ZHCSU10P March   2000  – February 2025 LP2981-N

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
        1. 6.3.3.1 Current Limit (Legacy Chip)
        2. 6.3.3.2 Current Limit (New Chip)
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Thermal Shutdown
      6. 6.3.6 Output Pulldown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors (Legacy Chip)
          1. 7.1.1.1.1 Tantalum Capacitors
          2. 7.1.1.1.2 Ceramic Capacitors
          3. 7.1.1.1.3 Aluminum Capacitors
        2. 7.1.1.2 Recommended Capacitors (New Chip)
      2. 7.1.2 Input and Output Capacitor Requirements
        1. 7.1.2.1 Input Capacitor
        2. 7.1.2.2 Output Capacitor
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON and OFF Input Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 第三方产品免责声明
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Related Documentation
    5. 8.5 支持资源
    6. 8.6 Trademarks
    7. 8.7 静电放电警告
    8. 8.8 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VIN Supply input voltage (for legacy chip) 2.1 16 V
Supply input voltage (for new chip) 2.5 16
VIN – VOUT Input-output differential (for legacy chip) 0.7 11
Input-output differential (for new chip) 0 16
VOUT Output voltage (for new chip) 1.2 5
VON/OFF Enable voltage (for legacy chip) 0 VIN
Enable voltage (for new chip) 0 16
IOUT Output current 0 100 mA
CIN(1) Input capacitor 1 µF
COUT Output capacitor (for legacy chip)  2.2 4.7
Output capacitance (for new chip) (1) 1 2.2 200
COUT ESR (2) Output capacitor ESR (for new chip) (3) 0 1 Ω
TJ Operating junction temperature –40 125 °C
(2) Maximum supported ESR range for new chip is 1Ω. For output capacitor with higher ESR values, place a low ESR MLCC capacitor.
(3) Details related to supported ESR range for the legacy chip are available in the Recommended Capacitors for the Legacy Chip section.