ZHCSW40B February   2003  – July 2024 CD74AC238

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 说明
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics, VCC = 1.5 V
    7. 4.7 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    8. 4.8 Switching Characteristics, VCC = 5 V ± 0.5 V
    9. 4.9 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application Information
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

3 Pin Configuration and Functions

CD74AC238 CD74AC238 D or PW Package; 16-Pin SOIC or TSSOP (Top View)Figure 3-1 CD74AC238 D or PW Package; 16-Pin SOIC or TSSOP (Top View)
CD74AC238 CD74AC238 BQB Package, 16-Pin WQFN (Top View)Figure 3-2 CD74AC238 BQB Package, 16-Pin WQFN (Top View)
Table 3-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
A 1 I Input A
B 2 I Input B
C 3 I Input C
G2A 4 I Strobe Input 2A, active low
G2B 5 I Strobe Input 2B, active low
G1 6 I Strobe Input
Y7 7 O Output 7
GND 8 G Ground
Y6 9 O Output 6
Y5 10 O Output 5
Y4 11 O Output 4
Y3 12 O Output 3
Y2 13 O Output 2
Y1 14 O Output 1
Y0 15 O Output 0
VCC 16 P Positive Supply
Thermal Pad(2) — Thermal Pad
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
(2) BQB package only