel 2, Input A
2B 5 Input Channel 2, Input B
2Y 6 Output Channel 2, Output Y
GND 7 — Ground
3Y 8 Output Channel 3, Output Y
3A 9 Input Channel 3, Input A
3B 10 Input Channel 3, Input B
4Y 11 Output Channel 4, Output Y
4A 12 Input Channel 4, Input A
4B 13 Input Channel 4, Input B
VCC 14 — Positive Supply
Thermal pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
BQA package only.