ZHCSWI8K May   1999  – September 2024 SN74LV4051A

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information: SN74LV4051A
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Characteristics VCC = 2.5 V ± 0.2 V
    7. 5.7  Timing Characteristics VCC = 3.3 V ± 0.3 V
    8. 5.8  Timing Characteristics VCC = 5 V ± 0.5 V
    9. 5.9  AC Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.3 Thermal Information: SN74LV4051A

THERMAL METRIC(1) SN74LV4051A SN74LV4051A SN74LV4051A SN74LV4051A UNIT
D (SOIC) PW (TSSOP) RGY (VQFN) DYY (SOT)
16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance  115.2 140.2 89.4 199.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75.0 72.6 89.7 121.2 °C/W
RθJB Junction-to-board thermal resistance 76.6 98.7 65.4 129 °C/W
ΨJT Junction-to-top characterization parameter 31.3 13.4 25.0 24.6 °C/W
ΨJB Junction-to-board characterization parameter 75.7 97.3 65.2 126.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 48.9 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.