ZHCSWV4C November   2004  – February 2025 SN74AC08-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 说明
  4. Pin Configuration and Functions
  5. Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Switching Characteristics, VCC = 3.3V ± 0.3V
    6. 4.6 Switching Characteristics, VCC = 5V ± 0.5V
    7. 4.7 Operating Characteristics
  6. Parameter Measurement Information
  7. Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Pin Configuration and Functions

SN74AC08-Q1 D or PW Package, 14-Pin
                        SOIC or TSSOP (Top View)Figure 3-1 D or PW Package, 14-Pin SOIC or TSSOP (Top View)
SN74AC08-Q1 BQA Package, 14-Pin WQFN
                        (Top View)Figure 3-2 BQA Package, 14-Pin WQFN (Top View)
Table 3-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1A 1 Input Channel 1, Input A
1B 2 Input Channel 1, Input B
1Y 3 Output Channel 1, Output Y
2A 4 Input Channel 2, Input A
2B 5 Input Channel 2, Input B
2Y 6 Output Channel 2, Output Y
GND 7 Ground
3Y 8 Output Channel 3, Output Y
3A 9 Input Channel 3, Input A
3B 10 Input Channel 3, Input B
4Y 11 Output Channel 4, Output Y
4A 12 Input Channel 4, Input A
4B 13 Input Channel 4, Input B
VCC 14 Positive Supply
Thermal pad(2) The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
BQA package only.