ZHCST97F October   2004  – October 2024 SN74AHC1G08-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 5.7 Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 5.8 Operating Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Feature Description
      1. 7.2.1 CMOS Schmitt-Trigger Inputs
    3. 7.3 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Typical Application
    2. 8.2 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
        1. 8.3.1.1 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Thermal Information

THERMAL METRIC(1) SN74AHC1G08-Q1 UNIT
DBV (SOT-23) DCK (SOT-SC70) DTX (X2SON)
5 PINS 5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 278 289.2 184.7 °C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).