ZHCSWV4C November 2004 – February 2025 SN74AC08-Q1
PRODUCTION DATA
Figure 3-1 D or PW Package, 14-Pin
SOIC or TSSOP (Top View)| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| 1A | 1 | Input | Channel 1, Input A |
| 1B | 2 | Input | Channel 1, Input B |
| 1Y | 3 | Output | Channel 1, Output Y |
| 2A | 4 | Input | Channel 2, Input A |
| 2B | 5 | Input | Channel 2, Input B |
| 2Y | 6 | Output | Channel 2, Output Y |
| GND | 7 | — | Ground |
| 3Y | 8 | Output | Channel 3, Output Y |
| 3A | 9 | Input | Channel 3, Input A |
| 3B | 10 | Input | Channel 3, Input B |
| 4Y | 11 | Output | Channel 4, Output Y |
| 4A | 12 | Input | Channel 4, Input A |
| 4B | 13 | Input | Channel 4, Input B |
| VCC | 14 | — | Positive Supply |
| Thermal pad(2) | — | The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply. | |