ZHCSU12M
March 2000 – June 2025
LP2982
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagrams
6.3
Feature Description
6.3.1
Output Enable
6.3.2
Dropout Voltage
6.3.3
Current Limit
6.3.4
Undervoltage Lockout (UVLO)
6.3.5
Output Pulldown
6.3.6
Thermal Shutdown
6.4
Device Functional Modes
6.4.1
Device Functional Mode Comparison
6.4.2
Normal Operation
6.4.3
Dropout Operation
6.4.4
Disabled
7
Application and Implementation
7.1
Application Information
7.1.1
Recommended Capacitor Types
7.1.1.1
Recommended Capacitors (Legacy Chip)
7.1.1.2
Recommended Capacitors (New Chip)
7.1.2
Input Capacitor Requirements
7.1.3
Output Capacitor Requirements
7.1.4
Noise Bypass Capacitor (CBYPASS)
7.1.5
Reverse Current
7.1.6
Power Dissipation (PD)
7.1.7
Estimating Junction Temperature
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.2.1
ON/ OFF Input Operation
7.2.3
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
器件和文档支持
8.1
器件命名规则
8.2
第三方产品免责声明
8.3
文档支持
8.3.1
相关文档
8.4
接收文档更新通知
8.5
支持资源
8.6
商标
8.7
静电放电警告
8.8
术语表
9
Revision History
10
Mechanical, Packaging, and Orderable Information
8.3.1
相关文档
更多信息,请参见以下文档:
德州仪器 (TI),
半导体和 IC 封装热指标
应用手册
德州仪器 (TI),
使用新的热指标
应用手册
德州仪器 (TI),
采用 JEDEC PCB 设计的线性和逻辑封装的热特性
应用手册